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71. 发明专利

JP2012227317A Deposition method, program, computer storage medium and deposition apparatus 有权
标题翻译：沉积方法，程序，计算机存储介质和沉积装置
公开(公告)号：JP2012227317A
公开(公告)日：2012-11-15
申请号：JP2011092762
申请日：2011-04-19
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： HIROSHIRO KOKICHI , TERADA SHOICHI , NISHI TAKANORI , KITANO TAKAHIRO
IPC分类号： H01L21/027 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： PROBLEM TO BE SOLVED: To enhance throughput of substrate processing by depositing a silane coupling agent appropriately on a substrate.SOLUTION: A surface of a template T is subjected to UV irradiation and cleaned (Fig. 11(a)). A mold release agent S is then applied onto the template T (Fig. 11(b)). Subsequently, alcohol A is applied onto the mold release agent S of the template T (Fig. 11(c)). Thereafter, supersonic vibration is imparted to the mold release agent S on the template T (Fig. 11(d)). Chemical reaction of the surface of the template T and the mold release agent S is accelerated by this supersonic vibration, and adhesion of the surface of the template T and the mold release agent S is enhanced. Finally, the mold release agent S on the template T is rinsed, and a mold release film Sis deposited on the template T along a transfer pattern (Fig. 11(e)).
摘要翻译：要解决的问题：通过在基板上适当地沉积硅烷偶联剂来提高基板加工的生产量。解决方案：对模板T的表面进行紫外线照射和清洁（图11（a））。然后将脱模剂S施加到模板T上（图11（b））。随后，将乙醇A施加到模板T的脱模剂S上（图11（c））。此后，对模板T上的脱模剂S施加超音速振动（图11（d））。通过这种超音速振动来加速模板T和脱模剂S的表面的化学反应，并且提高了模板T和脱模剂S的表面的粘合性。最后，将模板T上的脱模剂S漂洗，沿着转印图案将模塑T上的脱模膜S F 沉积在模板T上（图11（e））。版权所有（C）2013，JPO＆INPIT

72. 发明专利

JP2012191215A Substrate cleaning apparatus, substrate cleaning method, and storage medium 有权
标题翻译：基板清洁装置，基板清洁方法和存储介质
公开(公告)号：JP2012191215A
公开(公告)日：2012-10-04
申请号：JP2012094888
申请日：2012-04-18
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TAKIGUCHI YASUSHI , YAMAMOTO TARO , FUJIMOTO AKIHIRO , NISHIKIDO SHUICHI , KUMAGAI MASARU , YOSHITAKA NAOTO , KITANO TAKAHIRO , TOKUNAGA YOICHI
IPC分类号： H01L21/304 , G02F1/13 , G02F1/1333 , H01L21/027 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus or the like which can clean a back surface of a substrate without need of reversing the substrate and without damage to a peripheral portion of the substrate.SOLUTION: A substrate cleaning apparatus 1 comprises two substrate supporting means (a suction pad 2 and a spin chuck 3) which support and hold a substrate from its back surface with the back surface facing down, and releases and holds again the substrate between these two substrate supporting means while a support region does not overlap with the other support region. A cleaning member (a brush 5) cleans the back surface of the substrate other than a region supported by the substrate supporting means. The whole back surface of the substrate is cleaned using a structure that the substrate can be released and held again between the two substrate supporting means.
摘要翻译：要解决的问题：提供一种能够清洁基板的背面而不需要使基板反转而不损坏基板的周边部分的基板清洗装置等。解决方案：基板清洁装置1包括两个基板支撑装置（吸盘2和旋转卡盘3），该基板支撑装置（吸盘2和旋转卡盘3）从后表面支撑并保持基板，背面朝下，并且再次释放和保持基板在两个基板支撑装置之间，而支撑区域不与另一个支撑区域重叠。清洁构件（刷子5）除了由基板支撑装置支撑的区域之外，清洁基板的背面。使用可以将基板释放并再次保持在两个基板支撑装置之间的结构来清洁基板的整个背面。版权所有（C）2013，JPO＆INPIT

73. 发明专利

JP2012099676A Template processing method, program, computer storage medium and template processing unit 有权
标题翻译：模板处理方法，程序，计算机存储介质和模板处理单元
公开(公告)号：JP2012099676A
公开(公告)日：2012-05-24
申请号：JP2010246890
申请日：2010-11-02
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： HIROSHIRO KOKICHI , NISHI TAKANORI , TERADA SHOICHI , KITANO TAKAHIRO
IPC分类号： H01L21/027 , B29C33/58
CPC分类号： B29C33/58 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： PROBLEM TO BE SOLVED: To supply process liquid to the pattern region of a template while reducing the amount of process liquid supply onto the template.SOLUTION: A process liquid application jig 110 is arranged to face a template T so that the coated surface 111 of the process liquid application jig 110 covers the pattern region Dof the template T, and the distance of a clearance 116 between the coated surface 111 and the pattern region Dbecomes the distance of generating capillary phenomenon of a mold release agent S (Fig. 12(a)). Subsequently, the mold release agent S is supplied from a process liquid supply section 120 to the clearance 116, and the mold release agent S is diffused only onto the pattern region Dby capillary phenomenon (Figs. 12(b)-(d)). Thereafter, the mold release agent S is dried by blowing air thereto from an air nozzle 150 (Fig. 12(e)).
摘要翻译：要解决的问题：将工艺液体提供给模板的图案区域，同时减少对模板的工艺液体供应量。解决方案：处理液施加夹具110布置成面对模板T，使得处理液施加夹具110的涂覆表面111覆盖图案区域D 1 模板T和涂布表面111与图案区域D 1 之间的间隙116的距离成为脱模剂S产生毛细管现象的距离（图1）。图12（a））。随后，脱模剂S从处理液供给部120供给到间隙116，脱模剂S仅通过毛细管扩散到图案区域D 1 现象（图12（b） - （d））。此后，通过从空气喷嘴150向其吹入空气来干燥脱模剂S.（图12（e））。版权所有（C）2012，JPO＆INPIT

74. 发明专利

JP2011253899A Hydrophobic treatment method and hydrophobic treatment device 有权
标题翻译：疏水处理方法和疏水处理装置
公开(公告)号：JP2011253899A
公开(公告)日：2011-12-15
申请号：JP2010126048
申请日：2010-06-01
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： HAMADA TOMOKO , NISHI KENJI , NIIMURA SATOSHI , FUKUOKA TETSUO , KITANO TAKAHIRO , TAKESHITA KAZUHIRO , YASUMATSU JUN
IPC分类号： H01L21/027 , B05C9/10 , B05D3/10 , B05D5/00
摘要： PROBLEM TO BE SOLVED: To provide a hydrophobic treatment method and a hydrophobic treatment device in which high hydrophobicity can be stably ensured.SOLUTION: In a hydrophobic treatment for supplying a wafer W with an HMDS gas in a processing container to generate a hydrophobic group including -O(CH)on a surface of the wafer, a process of supplying the wafer W with steam as a reaction accelerator for accelerating the hydrophobization, a process of heating the wafer W carried in the processing container, and a process of supplying the HMD gas to the surface of the wafer W in a condition that the steam is adsorbed on the surface of the heated wafer W are performed. The steam accelerates a reaction between silicon in the HMDS hydrophobic treatment gas and oxygen on the substrate surface, by which high hydrophobicity is stably achieved.
摘要翻译：要解决的问题：提供疏水性处理方法和能够稳定地确保高疏水性的疏水性处理装置。解决方案：在用于在处理容器中提供具有HMDS气体的晶片W以产生包含-O（CH 3 ）的疏水基团的疏水处理 3 ，提供晶片W作为用于加速疏水化的反应促进剂的蒸汽的处理，加工在处理容器中的晶片W的加工过程在将蒸汽吸附在被加热的晶片W的表面上的条件下，将HMD气体供给到晶片W的表面。蒸汽加速HMDS疏水性处理气体中的硅与基材表面上的氧之间的反应，从而稳定地实现高疏水性。版权所有（C）2012，JPO＆INPIT

75. 发明专利

JP2011104910A Template processing method, program, computer storage medium, template processor, and imprinting system 审中-公开
标题翻译：模式处理方法，程序，计算机存储介质，模板处理器和打印系统
公开(公告)号：JP2011104910A
公开(公告)日：2011-06-02
申请号：JP2009263562
申请日：2009-11-19
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： HIROSHIRO KOKICHI , NISHI TAKANORI , KITANO TAKAHIRO , TERADA SHOICHI
IPC分类号： B29C33/58 , B29C59/02 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To improve throughput of template processing while forming a film of a mold release agent appropriately on the surface of a template.
SOLUTION: Template processing for forming the film of the mold release agent on the surface of the template includes cleaning the surface of the template (process A2), coating the surface of the template with the mold release agent by a coating unit (process A3), drying the mold release agent on the template (process A4), applying alcohol to the mold release agent on the template to stick the mold release agent closely to the surface of the template and eliminating the unreacted portion of the mold release agent (process A5), and drying to eliminate alcohol on the template (process A6), thus forming the film of the mold release agent with a predetermined film thickness on the surface of the template.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：在模板表面上适当地形成脱模剂的膜时，提高模板加工的生产量。解决方案：在模板表面上形成脱模剂的膜的模板处理包括清洗模板的表面（工艺A2），用脱模剂涂覆模板的表面通过涂覆单元（方法A3），在模板上干燥脱模剂（方法A4），向模板上的脱模剂施加酒精以将脱模剂紧贴在模板的表面上，并除去脱模剂的未反应部分（方法A5），并干燥以除去模板上的醇（方法A6），从而在模板的表面上形成具有预定膜厚度的脱模剂的膜。版权所有（C）2011，JPO＆INPIT

76. 发明专利

JP2011044671A Hydrophobization treatment apparatus, hydrophobization treatment method, and storage medium 有权
标题翻译：疏水处理装置，疏水处理方法和储存介质
公开(公告)号：JP2011044671A
公开(公告)日：2011-03-03
申请号：JP2009193587
申请日：2009-08-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： NIIMURA SATOSHI , FUKUOKA TETSUO , KITANO TAKAHIRO
IPC分类号： H01L21/027 , G03F7/38
CPC分类号： C23C16/24 , C23C16/4485
摘要： PROBLEM TO BE SOLVED: To provide a hydrophobization treatment apparatus which has high vaporization efficiency for a chemical solution, is capable of feeding a highly-concentrated hydrophobizing gas to a substrate, and furthermore, is capable of suppressing deterioration of a chemical solution.
SOLUTION: The hydrophobization treatment apparatus is configured to include: a vaporization surface formation part, the surface of which is located in a vaporization chamber; a vaporization surface heating means for heating the vaporization surface formation part; a chemical solution feed port for feeding a chemical solution for hydrophobization treatment to the surface of the vaporization surface formation part; a gas introduction port for introducing a carrier gas, which is used for vaporizing the chemical solution spread over the vaporization surface formation part, into the vaporization chamber; a takeout port for taking out a hydrophobizing gas; and a treatment vessel which feeds the hydrophobizing gas taken out through the takeout port to a substrate. This configuration allows the highly-concentrated hydrophobizing gas to be fed to the substrate, and also allows deterioration of the chemical solution to be suppressed because the stored chemical solution does not make contact with the carrier gas when treatment is not performed.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种化学溶液的蒸发效率高的疏水化处理装置，能够将高浓缩疏水化气体供给到基板，此外，能够抑制化学溶液的劣化。解决方案：疏水化处理装置被构造成包括：蒸发表面形成部分，其表面位于蒸发室中; 蒸发表面加热装置，用于加热汽化表面形成部分; 用于向蒸发表面形成部分的表面供给用于疏水化处理的化学溶液的化学溶液进料口; 用于引入用于将分散在蒸发表面形成部分上的化学溶液蒸发的载气引入气化室的气体导入口; 用于取出疏水性气体的取出口; 以及将通过取出口取出的疏水化气体供给到基板的处理容器。通过该结构，能够将高浓缩的疏水化气体供给到基板，并且，由于在不进行处理的情况下，储存的化学溶液不与载气接触，因此能够抑制化学溶液的劣化。版权所有（C）2011，JPO＆INPIT

77. 发明专利

JP2011009359A Template treatment device, and imprint system 有权
标题翻译：模板处理设备和印刷系统
公开(公告)号：JP2011009359A
公开(公告)日：2011-01-13
申请号：JP2009149849
申请日：2009-06-24
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TERADA SHOICHI , KIMURA YOSHIO , KITANO TAKAHIRO
IPC分类号： H01L21/027 , B29C33/58 , B29C33/72 , B29C59/02
CPC分类号： B05C13/00 , B29C33/58 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/566 , H01L21/67057 , H01L21/6715 , H01L21/67178 , H01L21/6719 , H01L21/67207 , H01L21/67333 , H01L21/68707 , H01L2924/0002 , Y10S414/141 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To continuously form the film of a release agent on a plurality of templates.SOLUTION: A template treatment device 1 includes a connection of a template charging/discharging station 2 and a treatment station 3 in one body. The template charging/discharging station 2 can hold a plurality of templates T and charges/discharges the templates to/from the treatment station 3. The treatment station 3 includes a transfer unit 20 for transferring the templates T to various treatment units arranged in treatment blocks G1 to G4. The treatment blocks G1 and G2 include coating units for applying the mold release agent to the templates T1 and cleaning units for cleaning the mold release agent away from on the templates T, respectively. The treatment blocks G3 and G4 include cleaning units for cleaning surfaces of the templates T, a temperature control unit for controlling temperature of the templates T, and heating units for calcining the templates T.
摘要翻译：要解决的问题：在多个模板上连续地形成脱模剂的膜。解决方案：模板处理装置1包括模板充放电站2和处理站3在一体中的连接。模板充电/放电站2可以容纳多个模板T，并且对来自处理站3的模板进行充电/放电。处理站3包括用于将模板T传送到布置在处理块中的各种处理单元的转移单元20 G1到G4。处理块G1和G2分别包括用于将模具分离剂施加到模板T1的涂布单元和用于清除脱模剂的清洁单元远离模板T。处理块G3和G4包括用于清洁模板T的表面的清洁单元，用于控制模板T的温度的温度控制单元和用于煅烧模板T的加热单元。

78. 发明专利

JP2010192920A Coating processor 有权
标题翻译：涂料加工商
公开(公告)号：JP2010192920A
公开(公告)日：2010-09-02
申请号：JP2010091138
申请日：2010-04-12
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KITANO TAKAHIRO , MOTOMATSU KAZUKI , TANAKA KEIICHI
IPC分类号： H01L21/027 , B05C5/02 , B05C11/00 , B05C11/10
摘要： PROBLEM TO BE SOLVED: To provide a coating processor that suppresses unnecessary consumption of a resist liquid as much as possible, and can adjust the viscosity of the resist liquid on an in-line basis without lowering the throughput.
SOLUTION: The coating processor includes: a dilute coating liquid supply mechanism comprising a mixing unit 70 for mixing a high-concentration coating liquid and a solvent together to prepare a dilute coating liquid diluted to a predetermined concentration, a coating liquid discharging mechanism 14 for discharging the dilute coating liquid to form a coating film on a substrate, feeding piping 69 for feeding the dilute coating liquid from the mixing section 70 to the coating liquid discharging mechanism 14, a buffer tank 71 for temporarily reservoiring the dilute coating liquid from the feeding piping 69, and a supply pump 74 for supplying the dilute coating liquid from the buffer tank 71 to the coating liquid discharging mechanism 14; a dilute liquid circulation section which receives the dilute coating liquid from the buffer tank 71 and returns it to the mixing section 70 for circulation; and a switching mechanism for changing the feed destination of the dilute coating liquid between the side of the coating liquid discharging mechanism 14 and the side of the coating liquid circulation section.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供尽可能地抑制不必要的抗蚀剂液体消耗的涂布处理器，并且可以在不降低生产量的情况下在线基础上调节抗蚀剂液体的粘度。解决方案：涂料处理器包括：稀释涂料液体供给机构，包括混合单元70，用于将高浓度涂布液和溶剂混合在一起，制备稀释至预定浓度的稀释涂布液，涂布液排出机构 14，用于排出稀释涂布液以在基材上形成涂膜，将稀释涂料液体从混合部分70供给到涂布液排出机构14的供给管道69;缓冲罐71，用于将稀释涂料液从供给管道69和用于将稀释涂液从缓冲罐71供给到涂液排出机构14的供给泵74; 稀释液体循环部分，其从缓冲罐71接收稀释的涂布液并将其返回到混合部分70以进行循环; 以及切换机构，用于改变涂布液排出机构14的一侧和涂布液循环部分之间的稀释涂布液的进给目的地。版权所有（C）2010，JPO＆INPIT

79. 发明专利

JP2009194237A Heat treatment apparatus, heat treatment method, coating, development apparatus, and storage medium 有权
标题翻译：热处理设备，热处理方法，涂料，开发设备和储存介质
公开(公告)号：JP2009194237A
公开(公告)日：2009-08-27
申请号：JP2008035082
申请日：2008-02-15
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： FUKUOKA TETSUO , KITANO TAKAHIRO
IPC分类号： H01L21/027 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment apparatus speedily increasing and decreasing the temperature of a hot plate when heat-treating a substrate placed on the hot plate.
SOLUTION: The heat treatment apparatus includes: the hot plate for placing a substrate for heating; a hot plate temperature-controlling section for controlling the temperature of the hot plate according to the temperature of a temperature-controlled medium; and a control section. The control section controls the operations of a medium temperature-controlled means and a supply means to supply the temperature-controlled medium controlled to a temperature higher than first temperature to the channel of the hot plate temperature-controlling section for changing the temperature of the hot plate to the first temperature higher than an arbitrary temperature from the arbitrary temperature, and to supply the temperature-controlled medium controlled to a temperature lower than a second temperature to the channel of the hot plate temperature-controlled section for changing the temperature of the hot plate to the second temperature lower than an arbitrary temperature from the arbitrary temperature, thus speedily increasing and decreasing the temperature of the hot plate.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：当热处理放置在热板上的基板时，提供一种快速增加和降低热板温度的热处理设备。解决方案：热处理设备包括：用于放置用于加热的基板的热板; 热板温度控制部分，用于根据温度控制介质的温度控制热板的温度; 和控制部分。控制部分控制介质温度控制装置和供应装置的操作，以将控制到高于第一温度的温度的温度控制介质提供给热板温度控制部分的通道，以改变热的温度将板温到比任意温度高的任意温度的第一温度，并且将控制到温度低于第二温度的温度控制介质供给到热板温度控制部分的通道，以改变热的温度从第二温度到任意温度的任意温度，从而快速增加和降低热板的温度。版权所有（C）2009，JPO＆INPIT

80. 发明专利

JP2008294155A Heat treatment device, heat treatment method, and storage medium 有权
标题翻译：热处理装置，热处理方法和储存介质
公开(公告)号：JP2008294155A
公开(公告)日：2008-12-04
申请号：JP2007137001
申请日：2007-05-23
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： FUKUOKA TETSUO , KITANO TAKAHIRO , TERADA KAZUO
IPC分类号： H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment device etc., capable of maintaining in-plane uniformity of a heat treatment between substrates by carrying out the heat treatment while a heating plate and the substrates are held in parallel.
SOLUTION: A heating chamber 3 having a substrate carrying-in opening 31 is formed on a flank of the heat treatment device 1, and the heating plates 36 and 37 for heat-treating a substrate W are provided in parallel above and below the heating chamber 3. A substrate carrying means 5 carries the substrate W to a heat treatment position in the heating chamber 3 and holds it, and heating plate tilt detecting means 2A to 2E, and 71 detect a tilt between the heating plates 36 and 37. Alarm means 71 and 72 generate an alarm when the detection results exceed a predetermined value.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种能够通过在加热板和基板保持平行的同时进行热处理来保持基板之间的热处理的面内均匀性的热处理装置等。解决方案：在热处理装置1的侧面上形成具有基板输入开口31的加热室3，并且在基板W的上下平行地设置用于热处理基板W的加热板36和37 基板承载装置5将基板W运送到加热室3中的热处理位置并保持其，并且加热板倾斜检测装置2A至2E和71检测加热板36和37之间的倾斜当检测结果超过预定值时，报警装置71和72产生报警。版权所有（C）2009，JPO＆INPIT

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