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    • 77. 发明授权
    • Superconductor and method of producing same
    • 超导体及其制造方法
    • US5849667A
    • 1998-12-15
    • US683915
    • 1996-07-19
    • Masato MurakamiSang-Im YooNaomichi SakaiHiroshi TakaichiTakamitsu HiguchiShoji Tanaka
    • Masato MurakamiSang-Im YooNaomichi SakaiHiroshi TakaichiTakamitsu HiguchiShoji Tanaka
    • H01L39/12H01B12/00C04B35/50
    • H01L39/126Y10S505/742Y10S505/778Y10S505/779Y10S505/785
    • A high critical temperature and high critical current density superconductor is disclosed which contains a metal oxide expressed by the following formula (I): (R.sup.1.sub.1-x, Ba.sub.x)Ba.sub.2 Cu.sub.3 O.sub.d (I) wherein R.sup.1 stands for at least one element selected from the group consisting of La, Nd, Sm, Eu and Gd, x is a number greater than 0 but not greater than 0.5 and d is a number between 6.2 and 7.2. Fine phases of RE211, RE422 and/or a metal oxide expressed by the formula (R.sup.2.sub.1-z, Ba.sub.z) (Ba.sub.1-y, R.sup.2.sub.y).sub.2 Cu.sub.3 O.sub.p (R.sup.2 =La, Nd, Sm, Eu or Gd) may be dispersed in a matrix of the matrix phase of the formula (I). The above superconductor may be obtained by cooling a melt having a temperature of 1,000.degree.-1,300.degree. C. and containing R.sup.1, Ba, Cu and O at a cooling rate of 5.degree. C./hour or less under a partial pressure of oxygen of between 0.00001 and 0.05 atm, followed by annealing at 250.degree.-600.degree. C. in an oxygen atmosphere.
    • 公开了一种高临界温度和高临界电流密度超导体,其包含由下式(I)表示的金属氧化物:( R11-x,Bax)Ba2Cu3Od(I)其中R1表示选自以下的至少一种元素: 的La,Nd,Sm,Eu和Gd,x是大于0但不大于0.5的数,d是6.2和7.2之间的数。 RE211,RE422和/或由式(R21-z,Baz)(Ba1-y,R2y)2Cu3Op(R2 = La,Nd,Sm,Eu或Gd)表示的金属氧化物的细相可以分散在基质 的式(I)的基质相。 上述超导体可以通过在5℃/小时以下的冷却速度下,在温度为1000〜-1300℃的温度下冷却含有R 1,Ba,Cu和O的熔体, 在0.00001和0.05atm之间,然后在氧气氛中在250-600℃退火。
    • 78. 发明授权
    • Tuning fork vibration device and method for manufacturing the same
    • 调弦叉振动装置及其制造方法
    • US08120178B2
    • 2012-02-21
    • US11692365
    • 2007-03-28
    • Takamitsu HiguchiMakoto Eguchi
    • Takamitsu HiguchiMakoto Eguchi
    • H01L21/00
    • H03H9/21H03H2003/026
    • A tuning fork vibration device includes: a SOI substrate having a substrate, an oxide layer formed above the substrate and a semiconductor layer formed above the oxide layer; a tuning fork type vibration section that is formed by processing the semiconductor layer and the oxide layer and composed of the semiconductor layer; and a driving section for generating flexural vibration of the vibration section, wherein the vibration section includes a support section and two beam sections formed in a cantilever shape with the support section as a base of the beam sections, and the driving section includes a pair of drivers formed on each of the two beam sections, each of the drivers including a first electrode layer, a piezoelectric layer formed above the first electrode layer and a second electrode layer formed above the piezoelectric layer.
    • 音叉振动装置包括:具有衬底的SOI衬底,在衬底上形成的氧化物层和形成在氧化物层上方的半导体层; 通过处理半导体层和氧化物层并由半导体层组成的音叉型振动部分; 以及用于产生振动部分的弯曲振动的驱动部分,其中所述振动部分包括支撑部分和形成为悬臂形状的两个梁部分,其中所述支撑部分为所述梁部分的基部,并且所述驱动部分包括一对 驱动器形成在两个光束部分中的每一个上,每个驱动器包括第一电极层,形成在第一电极层上方的压电层和形成在压电层上方的第二电极层。