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71. 发明专利

JP2001110701A SUBSTRATE TREATMENT EQUIPMENT 失效
公开(公告)号：JP2001110701A
公开(公告)日：2001-04-20
申请号：JP28532599
申请日：1999-10-06
申请人： TOKYO ELECTRON LTD
发明人： TAKEKUMA TAKASHI , UEDA KAZUNARI
IPC分类号： H01L21/677 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To reduce the load on a wafer carrying means and improve throughout, in e.g. coating equipment and developing equipment. SOLUTION: In a treatment station S2 performing coating of resist or the like, a first treatment part group containing a reflection preventing film forming unit B, a coating unit C and a cooling part 3 is arranged in parallel to the arrangement direction of a cassette 22 of a cassette station S1 delivering the cassette 22 and adjacently to the station S1. Neighboring the first treatment part group, a third treatment part group containing a shelf unit R and a second treatment part group containing a developing unit D are arranged in this order oppositely to the first treatment part group. Water carrying means MA1, MA2 are arranged between the first and second treatment part groups and between the second and third treatment part groups, respectively. As a result, delivery of a wafer W is enabled to the first treatment part group by using a delivering arm 23 of the cassette station S1, and the load of the wafer carrying means MA can be reduced.

72. 发明专利

JP2001077019A PROCESSING SYSTEM 失效
公开(公告)号：JP2001077019A
公开(公告)日：2001-03-23
申请号：JP2000213129
申请日：2000-07-13
申请人： TOKYO ELECTRON LTD
发明人： AKUMOTO MASAMI , KIMURA YOSHIO , IIDA NARIAKI , HARADA KOJI , UEDA KAZUNARI
IPC分类号： H01L21/677 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To reduce the occupation space of a system, to reduce clean room cost, to realize high speed transfer and access velocity and to improve a throughput. SOLUTION: In the system, a cassette station 10 for carrying substrates to be processed, e.g. semiconductor wafers W into the system from the outside at the unit of plural pieces, 25 pieces in a wafer cassette CR for example, or carrying them out from the system, a processing station 12 where the various processing units of a single wafer type for executing a prescribed processing on the semiconductor wafers W one by one in a developing coating process, are arranged for plural stages around a main wafer transfer mechanism 24 for plural groups G1 to G4, an interface part 14 transferring the semiconductor wafers W between the processing station 12 and the adjacent exposure device are integrally connected. The main wafer transportation mechanism 24 is equipped with a cylindrical supporting body having a side opening part which can rotate around a vertical axis, and a wafer transfer body which is installed inside the cylindrical supporting body so that it can move in a vertical direction (Z direction) and has tweezers which can move forward/backward in a horizontal direction so that it can pass through the side opening part of the cylindrical supporting body.

73. 发明专利

JP2001068525A SUBSTRATE TRANSFER DEVICE AND TREATING SYSTEM 失效
公开(公告)号：JP2001068525A
公开(公告)日：2001-03-16
申请号：JP2000214595
申请日：2000-07-14
申请人： TOKYO ELECTRON LTD
发明人： AKUMOTO MASAMI , KIMURA YOSHIO , IIDA NARIAKI , HARADA KOJI , UEDA KAZUNARI
IPC分类号： G03F7/16 , B65G49/07 , G03F7/30 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To enable transfer of substrates to be treated at a high speed, smoothly and effectively within a small occupied floor space. SOLUTION: In a main wafer transfer mechanism 24, a wafer transfer body 96 is attached freely movably in the vertical (Z direction) directions inside a cylindrical support body 94 consisting of a pair of vertical wall parts 91 and 92 connected at the upper and lower ends so as to face opposite to each other. The cylindrical support body 94 is connected to the rotary shaft of a rotary driving motor 98, so as to rotate on a rotary axis integrally with the wafer transfer body 96 by a rotary drive force of the motor 98. The wafer transfer body 96 is provided with a plurality, e.g. three pairs of tweezers 106A, 106B and 106C which are movable in the X-direction (forwards and backwards) on a transfer table 104. Each pair of tweezers 106 is allowed to pass through a side opening part 95 between both the vertical wall parts 91 and 92 of the cylindrical support body 94.

74. 发明专利

JP2001052983A HEAT TREATMENT APPARATUS AND METHOD THEREFOR 失效
公开(公告)号：JP2001052983A
公开(公告)日：2001-02-23
申请号：JP22495199
申请日：1999-08-09
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , HARADA KOJI , YANO KAZUTOSHI
IPC分类号： H01L21/027 , G03F7/38
摘要： PROBLEM TO BE SOLVED: To obtain a heat treatment apparatus and a method therefor in which the substrate transfer time can be reduced to improve throughput in treating a substrate in the case of heat treatment a low temperature. SOLUTION: An anti-reflection-film coated wafer W is transferred to a treatment chamber 50, by placed on lift pins 54, approached to a low-temperature heating prate 51 by lowering the lift pins 54, and subjected to a lowtemperature heat treatment there. Then, the wafer W is approached to a high-temperature heating plate 52 by being lifted up by the lift pins 54, and subjected to a high- temperature heat treatment there. Then, the wafer W is lowered by the lift pins 54 and is taken out from the treatment chamber 50.

75. 发明专利

JP2000277600A RETAINER OF SUBSTRATE 失效
公开(公告)号：JP2000277600A
公开(公告)日：2000-10-06
申请号：JP7782199
申请日：1999-03-23
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI
IPC分类号： H01L21/68 , H01L21/027 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To transport a substrate to a precise position in an apparatus of a transportation destination by a method wherein there are provided a plurality of support members which horizontally support the substrate in an inner periphery of a frame part enclosing and ranging over a semicircle or over of the outer periphery of the substrate, and can incline downwardly. SOLUTION: When a wafer W is transferred to a cleaner or heater, respective support members 124 to 127 of tweezers are inclined downwardly in an inner periphery of a frame part 121, and a wafer W is positioned by sliding an inclined face. The respective support members 124 to 127 are constituted so that a support face 128 is horizontalized by pressing of a leaf spring 131, and there is provided a positioning groove 135 for engaging with an end of the wafer W when these support members 124 to 127 are inclined. A frame part side of the support members 124 to 127 is set as a heavy part, and a side of supporting the wafer W is set as a light part, and the support members 124 to 127 may be constituted so that the support face 128 is horizontalized by its weight. Thus, it is possible to position the substrate to an accurate position, and to transport it to the accurate position of a transportation destination.

76. 发明专利

JP2000091226A SUBSTRATE TREATMENT APPARATUS 失效
公开(公告)号：JP2000091226A
公开(公告)日：2000-03-31
申请号：JP19556899
申请日：1999-07-09
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , MATSUSHITA MICHIAKI , ITO KAZUHIKO , YAMAGUCHI TADAYUKI
IPC分类号： H01L21/027 , G03F7/20 , G03F7/30
摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus with a good throughput at a high-speed treatment, in which strict temperature control can be realized as compared with a conventional case and a circuit pattern can be transfered accurately. SOLUTION: A mechanism for temperature control of a wafer put in a buffer cassette BR in an interface part includes an air temperature control mechanism 101 for BR temperature control and a BR temperature control unit 102 for controlling the air temperature control mechanism 101. In addition, a control signal and a temperature detection signal from an exposure-apparatus temperature control unit 203 to a substrate temperature control mechanism 202 for the exposure apparatus are entered in the BR temperature control unit 102. On the basis of the tendency of the signal, the control signal to the air temperature control mechanism 101 for BR temperature control is adjusted.

77. 发明专利

JPH11330198A SUBSTRATE CARRYING EQUIPMENT AND SUBSTRATE PROCESSING EQUIPMENT 失效
公开(公告)号：JPH11330198A
公开(公告)日：1999-11-30
申请号：JP13410298
申请日：1998-05-15
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI
IPC分类号： B65G1/00 , B65G49/07 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide substrate carrying equipment which is able to restrain further the generation of dust as compared with the conventional one and manufacturing cost reduction or the like is enabled by simplifying mechanism such as positioning mechanism. SOLUTION: Step parts 2a, 2b, 2c as anchoring parts for anchoring the peripheral part of a wafer W are formed on the tip side upper surface of a forceps 2. The step parts 2b, 2c formed on rear end side of the forceps 2 are constituted as two steps, so as to form two anchoring surfaces for anchoring the peripheral part of the wafer W. The step part 2b is so constituted as to have sufficient clearance to the diameter of the wafer, in order to absorve the dispersion of positions of wafers and be able to anchor the wafer. The step part 2c is so constituted as to be able to retain the wafer in the state that it is precisely positioned almost without looseness.

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