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    • 72. 发明专利
    • METHOD FOR PRODUCING DIELECTRIC CERAMIC COMPOSITION
    • JP2001220225A
    • 2001-08-14
    • JP2000304760
    • 2000-10-04
    • TDK CORP
    • SATO SHIGEKITERADA YOSHIHIROFUJIKAWA YOSHINORI
    • C04B35/46H01B3/00H01B3/12H01G4/12
    • PROBLEM TO BE SOLVED: To provide a method for producing a dielectric ceramic composition suitable as the dielectric ceramic composition for a laminated chip capacitor capable of using a base metal such as Ni and a Ni alloy as an internal electrode, having small dielectric loss, high dielectric constant and insulation resistance, and excellent in a high- temperature accelerated life characteristics by which the precipitation of a foreign phase except the main composition and the formation of the fine structure of a dielectric substance is suppressed, while regulating the volume-temperature characteristics so as to satisfy the X8R characteristics. SOLUTION: This method for producing a dielectric ceramic composition comprising barium titanate as a main component, a second subcomponent consisting essentially of silicon oxide, a sixth subcomponent containing CaZrO3 or CAO+ZrO2, and other subcomponents comprises mixing the sixth subcomponent and other subcomponents except the second subcomponent with the main component to provide a precalcining powder, calcining the obtained precalcining powder to provide a calcined powder, and mixing the second subcomponent with the calcined powder to provide the objective dielectric ceramic composition having the specific molar ratio of each subcomponent to the main component.
    • 76. 发明专利
    • MANUFACTURE OF CERAMIC CAPACITOR AND CUTTER FOR LAMINATED MOLDING
    • JP2000269104A
    • 2000-09-29
    • JP7156799
    • 1999-03-17
    • TDK CORP
    • KANASUGI MASAAKISATO SHIGEKI
    • H01G4/12H01G13/00
    • PROBLEM TO BE SOLVED: To prevent the ply separation or the reduction in the ply adhesion in a cutting process by cutting a laminated molding with a cutting blade with its one principal plane being pressed and, after drawing up the cutting blade, canceling the pressing. SOLUTION: After a laminated molding 1 is positioned and set with accuracy on a base 21, a fluid pressure cylinder is operated to lower a press body 24. In the pressing of the laminated molding by the press body 24, a load is not necessarily applied but it would be just fine to bring the press body 24 into contact with the laminated molding 1. Next, the fluid pressure cylinder is operated to lower a cutting blade base 23 and a cutting blade 22. When the cutting blade 22 reaches the bottom dead point where it can cut the laminated molding 1, the cylinder is operated in the reverse direction to raise the cutting blade base 23 and the cutting blade 22 with the press body 24 being kept at the same position. When the cutting blade base 23 and the cutting blade 22 are raised up to a certain point, the cylinder is operated in the reverse direction to raise the press body 24.
    • 78. 发明专利
    • Method of manufacturing laminated ceramic electronic component
    • 制造层压陶瓷电子元件的方法
    • JP2008277766A
    • 2008-11-13
    • JP2008060886
    • 2008-03-11
    • Tdk CorpTdk株式会社
    • MORITA DAISUKESATO SHIGEKIKARATSU SHINKO
    • H01G4/30H01G4/12
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated ceramic electronic component capable of preventing cracks, or the like after sintering effectively by achieving satisfactory lamination properties and adhesiveness in a green sheet even if a binder included in the green sheet and an internal electrode pattern layer is immiscible.
      SOLUTION: The manufacturing method of a laminated ceramic electronic component has a process for obtaining a laminate by laminating the green sheet containing a ceramic powder and a butyral resin and the internal electrode pattern layer. The degree of polymerization in the butyral resin is 1,000-2,400. An internal electrode paste has a conductor powder and an organic binder (at least one selected from ethyl cellulose, gum rosin used as an adhesive additive agent, rosin glycerol ester, and an alicyclic petroleum resin). The organic binder that exceeds 2 pts.wt. and is less than 9 pts.wt. is contained to a conductor powder of 100 pts.wt. The content by percentage of the adhesive additive agent to the content of the organic binder is 5-50 wt.%.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 解决问题:为了提供一种能够通过实现令人满意的层压性能和生片中的粘附性而有效地防止裂纹等的层叠陶瓷电子部件的制造方法,即使生坯中包含的粘合剂 并且内部电极图案层是不混溶的。 解决方案:层压陶瓷电子部件的制造方法具有通过层压含有陶瓷粉末和丁缩醛树脂的生片和内部电极图案层来获得层压体的工艺。 丁缩醛树脂中的聚合度为1,000-2,400。 内部电极糊具有导体粉末和有机粘合剂(选自乙基纤维素,用作粘合剂添加剂的松香,松香甘油酯和脂环族石油树脂中的至少一种)。 有机粘合剂超过2重量 并且小于9磅 被包含在100重量份的导体粉末中 粘合剂添加剂的含量相对于有机粘合剂的含量为5-50重量%。 版权所有(C)2009,JPO&INPIT
    • 79. 发明专利
    • Method for manufacturing laminated ceramic electronic part
    • 层压陶瓷电子零件制造方法
    • JP2008153309A
    • 2008-07-03
    • JP2006337622
    • 2006-12-14
    • Tdk CorpTdk株式会社
    • MORITA DAISUKESATO SHIGEKIKARATSU SHINKO
    • H01G4/12H01G4/30
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic electronic part thinning a green sheet, improving the laminating and adhesive properties of the green sheet even in the incompatible combination of each binder contained in the green sheet and an internal-electrode pattern layer and being capable of effectively preventing cracks or the like after baking.
      SOLUTION: The method for manufacturing the laminated ceramic electronic part has a thermocompression bonding process alternately superposing ceramic green sheets containing ceramic pulverulent bodies and butylal resins and the internal-electrode pattern layers having a specified pattern through heating and pressing and obtaining a green laminate. In the manufacturing method for the laminated ceramic electronic part, an internal-electrode paste for forming the internal-electrode pattern layer has conductive powder and the binder mainly comprising ethyl cellulose. In the manufacturing method, ethyl cellulose is contained in 1.0 to 3.0 pts.wt (except 1.0 pts.wt.) to conductive powder of 100 pts.wt.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种薄片化薄片层压陶瓷电子部件的制造方法,即使在生片中包含的各种粘合剂的不相容的组合和内部的粘合剂组合中,也能改善生片的层压和粘合性能 电极图案层,并且能够有效地防止烘烤后的裂纹等。 < P>解决方案:层压陶瓷电子部件的制造方法具有通过加热和加压交替地叠加含有陶瓷粉体和丁基树脂的陶瓷生片和具有指定图案的内部电极图案的热压接工艺,并获得绿色 层压板。 在层叠陶瓷电子部件的制造方法中,形成内部电极图案层的内部电极浆料具有导电性粉末,主要包含乙基纤维素的粘合剂。 在制造方法中,乙基纤维素含量为1.0〜3.0重量份(1.0重量份以下)为100重量份的导电粉末。 版权所有(C)2008,JPO&INPIT
    • 80. 发明专利
    • Method for manufacturing electronic component having internal electrode layer
    • 用于制造具有内部电极层的电子元件的方法
    • JP2007189107A
    • 2007-07-26
    • JP2006006597
    • 2006-01-13
    • Tdk CorpTdk株式会社
    • KANASUGI MASAAKIKARATSU SHINKOSATO SHIGEKI
    • H01G4/30H01G4/12
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component which can increase the bulk density of an electrode paste layer to be formed as an internal electrode layer and can less involve problems with the interrupted internal electrode layer, a reduced electrostatic capacity caused by irregular thickness or the like, short-circuit failure, or nonlamination (nonbonding failure).
      SOLUTION: The method for manufacturing an electronic component having an internal electrode layer comprises steps of forming a green sheet 10a, forming an electrode paste layer 12a to be formed as the internal electrode layer 12, forming a green chip as a laminate with the electrode paste layer 12a and the green sheet 10a, and baking the green chip. Before the electrode paste layer 12a is dried as the internal electrode layer 12, a magnetic force is applied to the electrode paste layer while heated at such a temperature as not to completely dry the electrode paste.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 解决的问题:为了提供一种电子部件的制造方法,其能够增加要形成为内部电极层的电极浆料层的体积密度,并且可能较少涉及中断的内部电极层的问题,减少了 由不规则的厚度等引起的静电容量,短路故障或非层压(非接合故障)。 解决方案:具有内部电极层的电子部件的制造方法包括以下步骤:形成生片10a,形成要形成的电极浆料层12a作为内部电极层12,形成作为层压体的绿色芯片, 电极浆料层12a和生片10a,并烘烤绿色芯片。 在电极浆料层12a作为内部电极层12干燥之前,在不使电极浆料完全干燥的温度下加热的同时向电极糊剂层施加磁力。 版权所有(C)2007,JPO&INPIT