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    • 72. 发明授权
    • Nonvolatile semiconductor memory device and manufacturing method thereof
    • 非易失性半导体存储器件及其制造方法
    • US07115943B2
    • 2006-10-03
    • US11013406
    • 2004-12-17
    • Toshiyuki MineNatsuki YokoyamaKan Yasui
    • Toshiyuki MineNatsuki YokoyamaKan Yasui
    • H01L29/792
    • H01L21/28282H01L27/11568H01L29/792
    • A MONOS nonvolatile memory of a split gate structure, wherein writing and erasing are performed by hot electrons and hot holes respectively, is prone to cause electrons not to be erased and to remain in an Si nitride film on a select gate electrode sidewall and that results in the deterioration of rewriting durability. When long time erasing is applied as a measure to solve the problem, drawbacks appear, such as the increase of a circuit area caused by the increase of the erasing current and the deterioration of retention characteristics. In the present invention, an Si nitride film is formed by the reactive plasma sputter deposition method that enables oriented deposition and the Si nitride film on a select gate electrode sidewall is removed at the time when a top Si oxide film is formed.
    • 分离栅结构的MONOS非易失性存储器,其中由热电子和热孔分别执行写入和擦除容易导致电子不被擦除并且保留在选择栅极电极侧壁上的氮化硅膜中,并且结果 在改写耐久性的恶化。 当长时间擦除作为解决该问题的措施时,会出现缺点,例如由擦除电流的增加引起的电路面积的增加和保留特性的劣化。 在本发明中,通过能够进行取向沉积的反应等离子体溅射沉积方法形成氮化硅膜,并且在形成顶部Si氧化物膜时,在选择栅电极侧壁上除去Si氮化物膜。
    • 73. 发明申请
    • Semiconductor device and manufacturing method for semiconductor device to reduce the lithography masks
    • 用于半导体器件的半导体器件和制造方法来减少光刻掩模
    • US20060035435A1
    • 2006-02-16
    • US11189078
    • 2005-07-26
    • Kan YasuiDigh HisamotoTetsuya Ishimaru
    • Kan YasuiDigh HisamotoTetsuya Ishimaru
    • H01L21/336
    • H01L29/792G11C16/0466H01L27/115H01L27/11519H01L27/11568H01L29/42344
    • Semiconductor device and manufacturing method for reducing the number of required lithography masks added to the nonvolatile memory in the standard CMOS process to shorten the production period and reduce costs. In a split-gate memory cell with silicided gate electrodes utilizing a sidewall structure, a separate auxiliary pattern is formed adjoining the selected gate electrodes. A contact is set on a wiring layer self-aligned by filling side-wall gates of polysilicon in the gap between the electrodes and auxiliary pattern. The contact may overlap onto the auxiliary pattern and device isolation region, in an optimal design considering the size of the occupied surface area. If the distance to the selected gate electrode is x, the ONO film deposit thickness is t, and the polysilicon film deposit thickness is d, then the auxiliary pattern may be separated just by a distance x such that x
    • 用于减少在标准CMOS工艺中添加到非易失性存储器中的所需光刻掩模的数量的半导体器件和制造方法,以缩短生产周期并降低成本。 在具有利用侧壁结构的硅化栅电极的分裂栅极存储单元中,形成邻接所选择的栅电极的单独的辅助图案。 通过填充电极和辅助图案之间的间隙中的多晶硅的侧壁栅极,将接触设置在自对准的布线层上。 考虑到占用的表面积的大小,接触可以以最佳设计重叠在辅助图案和设备隔离区域上。 如果到选定的栅电极的距离为x,则ONO膜沉积厚度为t,多晶硅膜沉积厚度为d,则辅助图案可以仅分开距离x,使得x <2x(t + d) 。
    • 76. 发明申请
    • Non-volatil semiconductor memory device and writing method thereof
    • 非挥发性半导体存储器件及其写入方法
    • US20050285181A1
    • 2005-12-29
    • US11147243
    • 2005-06-08
    • Kan YasuiDigh HisamotoToshihiro TanakaTakashi Yamaki
    • Kan YasuiDigh HisamotoToshihiro TanakaTakashi Yamaki
    • G11C16/02G11C16/04G11C16/34H01L21/8247H01L27/10H01L27/115H01L29/423H01L29/788H01L29/792
    • G11C16/3418G11C16/0466G11C16/3427H01L27/115H01L29/4232H01L29/792
    • In a non-volatile semiconductor memory device using a charge storage film, it is intended to prevent a sequence disturb such as an erroneous write or erase of another memory cell on one and same word line which occurs depending on a bias transition path in stand-by state and write state. In connection with rise and fall of a word line bias, the present invention adopts a procedure such that a diffusion region voltage Vs on a memory transistor side is changed, and after the voltage Vs passes a certain intermediate value Vsx, a gate voltage Vmg of the memory transistor is changed. Alternatively, there is adopted a procedure such that the gate voltage Vmg of the memory transistor is changed, and after the voltage Vmg passes a certain intermediate value Vmgx, the diffusion layer voltage Vs on the memory transistor side is changed. The values of Vsx and Vmgx are determined from the magnitude of the electric field in a gate insulating film not causing FN tunneling electron injection that causes a change in threshold voltage and the magnitude of a potential barrier against holes not causing BTBT hot hole injection.
    • 在使用电荷存储膜的非易失性半导体存储器件中,旨在防止在根据独立的偏置过渡路径发生的同一字线上的另一个存储单元的错误写入或擦除的序列干扰, 按状态和写状态。 关于字线偏差的上升和下降,本发明采用使存储晶体管侧的扩散区电压Vs变化的过程,在电压Vs经过一定的中间值Vsx之后,栅极电压Vmg为 存储晶体管被改变。 或者,采用使存储晶体管的栅极电压Vmg改变的过程,并且在电压Vmg经过一定的中间值Vmgx之后,存储晶体管侧的扩散层电压Vs被改变。 Vsx和Vmgx的值由栅极绝缘膜中不引起FN隧穿电子注入的电场的大小确定,导致阈值电压的变化以及针对未引起BTBT热空穴注入的孔的势垒的大小。