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    • 73. 发明申请
    • Partial implantation method for semiconductor manufacturing
    • 半导体制造部分植入法
    • US20060211226A1
    • 2006-09-21
    • US11197091
    • 2005-08-04
    • Kyoung RouhYong SohnMin Lee
    • Kyoung RouhYong SohnMin Lee
    • H01L21/00H01L21/425
    • H01L21/265H01L21/26513
    • Disclosed herein is a partial implantation method for manufacturing semiconductor devices. The method involves implantation of dopant ions at different densities into a plurality of wafer regions, including first and second regions, defined in a wafer by means of a boundary line. In the method, first, second and third implantation zones are defined. The first implantation zone is the remaining part of the first region except for a specific part of the first region close to the boundary line, the second implantation zone is the remaining part of the second region except for a specific part of the second region close to the boundary line, and the third implantation zone is the remaining part of the wafer except for the first and second implantation zones. Then, dopant ions are implanted into the first implantation zone at a first density, into the second implantation zone at a second density different from the first density, and into the third implantation zone at a third density that is a midway value between the first and second densities.
    • 这里公开了用于制造半导体器件的部分注入方法。 该方法包括将不同密度的掺杂剂离子注入到通过边界线限定在晶片中的多个晶片区域,包括第一和第二区域。 在该方法中,限定了第一,第二和第三植入区。 第一植入区域是第一区域的剩余部分,除了靠近边界线的第一区域的特定部分之外,第二植入区域是第二区域的剩余部分,除了靠近第二区域的第二区域的特定部分 边界线和第三植入区域是除了第一和第二植入区域之外的晶片的剩余部分。 然后,掺杂剂离子以第一密度注入第一注入区,以不同于第一密度的第二密度注入第二注入区,并以第三密度进入第三注入区,第三密度是第一和第 第二密度。