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    • 71. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • WO1992006500A1
    • 1992-04-16
    • PCT/JP1991001346
    • 1991-10-04
    • SEIKO EPSON CORPORATIONTAKENAKA, Kazuhiro
    • SEIKO EPSON CORPORATION
    • H01L27/115
    • H01L27/11502
    • In the structure of a memory in which capacitors using ferroelectric substances (109) are integrated on a semiconductor substrate, particularly in the structure of certain one of unit cells forming the memory, an electrode (110) of the ferroelectric capacitor and the source diffusion layer constituting a MOS transistor are connected by a wiring electrode (107). The drain diffusion layer constituting the MOS transistor is connected with a first wiring electrode (114) containing, e.g. Al as its main component. The other electrode (113) of the capacitor is used as a second wiring electrode, leaving as it is. A third wiring electrode (108) containing, e.g. Al as its main component is disposed in parallel with the second wiring electrode, and is connected with the first wiring electrode directly or via the second wiring electrode. Thereby, the memory is suited to larger scale integration, and able to operate at a high speed.
    • 在其中具有铁电材料(109)的电容器集成在半导体衬底上的存储器的结构中,特别是在构成存储器的某些单元电池的结构中,铁电电容器的电极(110)和层 构成MOS晶体管的源极通过互连电极(107)连接。 MOS晶体管的漏极扩散层连接到包含例如Al作为主要成分的第一互连电极(114)。 原样使用电容器的另一电极(113)作为第二互连电极。 包含例如Al作为主要成分的第三互连电极(108)平行于第二互连电极安装并且直接或经由互连电极与第一互连电极连接。 第二电极。 因此,该存储器适用于高密度集成,可以高速运行。