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    • 73. 发明授权
    • Method for forming an MgO barrier layer in a tunneling magnetoresistive (TMR) device
    • 在隧道磁阻(TMR)器件中形成MgO阻挡层的方法
    • US07488609B1
    • 2009-02-10
    • US11941763
    • 2007-11-16
    • Tsann LinDaniele Mauri
    • Tsann LinDaniele Mauri
    • H01L21/00
    • H01L43/12B82Y10/00B82Y25/00B82Y40/00G01R33/098G11B5/3163G11B5/3906G11B5/3909G11C11/15H01F10/3254H01F10/3295H01F41/307
    • A method of forming a barrier layer of a tunneling magnetoresistive (TMR) device by forming first and second MgO barrier layers by different sputtering methods, but in the same sputtering system module. A first magnesium-oxide (MgO) barrier layer is formed over one of the TMR device's ferromagnetic layers by a DC magnetron sputter deposition from an Mg target in an oxygen environment. In the same module, a second MgO barrier layer is formed over the first MgO film by an RF sputter deposition from an MgO target and in an environment free of oxygen. Prior to the formation of the first MgO barrier layer, an optional Mg protection layer can be deposited on the ferromagnetic layer and oxidized by a first optional oxygen treatment. After deposition of the first MgO barrier layer, a second optional oxygen treatment may be conducted. After deposition of the second MgO barrier layer, a second Mg protection layer may be deposited by DC sputter deposition, followed by an optional third oxygen treatment.
    • 通过用不同的溅射方法,但在相同的溅射系统模块中形成第一和第二MgO阻挡层,形成隧道磁阻(TMR)器件的势垒层的方法。 通过在氧环境中的Mg靶的DC磁控溅射沉积,在TMR器件的铁磁层之一上形成第一氧化镁(MgO)阻挡层。 在相同的模块中,通过来自MgO靶的RF溅射沉积和在不含氧的环境中,在第一MgO膜上形成第二MgO阻挡层。 在形成第一MgO阻挡层之前,可以在铁磁层上沉积可选的Mg保护层,并通过第一任选的氧处理进行氧化。 在沉积第一MgO阻挡层之后,可以进行第二任选的氧处理。 在沉积第二MgO阻挡层之后,可以通过DC溅射沉积沉积第二Mg保护层,随后进行任选的第三氧处理。
    • 76. 发明申请
    • Magnetic read head having increased electron exchange
    • 磁读头具有增加的电子交换
    • US20080137236A1
    • 2008-06-12
    • US11638271
    • 2006-12-12
    • Wen-Yaung LeeJinshan LiDaniele MauriBrian R. York
    • Wen-Yaung LeeJinshan LiDaniele MauriBrian R. York
    • G11B5/33G11B5/127
    • G11B5/3906B82Y25/00G01R33/093G11B5/3163
    • A magnetic head of either CIP or CPP configuration is disclosed, having a read sensor with a strongly pinned ferromagnetic layer due to increased electronic exchange with the AFM layer. The read sensor includes a lower seed layer whose material is chosen from a group consisting of Ta, NiFeCr, NiFeCoCr, NiFe, Cu, Ta/NiFeCr, Ta/NiFeCr/NiFe, Ta/Ru and Ta/NiFeCoCr, and an upper seed layer where the upper seed layer material is chosen from a group consisting of Ru, Cu, NiFe, Cu(x)Au(1-x)(x=0.22-0.5) alloys, Ru(x)Cr(1-x)(x=0.1-0.5) alloys, NiFeCr and NiFeCoCr. An AFM layer is formed on the upper seed layer and a ferromagnetic pinned layer is formed on the AFM layer. The exchange coupling energy Jk between the AFM layer and pinned layers exceeds 1.3 erg/cm2. Also disclosed is a method of fabrication of a magnetic head including a read head sensor with a strongly pinned ferromagnetic layer due to increased electronic exchange.
    • 公开了CIP或CPP配置的磁头,其具有由于与AFM层的电子交换增加而具有强固定的铁磁层的读取传感器。 读取传感器包括下部种子层,其材料选自由Ta,NiFeCr,NiFeCoCr,NiFe,Cu,Ta / NiFeCr,Ta / NiFeCr / NiFe,Ta / Ru和Ta / NiFeCoCr组成的组,以及上部种子层 其中上部种子层材料选自Ru,Cu,NiFe,Cu(x)Au(1-x)(x = 0.22-0.5)合金,Ru(x)Cr(1-x)(x = 0.1-0.5)合金,NiFeCr和NiFeCoCr。 在上种籽层上形成AFM层,在AFM层上形成铁磁性钉扎层。 AFM层和钉扎层之间的交换耦合能量Jk超过1.3erg / cm2。 还公开了一种由于增加的电子交换而制造包括具有强固定铁磁层的读头传感器的磁头的方法。
    • 79. 发明申请
    • Method for reactive sputter deposition of an ultra-thin metal oxide film
    • 超薄金属氧化物膜的反应溅射沉积方法
    • US20060042929A1
    • 2006-03-02
    • US10927888
    • 2004-08-26
    • Daniele Mauri
    • Daniele Mauri
    • C23C14/00C23C14/32
    • H01L43/12C23C14/0042C23C14/0089C23C14/081G11B5/127G11B5/39
    • The invention is a method for reactive sputter deposition of an ultra-thin film of an oxide of a first metal onto a film of a second metal. The method can be part of the fabrication of a magnetic tunnel junction (MTJ) with the metal oxide film becoming the tunnel barrier of the MTJ. The metal oxide film is reactively sputter deposited in the presence of reactive oxygen gas (O2) from a target consisting essentially of the first metal, with the sputtering occurring in the “high-voltage” state to assure that deposition occurs with the target in its metallic mode, i.e., no or minimal oxidation. When the metal oxide film is for a MTJ tunnel barrier, then the target is formed of a metal of Al, Ti, Ta, Y, Ga or In; an alloy of two or more of these metals; or an alloy of one or more of these metals with Mg; and the film of the second metal is an iron-containing film, typically a film of Fe or a CoFe alloy.
    • 本发明是将第一金属的氧化物的超薄膜反应溅射沉积到第二金属的膜上的方法。 该方法可以是金属氧化物膜成为MTJ隧道势垒的磁隧道结(MTJ)的制造的一部分。 在基本由第一金属组成的靶上,在活性氧气(O 2 O 2)存在下,金属氧化物膜被溅射沉积,溅射以“高电压”状态发生,以确保 目标在其金属模式中发生沉积,即没有或最小的氧化。 当金属氧化物膜用于MTJ隧道势垒时,靶由Al,Ti,Ta,Y,Ga或In的金属形成; 这些金属中的两种或更多种的合金; 或这些金属中的一种或多种与Mg的合金; 并且第二金属的膜是含铁膜,通常是Fe或CoFe合金的膜。