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    • 72. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07948790B2
    • 2011-05-24
    • US12558058
    • 2009-09-11
    • Takayuki TsukamotoReika Ichihara
    • Takayuki TsukamotoReika Ichihara
    • G11C11/00
    • G11C13/0007G11C11/5685G11C13/0064G11C13/0069G11C16/3413G11C16/3463G11C2013/009G11C2211/5642G11C2213/31G11C2213/56G11C2213/71G11C2213/72
    • A memory cell arranged between first and second wirings includes a variable-resistor element. A controller controls a voltage applied between the first and second wirings. The controller performs a first operation that applies a first voltage between the first and second wirings to switch the variable-resistor element from a first state with a resistance value not less than a first resistance value, to a second state with a resistance value not more than a second resistance value smaller than the first resistance value. The second operation applies a second voltage smaller than the first voltage between the first and second wirings to switch the variable-resistor element from the second state to the first state. In the first operation, a verify voltage is applied between the first and second wirings. Based on the obtained signal, a third voltage smaller than the first voltage is applied between the first and second wirings.
    • 布置在第一和第二布线之间的存储单元包括可变电阻器元件。 控制器控制施加在第一和第二布线之间的电压。 控制器执行第一操作,其在第一和第二布线之间施加第一电压,以将具有不小于第一电阻值的电阻值的第一状态的可变电阻元件切换到具有不大于电阻值的第二状态 比第一电阻值小的第二电阻值。 第二操作施加小于第一和第二布线之间的第一电压的第二电压,以将可变电阻元件从第二状态切换到第一状态。 在第一操作中,在第一和第二布线之间施加验证电压。 基于获得的信号,在第一和第二布线之间施加小于第一电压的第三电压。
    • 78. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07391085B2
    • 2008-06-24
    • US11299773
    • 2005-12-13
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • H01L27/092
    • H01L21/823857H01L21/823462
    • A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
    • 半导体器件包括半导体衬底,形成在衬底上的nMISFET,nMISFET包括形成在衬底上的第一电介质和形成在第一电介质上的第一金属栅极,并由选自Ti,Zr,Hf, Ta,Sc,Y,镧系元素和锕系和选自所述一种金属元素的硼化物,硅化物和锗化合物的一种,以及形成在所述衬底上的pMISFET,所述pMISFET包括形成在所述衬底上的第二电介质和第二金属 栅电极形成在第二电介质上并由与第一金属栅电极相同的材料制成,第二电介质面向第二金属栅电极的至少一部分由绝缘材料制成,绝缘材料与至少一部分 的第一电介质面向第一金属栅电极。