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    • 73. 发明申请
    • NOBLE METAL LAYER FORMATION FOR COPPER FILM DEPOSITION
    • 铜箔沉积物的金属层形成
    • US20080274279A1
    • 2008-11-06
    • US12170454
    • 2008-07-10
    • MEI CHANGLing Chen
    • MEI CHANGLing Chen
    • C23C16/06
    • C23C16/18C23C16/45553H01L21/28562H01L21/76843H01L21/76873H01L21/76874
    • Embodiments described herein relate to depositing a cobalt-containing layer by a cyclical deposition process while forming interconnects on a substrate. In one embodiment, a method for forming an interconnect structure is provided which includes depositing a tungsten-containing barrier layer over an exposed contact metal surface within an aperture formed in an insulating material disposed on a substrate, forming a cobalt-containing layer on the tungsten-containing barrier layer using a cyclical deposition process by sequentially exposing the substrate to a cobalt precursor gas and a silicon reducing gas, wherein the cobalt precursor gas contains a cobalt precursor having a cyclopentadienyl ligand, and depositing a copper material on the cobalt-containing layer.
    • 本文所述的实施例涉及通过循环沉积工艺沉积含钴层,同时在衬底上形成互连。 在一个实施例中,提供一种用于形成互连结构的方法,其包括在形成在设置在基板上的绝缘材料形成的孔内的暴露的接触金属表面上沉积含钨阻挡层,在钨上形成含钴层 使用循环沉积工艺通过将基底暴露于钴前体气体和还原性还原气体,其中钴前体气体包含具有环戊二烯基配体的钴前体,并且在含钴层上沉积铜材料 。
    • 74. 发明授权
    • Processing chamber configured for uniform gas flow
    • 处理室配置为均匀气流
    • US07422637B2
    • 2008-09-09
    • US11552727
    • 2006-10-25
    • Vincent KuLing ChenHoward GrunesHua Chung
    • Vincent KuLing ChenHoward GrunesHua Chung
    • C23C16/00C23F1/00H01L21/306
    • C23C16/45544C23C16/4409C23C16/4412C23C16/45521C23C16/4585
    • An apparatus and method for performing uniform gas flow in a processing chamber is provided. In one embodiment, an apparatus is an edge ring that includes an annular body having an annular seal projecting therefrom is provided. The seal is coupled to a side of the annular body opposite a side adapted to seat on the substrate support. In another embodiment, a processing system is provided that includes a chamber body, a lid, a substrate support and a plurality of flow control orifices. The lid is disposed on the chamber body and defining an interior volume therewith. The substrate support is disposed in the interior volume and at least partially defines a processing region with the lid. The flow control orifices are disposed between the substrate support and the lid. The flow control orifices are adapted to control flow of gases exiting the processing region.
    • 提供了一种在处理室中进行均匀气体流动的装置和方法。 在一个实施例中,一种装置是一种边缘环,其包括具有从其突出的环形密封件的环形主体。 密封件联接到环形体的与适于安置在基板支撑件上的一侧相对的一侧。 在另一个实施例中,提供了一种处理系统,其包括室主体,盖,衬底支撑件和多个流量控制孔。 盖子设置在室主体上并且与其限定内部容积。 衬底支撑件设置在内部容积中并且至少部分地限定具有盖子的处理区域。 流量控制孔布置在基板支撑件和盖子之间。 流量控制孔适于控制离开处理区域的气体流。