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    • 71. 发明申请
    • Heat Dissipation device
    • 散热装置
    • US20080049397A1
    • 2008-02-28
    • US11309905
    • 2006-10-26
    • Jun LongHao LiTao Li
    • Jun LongHao LiTao Li
    • H05K7/20
    • H01L23/467H01L23/4093H01L2924/0002H01L2924/00
    • A heat dissipation device for an electronic unit includes a heat sink (10), a pair of fan holders (30, 40) and a fan (50) mounted on the heat sink via the fan holders. The heat sink includes a base (11) with a plurality of fins (15) extending upwardly therefrom along a lateral direction thereof. The base forms a pair of lateral walls at two opposite lateral sides thereof. The fins are sandwiched between the lateral walls. A pair of supporting plates (17) extend from the lateral walls for mounting the fan holders on the heat sink. The fan holders cooperate with the lateral walls of the heat sink to encompass a top of the fins to prevent airflow generated by the fan from escaping from the top of the fins.
    • 一种用于电子单元的散热装置包括散热片(10),一对风扇支架(30,40)和通过风扇支架安装在散热器上的风扇(50)。 散热器包括具有从其沿其横向方向向上延伸的多个翅片(15)的基座(11)。 底座在其两个相对的侧面形成一对侧壁。 翅片夹在两侧壁之间。 一对支撑板(17)从侧壁延伸,用于将风扇支架安装在散热器上。 风扇支架与散热器的侧壁配合以包围散热片的顶部,以防止风扇产生的气流从散热片的顶部逸出。
    • 76. 发明申请
    • Method for attaching spacers in an emission display
    • 用于在发射显示器中附接间隔物的方法
    • US20070069627A1
    • 2007-03-29
    • US11240171
    • 2005-09-29
    • Kenneth DeanHao Li
    • Kenneth DeanHao Li
    • H01J19/42H01J63/04H01J1/62H01J9/24
    • H01J29/327H01J9/242H01J29/864H01J31/127H01J2329/8625
    • A method is provided for bonding spacers (22) to an anode (12) and/or cathode (24) of a flat panel display. The method comprises forming a black matrix layer (26) between a ductile metal layer (28) and a first display plate (12), the black matrix layer (26) and the ductile metal layer (28) defining a plurality of regions (20) surrounding a plurality of pixels (16). A cathodoluminescent material (18) is formed within each of the pixels (16) and an aluminum layer (32) may be formed on the silver layer (28) and the cathodoluminescent layer (18). A first end (52) of each of a plurality of spacers is attached to one each of the regions (20), wherein a thermocompression bonding positions the spacer (22) contiguous to the ductile metal layer (28). The second display plate (24), e.g., cathode, is attached to a second end of each of the plurality of spacers (22).
    • 提供一种用于将间隔物(22)连接到平板显示器的阳极(12)和/或阴极(24)的方法。 该方法包括在延性金属层(28)和第一显示板(12)之间形成黑矩阵层(26),黑矩阵层(26)和延性金属层(28)限定多个区域 )围绕多个像素(16)。 在每个像素(16)内形成阴极发光材料(18),并且可以在银层(28)和阴极发光层(18)上形成铝层(32)。 多个间隔件中的每一个的第一端(52)附接到每个区域(20),其中热压接将位置与延性金属层(28)邻接的间隔物(22)定位。 第二显示板(24),例如阴极,附接到多个间隔件(22)中的每一个的第二端。
    • 79. 发明授权
    • BST on low-loss substrates for frequency agile applications
    • BST用于频率敏捷应用的低损耗衬底
    • US06764864B1
    • 2004-07-20
    • US10418372
    • 2003-04-17
    • Hao LiJeffrey M. FinderYong LiangCorey Overgaard
    • Hao LiJeffrey M. FinderYong LiangCorey Overgaard
    • H01L2100
    • H01L21/32105C30B25/18C30B29/32H01L21/31691H01L21/7624
    • An exemplary system and method for providing a microwave regime, frequency-agile device is disclosed as comprising inter alia: a low-loss, insulating substrate (200); a layer of SiO2 (210) over the surface of said substrate; and a layer of BST (220) deposited over the SiO2 layer (210). Disclosed features and specifications may be variously controlled, configured, adapted or otherwise optionally modified to further improve or otherwise optimize frequency response or other material characteristics. Exemplary embodiments of the present invention representatively provide for integrated high-efficiency, low-loss microwave components that may be readily incorporated with existing technologies for the improvement of frequency response, device package form factors, weights and/or other manufacturing, device or material performance metrics.
    • 公开了一种用于提供微波状态的频率敏捷装置的示例性系统和方法,其特别包括:低损耗绝缘基板(200); 在所述衬底的表面上的SiO 2层(210); 以及沉积在SiO 2层(210)上的BST(220)层。 公开的特征和规范可以被不同地控制,配置,适配或以其他方式任意地修改,以进一步改进或以其它方式优化频率响应或其他材料特性。 本发明的示例性实施例代表性地提供了集成的高效率低损耗微波部件,其可以容易地与用于改进频率响应,装置包装形状因子,重量和/或其他制造,装置或材料性能的现有技术结合 指标