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    • 71. 发明申请
    • THERMAL INTERFACE MATERIALS AND METHODS FOR PROCESSING THE SAME
    • 热接口材料及其加工方法
    • US20120292005A1
    • 2012-11-22
    • US13111735
    • 2011-05-19
    • Karen BruzdaRichard F. HillBrian JonesMichael D. Craig
    • Karen BruzdaRichard F. HillBrian JonesMichael D. Craig
    • F28F7/00
    • H01L23/42F28F13/00F28F2013/006F28F2255/00H01L23/3737H01L2924/0002H01L2924/00
    • A thermal interface material is provided for use to fill a gap between surfaces in a thermal transfer system to transfer heat between the surfaces. The thermal interface material includes a base material and thermally conductive particles dispersed within the base material. The thermal interface material is conditioned under reduced pressure (e.g., prior to being placed in the gap between the surfaces, while being placed in the gap, after being placed in the gap, etc.) and, within about forty-eight hours or less of conditioning, the conditioned thermal interface material is either positioned in a container that inhibits ambient gas from contacting it (either alone or applied to the surfaces), or used to transfer heat between the surfaces. As such, the thermal interface material is substantially free of cracks following exposure to thermal cycling comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles.
    • 提供热界面材料用于填充热传递系统中的表面之间的间隙以在表面之间传递热量。 热界面材料包括基材和分散在基材内的导热颗粒。 热界面材料在减压下进行调节(例如,在放置在表面之间的间隙之前,放置在间隙中,放置在间隙中之后),并且在约48小时以内 调节的热界面材料或者被定位在容器中,其阻止环境气体与其接触(单独地或施加到表面),或者用于在表面之间传递热量。 因此,热界面材料在暴露于热循环之后基本上没有裂纹,包括至少约100摄氏度的温度变化至少约10个循环。