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    • 71. 发明授权
    • Method of preparing a sample for transmission electron microscopy
    • 制备透射电子显微镜样品的方法
    • US07649173B2
    • 2010-01-19
    • US11618728
    • 2006-12-29
    • Jianqiang HuZhixian RuiYanli ZhaoYanjun WangMing LiMin Pan
    • Jianqiang HuZhixian RuiYanli ZhaoYanjun WangMing LiMin Pan
    • G01N23/00G21K7/00
    • G01N1/32
    • A method for preparing TEM sample, comprising the following steps: providing a sample with two pits and a failure region between the two pits, the failure region comprising a semiconductor device; milling the first surface of the failure region, till the cross section of the semiconductor device is exposed; etching the first surface of the failure region; cleaning the sample; milling the second surface of the failure region, till the failure region can be passed by electron beam. A sample can be prepared for a high resolution TEM through above steps. When the sample is observed, it is easy to distinguish the lightly doped drain, source/drain regions from the silicon substrate and observe the pattern and defects in the lightly doped drain, source/drain regions clearly; in addition, it is easy to distinguish the BPSG from the non-doped silicon dioxide in the failure region.
    • 一种制备TEM样品的方法,包括以下步骤:提供具有两个凹坑的样品和两个凹坑之间的失效区域,所述失效区域包括半导体器件; 铣削故障区域的第一表面,直到半导体器件的横截面露出; 蚀刻失效区域的第一表面; 清洗样品; 铣削失效区域的第二表面,直到失效区域可以通过电子束。 可以通过上述步骤制备用于高分辨率TEM的样品。 当观察样品时,很容易区分轻掺杂漏极,源极/漏极区域与硅衬底,并清楚地观察到轻掺杂漏极,源极/漏极区域中的图案和缺陷; 此外,在故障区域中容易区分BPSG和非掺杂二氧化硅。
    • 72. 发明申请
    • Method for Treatment of Samples for Auger Electronic Spectrometer (AES) in the Manufacture of Integrated Circuits
    • 用于俄罗斯电子光谱仪(AES)在集成电路制造中的处理方法
    • US20090305440A1
    • 2009-12-10
    • US12364977
    • 2009-02-03
    • Qi Hau ZhangMing LiChorng Shyr NiouScott Liao
    • Qi Hau ZhangMing LiChorng Shyr NiouScott Liao
    • H01L21/66C23C14/34
    • G01N23/2276H01L22/12
    • A method for analyzing a sample for the manufacture of integrated circuits, e.g. MOS transistors, application specific integrated circuits, memory devices, microprocessors, system on a chip. The method includes providing an integrated circuit chip, which has a surface area with at least one region of interest, e.g., bond pad. The method includes covering a first portion of the surface area including the region of interest using a blocking material. The method also forms a metal layer on a second portion of the surface area, while the blocking material protects the first portion. The method removes the blocking material to expose the first portion of the surface area including the region of interest. The method also subjects the metal layer to a voltage differential to draw away one or more charged particles from the first portion of the surface area. The method also subjects the surface area including the region of interest to spectrometer analysis.
    • 用于分析用于制造集成电路的样品的方法,例如, MOS晶体管,专用集成电路,存储器件,微处理器,片上系统。 该方法包括提供集成电路芯片,其具有至少一个感兴趣区域的表面区域,例如接合焊盘。 该方法包括使用阻挡材料覆盖包括感兴趣区域的表面区域的第一部分。 该方法还在表面区域的第二部分上形成金属层,而阻挡材料保护第一部分。 该方法去除阻挡材料以暴露包括感兴趣区域的表面区域的第一部分。 该方法还使金属层进行电压差以从表面区域的第一部分抽出一个或多个带电粒子。 该方法还将包括感兴趣区域的表面区域进行光谱仪分析。
    • 78. 发明申请
    • Methods of Forming Integrated Circuit Devices Including a Depletion Barrier Layer at Source/Drain Regions
    • 形成集成电路器件的方法包括在源极/漏极区域的耗尽屏障层
    • US20080233701A1
    • 2008-09-25
    • US12131437
    • 2008-06-02
    • Ming Li
    • Ming Li
    • H01L21/336
    • H01L29/66628H01L21/26586H01L29/0653H01L29/1083H01L29/41775H01L29/66545H01L29/66636
    • Integrated circuit devices include an integrated circuit substrate having a channel region therein. A gate pattern is disposed on a top surface of the channel region. A depletion barrier layer covers a surface of the integrated circuit substrate adjacent opposite sides of the gate pattern and extending along a portion of a lateral face of the channel region. A source/drain layer is disposed on the depletion barrier layer and electrically contacting the lateral face of the channel region in a region not covered by the depletion barrier layer. The channel region may protrude from a surface of the substrate. The depletion barrier layer may be an L-shaped depletion barrier layer and the device may further include a device isolation layer disposed at a predetermined portion of the substrate through the source/drain layer and the depletion barrier layer. The depletion barrier layer and the device isolation layer may be formed of the same material.
    • 集成电路器件包括其中具有沟道区的集成电路衬底。 栅极图案设置在沟道区域的顶表面上。 耗尽屏障层覆盖与栅极图案的相对侧相邻的集成电路基板的表面,并且沿沟道区域的侧面的一部分延伸。 源极/漏极层设置在耗尽阻挡层上并与未被耗尽阻挡层覆盖的区域中的沟道区域的侧面电接触。 沟道区域可以从衬底的表面突出。 耗尽阻挡层可以是L形耗尽阻挡层,并且该器件还可以包括通过源/漏层和耗尽阻挡层设置在衬底的预定部分处的器件隔离层。 耗尽阻挡层和器件隔离层可以由相同的材料形成。
    • 79. 发明授权
    • Multi bridge channel field effect transistors with nano-wire channels and methods of manufacturing the same
    • 具有纳米线通道的多桥通道场效应晶体管及其制造方法相同
    • US07427788B2
    • 2008-09-23
    • US11259473
    • 2005-10-26
    • Ming LiSung-min Kim
    • Ming LiSung-min Kim
    • H01L29/80
    • H01L29/78696B82Y10/00H01L29/0665H01L29/0673H01L29/1029H01L29/42392H01L29/66545H01L29/66772H01L29/78654
    • A field effect transistor (FET) includes spaced apart source and drain regions disposed on a substrate and at least one pair of elongate channel regions disposed on the substrate and extending in parallel between the source and drain regions. A gate insulating region surrounds the at least one pair of elongate channel regions, and a gate electrode surrounds the gate insulating region and the at least one pair of elongate channel regions. Support patterns may be interposed between the semiconductor substrate and the source and drain regions. The elongate channel regions may have sufficiently small cross-section to enable complete depletion thereof. For example, a width and a thickness of the elongate channel regions may be in a range from about 10 nanometers to about 20 nanometers. The elongate channel regions may have rounded cross-sections, e.g., each of the elongate channel regions may have an elliptical cross-section. The at least one pair of elongate channel regions may include a plurality of stacked pairs of elongate channel regions.
    • 场效应晶体管(FET)包括设置在衬底上的间隔开的源极和漏极区域以及设置在衬底上并在源区域和漏极区域之间并联延伸的至少一对细长沟道区域。 栅极绝缘区域围绕至少一对细长沟道区域,并且栅极电极围绕栅极绝缘区域和至少一对细长沟道区域。 支撑图案可以插入在半导体衬底和源极和漏极区之间。 细长通道区域可以具有足够小的横截面以使其能够完全消耗。 例如,细长沟道区的宽度和厚度可以在约10纳米至约20纳米的范围内。 细长通道区域可以具有圆形横截面,例如每个细长通道区域可以具有椭圆形横截面。 所述至少一对细长通道区域可以包括多个堆叠的细长通道区域对。
    • 80. 发明授权
    • Integrated circuit devices including an L-shaped depletion barrier layer adjacent opposite sides of a gate pattern and methods of forming the same
    • 集成电路器件包括邻近栅极图案的相对侧的L形耗尽阻挡层及其形成方法
    • US07396730B2
    • 2008-07-08
    • US11000260
    • 2004-11-30
    • Ming Li
    • Ming Li
    • H01L21/336
    • H01L29/66628H01L21/26586H01L29/0653H01L29/1083H01L29/41775H01L29/66545H01L29/66636
    • Integrated circuit devices include an integrated circuit substrate having a channel region therein. A gate pattern is disposed on a top surface of the channel region. A depletion barrier layer covers a surface of the integrated circuit substrate adjacent opposite sides of the gate pattern and extending along a portion of a lateral face of the channel region. A source/drain layer is disposed on the depletion barrier layer and electrically contacting the lateral face of the channel region in a region not covered by the depletion barrier layer. The channel region may protrude from a surface of the substrate. The depletion barrier layer may be an L-shaped depletion barrier layer and the device may further include a device isolation layer disposed at a predetermined portion of the substrate through the source/drain layer and the depletion barrier layer. The depletion barrier layer and the device isolation layer may be formed of the same material.
    • 集成电路器件包括其中具有沟道区的集成电路衬底。 栅极图案设置在沟道区域的顶表面上。 耗尽屏障层覆盖与栅极图案的相对侧相邻的集成电路基板的表面,并且沿沟道区域的侧面的一部分延伸。 源极/漏极层设置在耗尽阻挡层上并与未被耗尽阻挡层覆盖的区域中的沟道区域的侧面电接触。 沟道区域可以从衬底的表面突出。 耗尽阻挡层可以是L形耗尽势垒层,并且该器件还可以包括通过源/漏层和耗尽阻挡层设置在衬底的预定部分处的器件隔离层。 耗尽阻挡层和器件隔离层可以由相同的材料形成。