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71. 发明授权

US08230588B2 Method of making an electronic device and electronic device substrate 失效
标题翻译：制造电子装置和电子装置基板的方法
公开(公告)号：US08230588B2
公开(公告)日：2012-07-31
申请号：US12553815
申请日：2009-09-03
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
IPC分类号： H05K3/30 , H05K3/02 , H05K3/10
CPC分类号： H01L21/4832 , H01L21/568 , H01L23/3121 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05553 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/0023 , H05K3/007 , H05K3/06 , H05K3/243 , H05K3/284 , H05K2203/0156 , H05K2203/0571 , H05K2203/1469 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of making an electronic device is disclosed. The method includes the steps of providing an electronic device substrate, mounting an electronic part on the electronic device substrate, removing the tape member and the metal film from the electronic device substrate, and forming a conductive structure at a position corresponding to the metal plating layer. The electronic device substrate includes a base material formed of a thin board and the base material includes a tape member, a metal film, a release layer, a metal layer, an electrical insulation layer and a metal plating layer filled in the plurality of openings.
摘要翻译：公开了一种制造电子设备的方法。该方法包括以下步骤：提供电子器件基板，将电子部件安装在电子器件基板上，从电子器件基板去除带状部件和金属膜，以及在对应于金属镀层的位置形成导电结构。电子设备基板包括由薄板形成的基材，并且基材包括填充在多个开口中的带部件，金属膜，剥离层，金属层，电绝缘层和金属镀层。

72. 发明授权

US07880279B2 Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same 有权
标题翻译：用于模制光学半导体的透明环氧树脂组合物和使用其的光学半导体集成电路器件
公开(公告)号：US07880279B2
公开(公告)日：2011-02-01
申请号：US11668974
申请日：2007-01-30
申请人： Kenji Uchida , Koki Hirasawa , Katsumi Shimada , Shinjiro Uenishi , Shinya Ota
发明人： Kenji Uchida , Koki Hirasawa , Katsumi Shimada , Shinjiro Uenishi , Shinya Ota
IPC分类号： H01L23/495
CPC分类号： C08G59/4215 , C08G59/66 , C08G59/686 , H01L24/45 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: R1: a hydrogen atom (—H), an alkyl group, or a phenyl group R2: an alkyl group (—CH3, —C2H5, —C3H7).
摘要翻译：在使用引线框架的光半导体集成电路装置中，用于模制光学半导体的透明环氧树脂组合物含有（A）环氧树脂; （B）固化剂; （C）硫醇; 和（D）由以下化学式1表示的胺类固化催化剂：R1：氢原子（-H），烷基或苯基R2：烷基（-CH3，-C2H5，-C3H7）。

73. 发明授权

US07773353B2 Power supply device, electrically-driven vehicle incorporating power supply device, and method of controlling power supply device 有权
标题翻译：电源装置，配有电源装置的电动车，以及电源装置的控制方法
公开(公告)号：US07773353B2
公开(公告)日：2010-08-10
申请号：US12087681
申请日：2007-02-01
申请人： Kenji Uchida
发明人： Kenji Uchida
IPC分类号： H02H3/00 , H02H9/08 , G01R31/00 , G01R31/08
CPC分类号： G01R31/42 , B60L3/00 , B60L2210/20 , G01R27/025 , H02J7/0027 , Y02T10/7055 , Y02T10/725
摘要： An ECU determines based on a voltage from an insulation resistance decrease detector whether the insulation resistance of a power supply device decreases or not. When a load external to the vehicle is not connected to the power supply device, the ECU sets a determination threshold value for determining that the insulation resistance decreases to a normal first value. On the other hand, when the load external to the vehicle is electrically connected to the power supply device, the ECU sets the determination threshold value to a second value which is lower than the first value, in consideration of an increase in the capacitive component due to a capacitor of a Y-capacitor.
摘要翻译： ECU根据来自绝缘电阻降低检测器的电压来确定电源装置的绝缘电阻是否减小。当车辆外部的负载没有连接到电源装置时，ECU设置用于确定绝缘电阻降低到正常第一值的确定阈值。另一方面，当车辆外部的负载电连接到电源装置时，ECU考虑到电容分量的增加而将确定阈值设置为低于第一值的第二值到Y电容器的电容器。

74. 发明授权

US07705245B2 Electronic device substrate and its fabrication method, and electronic device and its fabrication method 失效
标题翻译：电子器件基板及其制造方法，电子器件及其制造方法
公开(公告)号：US07705245B2
公开(公告)日：2010-04-27
申请号：US11530344
申请日：2006-09-08
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/113 , H01L21/4857 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/32057 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H05K3/0023 , H05K3/007 , H05K3/025 , H05K3/064 , H05K3/244 , H05K3/386 , H05K3/421 , H05K2201/0394 , H05K2201/09472 , H05K2203/0156 , H05K2203/0733 , H01L2924/00012 , H01L2924/00
摘要： An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.
摘要翻译：电子器件基板由薄板加强基板形成; 叠层在所述加强基板上的外部连接布线层，并且包括设置在所述加强基板上的电绝缘体，形成在所述电绝缘体中的开口，设置在所述开口中的第一导体图案和通孔导体，并且彼此一体地形成 ; 以及第二导体图案，其形成在与所述加强基板的所述电绝缘体的相对侧上，并且至少部分地电连接到所述通孔导体。

75. 发明授权

US07672033B2 Light modulating apparatus 失效
标题翻译：光调制装置
公开(公告)号：US07672033B2
公开(公告)日：2010-03-02
申请号：US11700813
申请日：2007-02-01
申请人： Toshiaki Kobayashi , Kenji Uchida , Akira Toyama , Katsuya Ikezawa , Akira Miura , Yasukazu Akasaka
发明人： Toshiaki Kobayashi , Kenji Uchida , Akira Toyama , Katsuya Ikezawa , Akira Miura , Yasukazu Akasaka
IPC分类号： G02B26/00
CPC分类号： G02F1/0327 , G02F1/0123 , H04B10/501
摘要： In a light modulating apparatus of an external modulating type which is used in an optical communication system, there are provided an LN modulator, a light branching circuit, a photoelectric converter, a bias control circuit, a driver for an LN modulator which serves to drive the LN modulator in response to an input electric signal, a capacitor for cutting off DC and low frequency components of the input electric signal, a low frequency component compensating circuit for compensating the DC and low frequency components of the input electric signal, and an adding circuit for adding an output of the bias control circuit and that of the low frequency component compensating circuit and generating a bias control signal of the LN modulator.
摘要翻译：在光通信系统中使用的外调制光调制装置中，设置有LN调制器，光分支电路，光电转换器，偏置控制电路，用于驱动LN调制器的驱动器 LN调制器响应于输入电信号，用于切断DC的电容器和输入电信号的低频分量;用于补偿输入电信号的DC和低频分量的低频分量补偿电路，以及添加用于添加偏置控制电路的输出和低频分量补偿电路的输出的电路，并产生LN调制器的偏置控制信号。

76. 发明申请

US20100025940A1 Metal gasket 有权
标题翻译：金属垫片
公开(公告)号：US20100025940A1
公开(公告)日：2010-02-04
申请号：US12311713
申请日：2007-12-27
申请人： Kenji Uchida , Toru Takasu , Kazuya Yoshijima
发明人： Kenji Uchida , Toru Takasu , Kazuya Yoshijima
IPC分类号： F02F11/00
CPC分类号： F16J15/0825 , F16J2015/085 , F16J2015/0862 , F16J2015/0868 , F16J2015/0875
摘要： The effective utilization of the elasticity of a full bead is prevented from being interfered by a thickness portion of the shim plate by providing a shim plate inside a full bead, thereby a lowering of the follow-up performance to head amplitude at the time of combustion is prevented, and the improvement of the sealability is achieved.A metal gasket 10 includes a pair of bead plates 14 and 14 having a cylinder hole 12 corresponding to a cylinder bore and a full bead 22 surrounding the cylinder hole, a first intermediate plate 18 interposed between the pair of bead plates, and a shim plate 16 interposed between the first intermediate plate and one bead plate in an area around the cylinder hole. The shim plate 16 is disposed to overlap with the full bead 22, and the thickness of a contact portion 19 to contact the shim plate 16 of the first intermediate plate changes in the peripheral direction of the cylinder hole.
摘要翻译：通过在整个焊道内部设置垫板，防止整个焊道的弹性的有效利用被垫片的厚度部分所干扰，从而降低燃烧时的磁头振幅的跟踪性能并且可以实现密封性的提高。金属垫圈10包括一对胎圈板14和14，其具有对应于缸孔的缸孔12和围绕缸孔的全胎22，夹在一对胎圈板之间的第一中间板18和垫板 16插入在第一中间板和一个胎圈板之间的区域中。垫板16设置成与整个胎圈22重叠，并且接触第一中间板的垫板16的接触部分19的厚度在缸孔的周向方向上变化。

77. 发明申请

US20090323299A1 ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKING SAME 失效
标题翻译：电子设备基板，电子设备及其制造方法
公开(公告)号：US20090323299A1
公开(公告)日：2009-12-31
申请号：US12553815
申请日：2009-09-03
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
IPC分类号： H05K7/00 , H05K3/46
CPC分类号： H01L21/4832 , H01L21/568 , H01L23/3121 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05553 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/0023 , H05K3/007 , H05K3/06 , H05K3/243 , H05K3/284 , H05K2203/0156 , H05K2203/0571 , H05K2203/1469 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
摘要翻译：一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。

78. 发明申请

US20090027869A1 Electronic device and method for manufacturing electronic device 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US20090027869A1
公开(公告)日：2009-01-29
申请号：US12213967
申请日：2008-06-26
申请人： Kenji Uchida , Koki Hirasawa
发明人： Kenji Uchida , Koki Hirasawa
IPC分类号： H02B1/01 , B05D5/12
CPC分类号： B29C70/72 , B29C45/14 , B29C45/14639 , H01L21/56 , H01L24/97 , H01L31/0203 , H01L31/18 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： An electronic device is provided with an improved reliability and a reduced contamination in a functional unit of an exposed element, and a method for manufacturing thereof is also provided. An electronic device includes a light receiving element, a frame member composed of a first resin provided so as to surround a photo acceptor unit of the light receiving element, and an encapsulating resin layer composed of a second resin and filling a periphery of the frame member. The photo acceptor unit of the light receiving element is exposed in a space surrounded by the frame member. The upper surface of the frame member and the upper surface of the encapsulating resin layer form a common plane, or the upper surface of the frame member is higher than the upper surface of the encapsulating resin layer.
摘要翻译：电子设备具有提高的可靠性和减少暴露元件的功能单元中的污染，并且还提供了其制造方法。电子设备包括光接收元件，由围绕光接收元件的光接收单元的第一树脂构成的框架元件和由第二树脂构成的封装树脂层，并且填充框架元件的周边。光接收元件的光接收单元在由框架构件包围的空间中露出。框架构件的上表面和封装树脂层的上表面形成公共平面，或者框架构件的上表面高于封装树脂层的上表面。

79. 发明申请

US20070177252A1 Light modulating apparatus 失效
标题翻译：光调制装置
公开(公告)号：US20070177252A1
公开(公告)日：2007-08-02
申请号：US11700813
申请日：2007-02-01
申请人： Toshiaki Kobayashi , Kenji Uchida , Akira Toyama , Katsuya Ikezawa , Akira Miura , Yasukazu Akasaka
发明人： Toshiaki Kobayashi , Kenji Uchida , Akira Toyama , Katsuya Ikezawa , Akira Miura , Yasukazu Akasaka
IPC分类号： G02F1/00
CPC分类号： G02F1/0327 , G02F1/0123 , H04B10/501
摘要： In a light modulating apparatus of an external modulating type which is used in an optical communication system, there are provided an LN modulator, a light branching circuit, a photoelectric converter, a bias control circuit, a driver for an LN modulator which serves to drive the LN modulator in response to an input electric signal, a capacitor for cutting off DC and low frequency components of the input electric signal, a low frequency component compensating circuit for compensating the DC and low frequency components of the input electric signal, and an adding circuit for adding an output of the bias control circuit and that of the low frequency component compensating circuit and generating a bias control signal of the LN modulator.
摘要翻译：在光通信系统中使用的外调制光调制装置中，设置有LN调制器，光分支电路，光电转换器，偏置控制电路，用于驱动LN调制器的驱动器 LN调制器响应于输入电信号，用于切断DC的电容器和输入电信号的低频分量;用于补偿输入电信号的DC和低频分量的低频分量补偿电路，以及添加用于添加偏置控制电路的输出和低频分量补偿电路的输出的电路，并产生LN调制器的偏置控制信号。

80. 发明申请

US20070075880A1 Coding circuit and coding apparatus 审中-公开
标题翻译：编码电路和编码装置
公开(公告)号：US20070075880A1
公开(公告)日：2007-04-05
申请号：US11527546
申请日：2006-09-27
申请人： Kenji Uchida
发明人： Kenji Uchida
IPC分类号： H03M7/34
CPC分类号： H04L27/2096 , H04L27/2075
摘要： Disclosed is a coding circuit including: a data delay unit to delay a second signal as a third signal, the second signal comprising one of two data produced by splitting a data for cording, a first signal comprising the other data; a first arithmetic unit to calculate a logic product of the first signal and a first clock signal as a fourth signal; a second arithmetic unit to calculate the logic product of the third signal and an inverted signal of the first clock signal as a fifth signal; a first holding signal inversion unit to invert an output signal as a sixth signal according to the fourth signal; a second holding signal inversion unit to invert an output signal as a seventh signal according to the fifth signal; and an exclusive OR operation unit to calculate an exclusive OR of the sixth signal and the seventh signal.
摘要翻译：公开了一种编码电路，包括：数据延迟单元，用于将第二信号延迟为第三信号，所述第二信号包括通过分割用于线路的数据产生的两个数据之一，包括其他数据的第一信号; 第一算术单元，用于计算第一信号和第一时钟信号的逻辑积作为第四信号; 第二运算单元，计算第三信号的逻辑积和第一时钟信号的反相信号作为第五信号; 第一保持信号反转单元，用于根据第四信号将作为第六信号的输出信号反相; 第二保持信号反转单元，用于根据第五信号将作为第七信号的输出信号反相; 以及用于计算第六信号和第七信号的异或的异或运算单元。

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