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    • 73. 发明授权
    • Phase change memory programming method without reset over-write
    • 相位改变存储器编程方法,无复位重写
    • US07864566B2
    • 2011-01-04
    • US12166934
    • 2008-07-02
    • Matthew J. BreitwischChung H. Lam
    • Matthew J. BreitwischChung H. Lam
    • G11C11/00G11C7/00
    • G11C13/0069G11C13/0004G11C13/0064G11C2013/0076G11C2013/0078G11C2013/0092
    • A method for programming a phase change memory device that avoids RESET overwrite. The method partially comprised of applying a reset write current pulse through the phase change memory element such that the reset write current pulse produces a voltage drop across the phase change memory element less than a reset threshold voltage and greater than a set threshold voltage. The reset write current pulse writing a RESET state to the phase change memory cell. The method additionally comprised of applying a set write current pulse through the phase change memory element such that the set write current pulse produces a voltage drop across the phase change memory element that is equal to or greater than the reset threshold voltage. The set write current pulse writing a SET state to the phase change memory cell.
    • 一种编程避免RESET重写的相变存储器件的方法。 所述方法部分地包括通过将所述复位写入电流脉冲施加到所述相变存储元件,使得所述复位写入电流脉冲在所述相变存储元件上产生小于复位阈值电压并大于设定阈值电压的电压降。 复位写入电流脉冲将RESET状态写入相变存储单元。 该方法还包括通过相变存储元件施加设置的写入电流脉冲,使得所设置的写入电流脉冲在相变存储器元件上产生等于或大于复位阈值电压的电压降。 该设定的写入电流脉冲将SET状态写入相变存储单元。
    • 80. 发明申请
    • Substrate backgate for trigate FET
    • 基板背板用于触发FET
    • US20080185649A1
    • 2008-08-07
    • US12099211
    • 2008-04-08
    • Brent A. AndersonMatthew J. BreitwischEdward J. Nowak
    • Brent A. AndersonMatthew J. BreitwischEdward J. Nowak
    • H01L29/786H01L21/336
    • H01L29/785H01L21/845H01L27/1211H01L29/66795
    • Disclosed is a tri-gate field effect transistor with a back gate and the associated methods of forming the transistor. Specifically, a back gate is incorporated into a lower portion of a fin. A tri-gate structure is formed on the fin and is electrically isolated from the back gate. The back gate can be used to control the threshold voltage of the FET. In one embodiment the back gate extends to an n-well in a p-type silicon substrate. A contact to the n-well allows electrical voltage to be applied to the back gate. A diode created between the n-well and p-substrate isolates the current flowing through the n-well from other devices on the substrate so that the back gate can be independently biased. In another embodiment the back gate extends to n-type polysilicon layer on an insulator layer on a p-type silicon substrate. A contact to the n-type polysilicon layer allows electrical voltage to be applied to the back gate. A trench isolation structure extending through the polysilicon layer to the insulator layer isolates current flowing through the polysilicon layer from other devices on the silicon substrate.
    • 公开了具有背栅的三栅场效应晶体管和形成晶体管的相关方法。 具体地说,后门结合在翅片的下部。 三栅结构形成在翅片上并与后门电隔离。 背栅可用于控制FET的阈值电压。 在一个实施例中,背栅极延伸到p型硅衬底中的n阱。 与n阱的接触允许将电压施加到后门。 在n阱和p衬底之间产生的二极管将流过n阱的电流与衬底上的其他器件隔离,使得后栅极可以被独立地偏置。 在另一个实施例中,背栅极延伸到p型硅衬底上的绝缘体层上的n型多晶硅层。 与n型多晶硅层的接触允许电压施加到后门。 通过多晶硅层延伸到绝缘体层的沟槽隔离结构将流过多晶硅层的电流与硅衬底上的其它器件隔离。