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    • 73. 发明申请
    • Contactless Plug Detect Mechanism
    • 非接触式检测机构
    • US20100182159A1
    • 2010-07-22
    • US12356567
    • 2009-01-21
    • Stephen Brian LynchFletcher RothkopfGordon Cameron
    • Stephen Brian LynchFletcher RothkopfGordon Cameron
    • G08B7/06
    • H01R13/641H01R24/58H01R2107/00
    • This is directed to systems and methods for detecting the insertion of a plug in a device port without physically contacting the plug. For example, systems and methods are provided for detecting the insertion of an audio plug into an audio jack without using physical contacts placed in the periphery of the audio jack. In some embodiments, an electrically conductive element (e.g., a circuit board trace) can be provided on a surface of the port or within the port wall. When a metallic or conductive plug is inserted into the port, the plug can interact with the conductive element and cause a change in capacitance or induction detected by appropriate circuitry coupled to the conductive element. In some embodiments, an optical sensor can be used to detect a plug placed in a port. In some embodiments, the electronic device can detect distinguishable attributes associated with the contact between the electrical contact of plug and port contacts using an appropriate sensor (e.g., a microphone or an accelerometer).
    • 这涉及用于检测插头插入设备端口而不物理接触插头的系统和方法。 例如,提供了用于检测音频插头插入到音频插孔中而不使用放置在音频插孔周边的物理触点的系统和方法。 在一些实施例中,导电元件(例如,电路板迹线)可以设置在端口的表面或端口壁内。 当金属或导电插头插入端口时,插头可以与导电元件相互作用,并引起电容变化或通过耦合到导电元件的适当电路检测到的感应。 在一些实施例中,可以使用光学传感器来检测放置在端口中的插头。 在一些实施例中,电子设备可以使用适当的传感器(例如,麦克风或加速度计)来检测与插头和端口触点的电触点之间的接触相关联的可区分属性。
    • 77. 发明授权
    • Assembly of a handheld electronic device
    • 装配手持电子设备
    • US09093234B2
    • 2015-07-28
    • US13544812
    • 2012-07-09
    • Stephen Brian LynchPinida Jan MoolsintongLeng Lim
    • Stephen Brian LynchPinida Jan MoolsintongLeng Lim
    • G06F1/16H01H15/10H01H9/02H05K5/00
    • H01H13/10H01H9/0207H01H13/50H01H15/10H01H2223/034H05K5/0013H05K5/0217H05K7/14Y10T29/49995
    • Several mechanical features of an electronic device are provided. In some embodiments, the device may include a bezel coupled to a housing. One or more snaps of the bezel may be operative to engage a cantilever spring of the housing. In some embodiments, the device may include a window that is formed by coupling an outer layer to an inner layer that is larger than the outer layer. In some embodiments, the device may include a chassis for supporting the window. In some embodiments, the device may include a grounding clip for simultaneously grounding the bezel, the housing and a circuit board. In some embodiments, the device may include a switch that includes a button molded into a base using a double shot process. In some embodiments, the device may include a switch supporting bracket that includes a slot operative to receive a pin of the bezel.
    • 提供了电子设备的几个机械特性。 在一些实施例中,设备可以包括联接到壳体的边框。 挡板的一个或多个卡扣可操作以接合壳体的悬臂弹簧。 在一些实施例中,该装置可以包括通过将外层耦合到比外层大的内层形成的窗口。 在一些实施例中,设备可以包括用于支撑窗户的底盘。 在一些实施例中,该装置可以包括接地夹,用于同时接地边框,壳体和电路板。 在一些实施例中,该装置可以包括开关,该开关包括使用双重注射工艺模制成基座的按钮。 在一些实施例中,设备可以包括开关支撑托架,该开关支撑托架包括可操作地接收边框的销的槽。
    • 78. 发明授权
    • Methods for assembling electronic devices using embedded light guide structures
    • 使用嵌入式导光结构组装电子设备的方法
    • US08944659B2
    • 2015-02-03
    • US13401692
    • 2012-02-21
    • Teodor DabovCasey J. FeinsteinDavid A. PakulaStephen Brian Lynch
    • Teodor DabovCasey J. FeinsteinDavid A. PakulaStephen Brian Lynch
    • F21V8/00
    • G02B6/0081C09J5/00C09J2203/318C09J2205/31G02B6/001G02B6/0086G02B6/102
    • Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.
    • 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时,可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分,刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。