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    • 71. 发明申请
    • METHOD TO ELIMINATE RE-CRYSTALLIZATION BORDER DEFECTS GENERATED DURING SOLID PHASE EPITAXY OF A DSB SUBSTRATE
    • 消除DSB基板固体相外延生成的再结晶边界缺陷的方法
    • US20090130817A1
    • 2009-05-21
    • US11941187
    • 2007-11-16
    • Angelo PintoWeize XiongManfred Ramin
    • Angelo PintoWeize XiongManfred Ramin
    • H01L21/762
    • H01L21/187H01L21/02532H01L21/02609H01L21/02667H01L21/76224
    • A method for semiconductor processing provides a DSB semiconductor body having a first crystal orientation, a second crystal orientation, and a border region disposed between the first and second crystal orientations. The border region further has a defect associated with an interface of the first crystal orientation and second the second crystal orientation, wherein the defect generally extends a distance into the semiconductor body from a surface of the body. A sacrificial portion of the semiconductor body is removed from the surface thereof, wherein removing the sacrificial portion at least partially removes the defect. The sacrificial portion can be defined by oxidizing the surface at low temperature, wherein the oxidation at least partially consumes the defect. The sacrificial portion can also be removed by CMP. An STI feature may be further formed over the defect after removal of the sacrificial portion, therein consuming any remaining defect.
    • 一种用于半导体处理的方法提供了具有第一晶体取向,第二晶体取向和设置在第一和第二晶体取向之间的边界区域的DSB半导体本体。 边界区域还具有与第一晶体取向和第二晶体取向的界面相关联的缺陷,其中缺陷通常从身体的表面延伸到半导体本体中的距离。 从其表面去除半导体本体的牺牲部分,其中去除牺牲部分至少部分地去除缺陷。 牺牲部分可以通过在低温下氧化表面来限定,其中氧化至少部分地消耗缺陷。 牺牲部分也可以通过CMP去除。 在去除牺牲部分之后,可以在缺陷上进一步形成STI特征,其中消耗任何剩余的缺陷。
    • 76. 发明申请
    • Method for manufacturing and structure of semiconductor device with sinker contact region
    • 具有沉降片接触区域的半导体器件的制造和结构的方法
    • US20050037588A1
    • 2005-02-17
    • US10939221
    • 2004-09-10
    • Angelo PintoJeffrey BabcockMichael SchoberScott BalsterChristoph Dirnecker
    • Angelo PintoJeffrey BabcockMichael SchoberScott BalsterChristoph Dirnecker
    • H01L21/331H01L29/417H01L27/082H01L21/8222
    • H01L29/66272H01L29/41708
    • A method for manufacturing a semiconductor device includes forming a buried layer of a semiconductor substrate. An active region is formed adjacent at least a portion of the buried layer. A first isolation structure is formed adjacent at least a portion of the buried layer. A second isolation structure is formed adjacent at least a portion of the active region. A base layer is formed adjacent at least a portion of the active region. A dielectric layer is formed adjacent at least a portion of the base layer, and then at least part of the dielectric layer is removed at an emitter contact location and at a sinker contact location. An emitter structure is formed at the emitter contact location. Forming the emitter structure includes etching the semiconductor device at the sinker contact location to form a sinker contact region. The sinker contact region has a first depth. The method may also include forming a gate structure. Forming the gate structure includes etching the sinker contact region thereby increasing the first depth of the sinker contact region to a second depth.
    • 半导体器件的制造方法包括形成半导体衬底的掩埋层。 在掩埋层的至少一部分附近形成有源区。 在掩埋层的至少一部分附近形成第一隔离结构。 在活性区域的至少一部分附近形成第二隔离结构。 在活性区域的至少一部分附近形成基底层。 在基底层的至少一部分附近形成电介质层,然后在发射极接触位置和沉降片接触位置移除介电层的至少一部分。 发射极结构形成在发射极接触位置。 形成发射极结构包括在沉降片接触位置蚀刻半导体器件以形成沉降片接触区域。 沉降片接触区域具有第一深度。 该方法还可以包括形成栅极结构。 形成栅极结构包括蚀刻沉降片接触区域,从而将沉降片接触区域的第一深度增加到第二深度。