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    • 71. 发明申请
    • MULTI-GATED, HIGH-MOBILITY, DENSITY IMPROVED DEVICES
    • 多层,高移动,密度改进的设备
    • US20090197382A1
    • 2009-08-06
    • US12023347
    • 2008-01-31
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L21/336
    • H01L21/26513H01L21/26546H01L21/26586H01L21/845H01L29/66803H01L29/785
    • Disclosed herein are embodiments of an improved method of forming p-type and n-type MUGFETs with high mobility crystalline planes in high-density, chevron-patterned, CMOS devices. Specifically, semiconductor fins are formed in a chevron layout oriented along the centerline of a wafer. Gates are formed adjacent to the semiconductor fins such that they are approximately perpendicular to the centerline. Then, masked implant sequences are performed, during which halo and/or source/drain dopants are implanted into the sidewalls of the semiconductor fins on one side of the chevron layout and then into the sidewalls of the semiconductor fins on the opposite side of the chevron layout. The implant direction used during these implant sequences is substantially orthogonal to the gates in order to avoid mask shadowing, which can obstruct dopant implantation when separation between the semiconductor fins in the chevron layout is scaled (i.e., when device density is increased).
    • 本文公开了在高密度,人字纹图案化的CMOS器件中形成具有高迁移率晶面的p型和n型MUGFET的改进方法的实施方案。 具体地,半导体散热片形成为沿着晶片的中心线定向的人字形布局。 门形成在半导体翅片附近,使得它们大致垂直于中心线。 然后,进行掩蔽的植入序列,在此期间将卤素和/或源极/漏极掺杂剂注入到人字形布局的一侧上的半导体鳍片的侧壁中,然后进入人字纹相反侧的半导体鳍片的侧壁 布局。 在这些植入序列期间使用的植入方向基本上与栅极正交,以避免掩模阴影,当阴影布局中的半导体鳍片之间的间隔被缩放时(即,当器件密度增加时),这可能阻碍掺杂剂注入。
    • 72. 发明授权
    • Low-capacitance contact for long gate-length devices with small contacted pitch
    • 具有小接触间距的长栅极长度器件的低电容接触
    • US07569897B2
    • 2009-08-04
    • US11767635
    • 2007-06-25
    • Brent A. AndersonEdward J. Nowak
    • Brent A. AndersonEdward J. Nowak
    • H01L29/76
    • H01L29/785H01L21/823431H01L21/823456H01L27/088H01L27/0886H01L27/1211H01L29/41791H01L29/66795H01L2029/7858
    • Disclosed are planar and non-planar field effect transistor (FET) structures and methods of forming the structures. The structures comprise segmented active devices (e.g., multiple semiconductor fins for a non-planar transistor or multiple semiconductor layer sections for a planar transistor) connected at opposite ends to source/drain bridges. A gate electrode is patterned on the segmented active devices between the source/drain bridges such that it has a reduced length between the segments (i.e., between the semiconductor fins or sections). Source/drain contacts land on the source/drain bridges such that they are opposite only those portions of the gate electrode with the reduced gate length. These FET structures can be configured to simultaneously maximize the density of the transistor, minimize leakage power and maintain the parasitic capacitance between the source/drain contacts and the gate conductor below a preset level, depending upon the performance and density requirements.
    • 公开了平面和非平面场效应晶体管(FET)结构和形成结构的方法。 这些结构包括在源极/漏极桥两端连接的分段有源器件(例如,用于非平面晶体管的多个半导体鳍片或用于平面晶体管的多个半导体层部分)。 在源极/漏极桥之间的分段有源器件上图案化栅电极,使得栅极电极在段之间(即,半导体鳍片或部分之间)具有减小的长度。 源极/漏极接触器接地在源/漏极桥上,使得它们仅与具有减小的栅极长度的栅电极的那些部分相对。 这些FET结构可以被配置为同时使晶体管的密度最大化,从而使漏极功率最小化,并且将源极/漏极触点和栅极导体之间​​的寄生电容保持在预定值以下,这取决于性能和密度要求。
    • 74. 发明申请
    • TUNABLE CAPACITOR
    • TUNABLE电容器
    • US20090108320A1
    • 2009-04-30
    • US11923864
    • 2007-10-25
    • Corey K. BarrowsJoseph A. IadanzaEdward J. NowakDouglas W. StoutMark S. Styduhar
    • Corey K. BarrowsJoseph A. IadanzaEdward J. NowakDouglas W. StoutMark S. Styduhar
    • H01L29/94
    • H01L29/94
    • Disclosed are embodiments of a design structure transistor that operates as a capacitor and an associated method of tuning capacitance within such a capacitor. The embodiments of the capacitor comprise a field effect transistor with front and back gates above and below a semiconductor layer, respectively. The capacitance value exhibited by the capacitor can be selectively varied between two different values by changing the voltage condition in a source/drain region of the transistor, e.g., using a switch or resistor between the source/drain region and a voltage supply. Alternatively, the capacitance value exhibited by the capacitor can be selectively varied between multiple different values by changing voltage conditions in one or more of multiple channel regions that are flanked by multiple source/drain regions within the transistor. The capacitor will exhibit different capacitance values depending upon the conductivity in each of the channel regions.
    • 公开了作为电容器操作的设计结构晶体管的实施例以及在这种电容器内调谐电容的相关方法。 电容器的实施例包括分别在半导体层上方和下方具有前栅极和后栅极的场效应晶体管。 通过改变晶体管的源极/漏极区域中的电压条件,例如使用源极/漏极区域和电压源之间的开关或电阻器,可以通过改变晶体管的源极/ 或者,可以通过改变在晶体管内侧面有多个源极/漏极区域的多个沟道区域中的一个或多个中的电压条件来选择性地在多个不同值之间变化由电容器呈现的电容值。 根据每个通道区域中的电导率,电容器将呈现不同的电容值。
    • 76. 发明授权
    • Integrated circuit having pairs of parallel complementary FinFETs
    • 具有成对的并联互补FinFET的集成电路
    • US07517806B2
    • 2009-04-14
    • US11186748
    • 2005-07-21
    • Andres BryantWilliam F. Clark, Jr.David M. FriedMark D. JaffeEdward J. NowakJohn J. PekarikChristopher S. Putnam
    • Andres BryantWilliam F. Clark, Jr.David M. FriedMark D. JaffeEdward J. NowakJohn J. PekarikChristopher S. Putnam
    • H01L21/302
    • H01L21/84H01L21/3086H01L21/3088H01L21/823821H01L27/1203H01L29/66795H01L29/785Y10S438/947
    • A method and structure for an integrated circuit structure that utilizes complementary fin-type field effect transistors (FinFETs) is disclosed. The invention has a first-type of FinFET which includes a first fin, and a second-type of FinFET which includes a second fin running parallel to the first fin. The invention also has an insulator fin positioned between the source/drain regions of the first first-type of FinFET and the second-type of FinFET. The insulator fin has approximately the same width dimensions as the first fin and the second fin, such that the spacing between the first-type of FinFET and the second-type of FinFET is approximately equal to the width of one fin. The invention also has a common gate formed over channel regions of the first-type of FinFET and the second-type of FinFET. The gate includes a first impurity doping region adjacent the first-type of FinFET and a second impurity doping region adjacent the second-type of FinFET. The differences between the first impurity doping region and the second impurity doping region provide the gate with different work functions related to differences between the first-type of FinFET and the second-type of FinFET. The first fin and the second fin have approximately the same width.
    • 公开了利用互补翅片型场效应晶体管(FinFET)的集成电路结构的方法和结构。 本发明具有包括第一鳍片的第一类型的FinFET和包括与第一鳍片平行的第二鳍片的第二类型的FinFET。 本发明还具有位于第一第一类型FinFET的源极/漏极区域和第二类型FinFET之间的绝缘体鳍片。 绝缘体鳍片具有与第一鳍片和第二鳍片大致相同的宽度尺寸,使得第一类型的FinFET和第二类型的FinFET之间的间隔大致等于一个鳍片的宽度。 本发明还具有形成在第一类型FinFET和第二类型FinFET的沟道区上的公共栅极。 栅极包括与第一类型的FinFET相邻的第一杂质掺杂区域和与第二类型的FinFET相邻的第二杂质掺杂区域。 第一杂质掺杂区域和第二杂质掺杂区域之间的差异为栅极提供与第一类型FinFET和第二类型FinFET之间的差异有关的不同功函数。 第一鳍片和第二鳍片具有大致相同的宽度。
    • 77. 发明申请
    • IMAGERS HAVING ELECTRICALLY ACTIVE OPTICAL ELEMENTS
    • 具有电动活性光学元件的图像
    • US20090065834A1
    • 2009-03-12
    • US11850798
    • 2007-09-06
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. Nowak
    • Brent A. AndersonJohn J. Ellis-MonaghanEdward J. Nowak
    • H01L27/146
    • H01L27/14636H01L27/14625
    • A CMOS image sensor comprising an array of active pixel cells. Each active pixel cell includes a substrate; a photosensing device formed at or below a substrate surface for collecting charge carriers in response to incident light; and, one or more light transmissive conductive wire structures formed above the photosensing device, the one or more conductive wire structures being located in an optical path above the photosensing device. The formed light transmissive conductive wire structures provide both an electrical and optical functions. An optical function is provided by tailoring the thickness of the conductive wire layer to filter light according to a pixel color scheme. Alternately, the light transmissive conductive wire structures may be formed as a microlens structure providing a light focusing function. Electrical functions for the conductive wire layer include use as a capacitor plate, as a resistor or as an interconnect.
    • 一种包括有源像素单元阵列的CMOS图像传感器。 每个有源像素单元包括衬底; 形成在基板表面处或下方的光敏装置,用于响应于入射光收集电荷载体; 以及形成在光敏器件上方的一个或多个透光导线结构,所述一个或多个导电线结构位于光敏器件上方的光路中。 形成的透光导线结构提供电和光学功能。 通过根据像素配色方案调整导线层的厚度以过滤光,提供光学功能。 或者,透光导线结构可以形成为提供光聚焦功能的微透镜结构。 用于导线层的电气功能包括用作电容器板,电阻器或互连件。