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    • 74. 发明授权
    • Display device and manufacturing method of the same
    • 显示装置及其制造方法相同
    • US08477251B2
    • 2013-07-02
    • US11939155
    • 2007-11-13
    • Sang-Hun LeeByoung-Joo KimChul HuhGwan-Soo Kim
    • Sang-Hun LeeByoung-Joo KimChul HuhGwan-Soo Kim
    • G02F1/1335
    • G06F3/0412G02F1/13338G02F1/1362G03F1/00G03F7/0005
    • A display device includes a first substrate including pixels and sensing electrodes corresponding with the pixels, and a second substrate facing the first substrate. The second substrate includes an organic layer with a black matrix dividing the pixels and a sensing spacer opposite to the sensing electrode. The organic layer including the black matrix and the sensing spacer may be formed in a single process using organic photoresist material. A mask includes a light-intercepting pattern including slits to block a portion of ultraviolet light emitted towards a photoresist layer to form the black matrix. The mask also includes a pattern to block ultraviolet light in a region corresponding to the sensing spacer if a negative type photoresist material is used, or the mask does not block ultraviolet light in the region corresponding to the sensing spacer if a positive type photoresist material is used.
    • 显示装置包括:第一基板,包括像素和与像素相对应的检测电极;以及面向第一基板的第二基板。 第二基板包括具有黑色矩阵分割像素的有机层和与感测电极相对的感测间隔件。 包括黑矩阵和传感间隔物的有机层可以使用有机光致抗蚀剂材料在单一工艺中形成。 掩模包括遮光图案,其包括狭缝以阻挡向光致抗蚀剂层发射的紫外光的一部分以形成黑矩阵。 如果使用负型光致抗蚀剂材料,掩模还包括阻挡紫外光的图案,如果使用负型光致抗蚀剂材料,或者如果正型光致抗蚀剂材料为 用过的。
    • 80. 发明授权
    • Semiconductor packaging method
    • 半导体封装方法
    • US6153141A
    • 2000-11-28
    • US155881
    • 1993-11-23
    • Jong Kyung KimDong Jin MoakChang Hun HyumChul Huh
    • Jong Kyung KimDong Jin MoakChang Hun HyumChul Huh
    • B29C31/04B29C45/02H01L21/56B29C31/08B29C33/02
    • B29C31/041B29C45/02H01L21/56H01L2924/0002
    • A container (10), which holds a molding material (12), is attached to a mold. The molding material passes from the container to the mold through an orifice (18) during the molding process. The container is gradiently heated with the hottest part of the container near the orifice, the heat gradually decreasing towards the opposite end of the container. The hotter molding material deforms faster than the cooler material and as the plastic is forced into the mold, the air escapes past the molding material along the container walls in the direction of the cooler material. A mechanism (16), preferably a narrow ram having a slightly conical shape (22), forces the molding material into the mold. The conical shape allows the air to pass by the mechanism out the end of the container opposite the orifice.
    • 将保持成型材料(12)的容器(10)附接到模具。 成型材料在模制过程中通过孔口(18)从容器通过模具。 容器与容器的最热部分靠近孔口进行梯度加热,热量朝着容器的相对端逐渐减小。 较热的成型材料比较冷的材料变得更快,当塑料被迫进入模具时,空气沿冷却器材料的方向沿容器壁逸出模制材料。 机构(16)优选地具有略微圆锥形状(22)的窄柱塞迫使模制材料进入模具。 锥形形状允许空气通过机构从与孔相对的容器的端部出来。