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    • 75. 发明授权
    • Method of manufacturing optical waveguide device
    • 制造光波导器件的方法
    • US06932880B2
    • 2005-08-23
    • US10166378
    • 2002-06-11
    • Yukitoshi InuiKuniyoshi KondoManabu KagamiTatsuya YamashitaAkari KawasakiHiroshi Ito
    • Yukitoshi InuiKuniyoshi KondoManabu KagamiTatsuya YamashitaAkari KawasakiHiroshi Ito
    • G02B6/13G02B6/138G02B6/34G02B6/26
    • G02B6/138G02B6/29362
    • Transparent parallel planar plates which are members for retaining an optical waveguide are provided erectly in an optical path of light in a transparent vessel in advance. An optical fiber is fixed into the transparent vessel while the optical fiber penetrates the transparent vessel, and an optical sensor is also disposed adjustably. Next, a first photo-curable resin solution is injected into the transparent vessel, and light with a predetermined wavelength for curing is emitted from the optical fiber so that the optical waveguide is self-formed by polymerization reaction. Because the parallel planar plates are transparent, the optical waveguide is formed so as to be extended again from the emission ports of the parallel planar plates. Finally, the optical waveguide is formed so as to reach a bottom surface of the transparent vessel. The optical waveguide has a structure in which the optical waveguide is firmly supported at four points in a forward end surface of the optical fiber, the parallel planar plates and the bottom surface of the transparent vessel. Accordingly, a firm optical waveguide device is formed.
    • 用于保持光波导的构件的透明平行平板预先在透明容器的光路中直立设置。 光纤固定在透明容器中,同时光纤穿透透明容器,光学传感器也可调整地设置。 接着,将第一光固化树脂溶液注入到透明容器中,从光纤射出固化用的规定波长的光,使得光波导通过聚合反应自成型。 由于平行平板是透明的,所以光波导形成为从平行平板的发射端口再次延伸。 最后,形成光波导以到达透明容器的底面。 光波导具有这样的结构,其中光波导被牢固地支撑在光纤的前端表面,平行平板和透明容器的底表面的四个点处。 因此,形成牢固的光波导装置。
    • 79. 发明授权
    • Logic emulation module and logic emulation board
    • 逻辑仿真模块和逻辑仿真板
    • US06829574B1
    • 2004-12-07
    • US09328800
    • 1999-06-09
    • Hiroshi ItoAkira YamagiwaNobuaki EjimaRyoichi KuriharaMasakazu SakaueYasuhiro Uemura
    • Hiroshi ItoAkira YamagiwaNobuaki EjimaRyoichi KuriharaMasakazu SakaueYasuhiro Uemura
    • G06F9455
    • G06F17/5027H01L2224/16H01L2924/13091H01L2924/00
    • Disclosed herein is an improved logic module used for logic emulation along with an enhanced logic emulation board subject to logic verification. The logic module has a plurality of programmable LSIs capable of programming logic and a plurality of switching LSIs capable of programming connections, the LSIs being mounted on one or both sides of a board. Peripheral portions of the board carry connectors for electrical connection to the outside. There are two types of data lines: those directly coupling the connectors to the programmable LSIs, and those linking the connectors to the programmable LSIs via the switching LSIs. The programmable and switching LSIs constitute a crossbar connection arrangement. The logic emulation board has connectors for connection to a logic emulation module, and lands for supporting LSIs targeted for development. Pins of the connectors and the lands are interconnected on a one-to-one basis. Also disclosed here is an upgraded module structure permitting a multiple-stage module setup together with an advanced cooling structure for modules.
    • 这里公开了一种用于逻辑仿真的改进的逻辑模块以及经过逻辑验证的增强型逻辑仿真板。 逻辑模块具有能够编程逻辑的多个可编程LSI和能够编程连接的多个开关LSI,LSI安装在板的一侧或两侧。 板的外围部分携带用于与外部电连接的连接器。 有两种类型的数据线:将连接器直接耦合到可编程LSI的数据线,以及通过开关LSI将连接器连接到可编程LSI的那些。 可编程和开关式LSI构成了一种交叉连接装置。 逻辑仿真板具有用于连接到逻辑仿真模块的连接器,并且用于支持用于开发的LSI的接地。 连接器和焊盘的引脚是以一对一的方式相互连接的。 这里还公开了一种升级的模块结构,允许多级模块与模块的先进冷却结构一起设置。