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    • 73. 发明专利
    • PATTERN FORMING METHOD AND THIN-FILM MAGNETIC HEAD FORMED BY USING THIS METHOD
    • JPH03277786A
    • 1991-12-09
    • JP7686990
    • 1990-03-28
    • HITACHI LTD
    • TAKEMOTO KAZUNARIAMATATSU ATSUSHIKITO MAKOTO
    • C23C14/12C23C14/04C23F4/00G11B5/31
    • PURPOSE:To uniformize the thickness of the resist film within a surface to be processed and to form high-accuracy patterns by forming a resist on a substrate having a large difference in height within the surface to be processed by a vapor deposition polymn. method and subjecting the resist to dry etching after exposing and developing. CONSTITUTION:The vapor deposited and polymerized film 1 having photosensitiveness is formed as the resist on the thin film 2 to be processed on the substrate having the large difference in height. This vapor deposited and polymerized film 1 is formed by bringing a monomer introduced in a vapor state in a vacuum chamber into a polymn. reaction on the substrate and is formed to a uniform thickness in the tall, low and sloped parts of stepped parts. Desired patterns are baked to this vapor deposited and polymerized film 1 and are developed after exposing, by which the resist patterns are formed. The resist patterns are transferred onto the thin film 2 to be processed by the dry process etching essentially consisting of a physical sputtering method, such as ion milling. The high-accuracy patterns are formed in this way. The thin-film magnetic head having the good sectional shape obtd. by patterning the magnetic material of track parts is obtd. by using the above-mentioned pattern forming method.