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    • 72. 发明申请
    • Light emitting diode package element with internal meniscus for bubble free lens placement
    • 具有内部半月板的发光二极管封装元件,用于无泡沫透镜放置
    • US20080026498A1
    • 2008-01-31
    • US11496918
    • 2006-07-31
    • Eric TarsaThomas C. YuanMaryanne BecerraPraveen Yadev
    • Eric TarsaThomas C. YuanMaryanne BecerraPraveen Yadev
    • H01L21/00
    • H01L33/58H01L33/52H01L2224/48091H01L2924/00014
    • A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a portion having a radius of curvature larger than the liquid encapsulant. The larger radius of curvature portion of the optical element is brought into contact with the liquid encapsulant. The optical element is then moved closer to the LED chip, growing the contact area between said optical element and said liquid encapsulant. The liquid encapsulant is then cured. A light emitting diode comprising a substrate with an LED chip mounted to it. A meniscus ring is on the substrate around the LED chip with the meniscus ring having a meniscus holding feature. An inner encapsulant is provided over the LED chip with the inner encapsulant having a contacting surface on the substrate, with the meniscus holding feature which defines the edge of the contacting surface. An optical element is included having a bottom surface with at least a portion that is concave. The optical element is arranged on the substrate with the concave portion over the LED chip. A contacting encapsulant is included between the inner encapsulant and optical element.
    • 一种用于制造发光二极管(LED)封装的方法,包括提供LED芯片并且用具有曲率半径的液体密封剂覆盖所述LED芯片的至少一部分。 提供一种具有底表面的光学元件,其具有至少一部分具有比液体密封剂大的曲率半径的部分。 光学元件的较大的曲率半径部分与液体密封剂接触。 然后将光学元件移动到更靠近LED芯片,增加所述光学元件和所述液体密封剂之间的接触面积。 然后固化液体密封剂。 一种发光二极管,包括安装有LED芯片的基板。 半月板环位于LED芯片周围的基板上,弯液面具有弯月面保持特征。 内部密封剂设置在LED芯片上,内部密封剂在基底上具有接触表面,其中弯月面保持特征限定接触表面的边缘。 包括具有至少一部分凹陷的底表面的光学元件。 光学元件布置在基板上,其中凹部在LED芯片上。 内密封剂和光学元件之间包括接触密封剂。