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    • 72. 发明专利
    • SEMICONDUCTOR LASER AND ITS FABRICATION METHOD
    • JPH09214063A
    • 1997-08-15
    • JP4026396
    • 1996-02-05
    • FURUKAWA ELECTRIC CO LTD
    • IWAI NORIHIROKASUKAWA AKIHIKO
    • H01S3/093H01S5/00H01S3/18
    • PROBLEM TO BE SOLVED: To provide a semiconductor laser and its fabrication method wherein a stepped part is formed on each substrate surface for supporting each of an active region and a mode field region, both substrate surfaces are in a (100) plane, and a slant surface connecting the substrate surfaces forms each of different conductivity type slope surfaces at least a specific angle in the direction (111) A from the substrate surface supporting the active region. SOLUTION: A surface of a p-InP substrate 11 that uses a lattice surface (100) as the substrate surface is etched to form a recessed part, a side wall of which is formed into a slant 11C forming a (311) A surface being a crystal surface parallel to an orientation flat. The slant 11C is constructed at this time to have an off angle of 10 degree or more with respect to the lattice surface (100). A pair of strip shaped SiO2 films are formed ON the first substrate surface 11A. This is used as a mask for selective growth. A semiconductor layer composed of a cladding layer 12, a quantum well active layer 13, and a cladding layer is formed on an exposed surface where the strip-shaped SiO2 films are not formed. At this time, Zn and Se are simultaneosuly doped. Hereby, the cladding layer is formed only on the slope, and can be formed simultaneously.
    • 74. 发明专利
    • SEMICONDUCTOR LASER DEVICE
    • JPH09129979A
    • 1997-05-16
    • JP28695795
    • 1995-11-06
    • FURUKAWA ELECTRIC CO LTD
    • IWAI NORIHIROKASUKAWA AKIHIKO
    • H01S3/139H01S5/00H01S5/068H01S3/18H01S3/133
    • PROBLEM TO BE SOLVED: To obtain a semiconductor laser device the oscillation wavelength of which does not change even when the temperature of an active layer fluctuates by installing a reflecting mirror the reflectivity of which drops as the temperature rises to at least one of the end faces of a resonator. SOLUTION: In a semiconductor laser device, a reflecting mirror the reflectivity of which drops as the temperature rises is installed to at least one of the end faces of a resonator. The reflecting mirror having such a characteristic is an interference type wavelength filter, in principle. In the filter, high-refractive index layers 211, 213, 215, and 217 and low-refractive index layers 212, 214, 216, and 218 are laminated upon another in this order and the thicknesses of the high-and low refractive index layers are respectively set at λ/4n1 and λ/4n2 (where, λ, n1 , and n2 respectively represent the oscillation wavelength, refractive index of the high-refractive index layers, and refractive index of the low- refractive index layers). However, only the thickness of the layer 214 which is contained in the laminated body of the low-refractive index layers is set at λ/2n2 .
    • 77. 发明专利
    • SEMICONDUCTOR LIGHT RECEIVING ELEMENT
    • JPH07106621A
    • 1995-04-21
    • JP24548493
    • 1993-09-30
    • FURUKAWA ELECTRIC CO LTD
    • IWAI NORIHIROOKUBO NORIOIJICHI TETSURO
    • H01L31/10
    • PURPOSE:To obtain a semiconductor light receiving element exhibiting excellent absorption characteristics for a specific laser light, while realizing monolithic structure with an electronic device easily, by laminating an InGaAs quantum well layer having compressive strain and a GaAsP or InGaP barrier layer having tensile strain alternately to form a light absorption layer. CONSTITUTION:A buffer layer 2, a strained quantum well light absorption layer 3, and a window layer 4 are laminated on an n-GaAs substrate 1. The strained quantum well light absorption layer comprises an alternate laminate of 100 layers of In0.28Ga0.72As well layer 3a and GaAs0.44P0.5 barrier layer 3b. The In0.28Ga0.72As well layer 3a is epitaxially grown on the GaAs substrate as a crystal having grating constant higher than that of GaAs. The well layer 3a is applied with compressive strain of 0.2% thus setting the center of absorption band of light receiving element at 1mum or thereabout. On the other hand, the GaAs0.44P0.5 barrier layer 3b is grown epitaxially on the GaAs substrate as a crystal having grating constant lower than that of GaAs and applied with tensile strain of 0.2%.