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    • 71. 发明授权
    • Multi-load thermal regulating system with multiple serial evaporators
    • 具有多个串联蒸发器的多负载热调节系统
    • US06926078B2
    • 2005-08-09
    • US10673149
    • 2003-09-30
    • Abdlmonem H. BeitelmalCullen E. BashChandrakant D. Patel
    • Abdlmonem H. BeitelmalCullen E. BashChandrakant D. Patel
    • F25B5/04F25B49/02H01L23/34H05K7/20F24F3/00
    • H05K7/20381F25B5/04F25B49/022F25B2400/01F25B2600/025F25B2600/21F25B2700/2117H01L23/34H01L2924/0002H01L2924/00
    • A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and a thermostatic expansion valve is utilized to control the flow of refrigerant through the refrigeration system. The temperatures of the components are reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to each respective component. In this regard, any relatively inactive, and therefore relatively cooler, component with respect to other components, may be heated by that component's respective supplemental heater, such that the temperature of the relatively inactive component is not reduced below the specified temperature range.
    • 一种用于降低多组件系统中部件之间温度变化的系统和方法。 在这方面,组件温度被控制为相对于其他部件保持相对恒定(大约在5℃内),同时允许部件之间的多个波动的热负荷。 使用具有可变容量(速度)压缩机和恒温膨胀阀的制冷系统来控制通过制冷系统的制冷剂的流动。 通过计量冷却部件的制冷剂的质量流量以补偿施加到制冷系统的热负荷来降低部件的温度。 组件之间的温度变化由辅助加热器减少,独立地向各个组件提供热量。 在这方面,相对于其他部件的任何相对不活泼且因此相对较冷的部件可被该部件相应的补充加热器加热,使得相对不活泼的部件的温度不降低到低于规定的温度范围。
    • 75. 发明授权
    • Passive spray coolant pump
    • 被动喷雾冷却液泵
    • US06708515B2
    • 2004-03-23
    • US09945046
    • 2001-08-31
    • Christopher G. MaloneCullen E. BashChandrakant D. Patel
    • Christopher G. MaloneCullen E. BashChandrakant D. Patel
    • F25D1703
    • H01L23/4336H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/00014H01L2924/00H01L2224/0401
    • A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. Inkjet-type sprayers are configured to spray cooling fluid down on the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.
    • 一种半导体芯片冷却系统,其具有形成空腔的主体,所述空腔被配置为当与芯片相邻地邻接时产生喷雾室,或者携带一个或多个芯片的基板或印刷电路板。 喷墨式喷雾器被配置成将冷却流体向下喷射在芯片上。 控制器将控制信号发送到喷雾器,以使喷雾器以导致冷却流体被半导体器件汽化的速率喷射。 冷却系统使用冷却流体表面张力将液体冷却流体从喷雾室向上抽吸到喷雾器上,以再次喷洒。 冷却系统使用喷雾室内的重力和/或压力将蒸发的冷却流体从喷雾室向上引导到冷凝器。 冷凝器被配置为冷却并冷凝蒸气。 储存器位于冷凝器下方和喷雾器上方,以便从冷凝器接收冷凝的蒸汽并将其送入喷雾器。