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    • 80. 发明授权
    • Method for evaluating HSG silicon film of semiconductor device by atomic
force microscopy
    • 用原子力显微镜评估半导体器件的HSG硅膜的方法
    • US5970312A
    • 1999-10-19
    • US12119
    • 1998-01-22
    • Seung-hee NamYoung-sun Kim
    • Seung-hee NamYoung-sun Kim
    • G01R31/265H01L21/66
    • G01R31/265B82Y15/00H01L22/12
    • An evaluating method of an HSG silicon film using atomic force microscopy (AFM). The characteristics of the HSG silicon film are measured and expressed with quantitative values using AFM. The above values are compared to values written in the working specification, to thereby evaluate the HSG silicon film and control the conditions of forming the HSG silicon film. Also, the capacitor where the HSG silicon film is interposed is formed, and then the capacitance of the capacitor is measured to determine the HSG height of the HSG silicon film for ensuring desired capacitance and conditions of forming the HSG silicon film. Accordingly, the characteristics of the HSG silicon film may be analyzed without damaging the semiconductor substrate and a preferred working specification for forming the HSG silicon film may be realized, to thereby increase the reproducibility of the HSG silicon film. Also, when the conditions of forming the HSG silicon film are determined, it is checked whether the apparatus for forming the HSG silicon film operates normally.
    • 使用原子力显微镜(AFM)的HSG硅膜的评估方法。 使用AFM测量HSG硅膜的特性并用定量值表达。 将上述值与工作规范中写入的值进行比较,从而评估HSG硅膜并控制形成HSG硅膜的条件。 此外,形成插入HSG硅膜的电容器,然后测量电容器的电容,以确定HSG硅膜的HSG高度,以确保所需的电容和形成HSG硅膜的条件。 因此,可以分析HSG硅膜的特性而不损坏半导体衬底,并且可以实现用于形成HSG硅膜的优选工作规范,从而提高HSG硅膜的再现性。 此外,当确定形成HSG硅膜的条件时,检查用于形成HSG硅膜的装置是否正常工作。