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71. 发明申请

US20130043582A1 MULTIPLE DIE IN A FACE DOWN PACKAGE 失效
公开(公告)号：US20130043582A1
公开(公告)日：2013-02-21
申请号：US13209596
申请日：2011-08-15
申请人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
发明人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC分类号： H01L23/482
CPC分类号： H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

72. 发明申请

US20130015590A1 MEMORY MODULE IN A PACKAGE 有权
标题翻译：包装中的存储器模块
公开(公告)号：US20130015590A1
公开(公告)日：2013-01-17
申请号：US13346185
申请日：2012-01-09
申请人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
发明人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
IPC分类号： H01L23/48
CPC分类号： H01L23/481 , G11C5/04 , H01L23/12 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49838 , H01L23/538 , H01L23/5386 , H01L24/06 , H01L24/09 , H01L24/29 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L27/108 , H01L2224/0401 , H01L2224/061 , H01L2224/091 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/01322 , H01L2924/1203 , H01L2924/1205 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/301 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate having first and second opposed surfaces, at least two pairs of microelectronic elements, and a plurality of terminals exposed at the second surface. Each pair of microelectronic elements can include an upper microelectronic element and a lower microelectronic element. The pairs of microelectronic elements can be fully spaced apart from one another in a horizontal direction parallel to the first surface of the substrate. Each lower microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. A surface of each of the upper microelectronic elements can at least partially overlie a rear surface of the lower microelectronic element in its pair. The microelectronic package can also include electrical connections extending from at least some of the contacts of each lower microelectronic element to at least some of the terminals.
摘要翻译：微电子封装可以包括具有第一和第二相对表面的衬底，至少两对微电子元件和在第二表面处暴露的多个端子。每对微电子元件可以包括上微电子元件和下微电子元件。这些微电子元件对可以在平行于衬底的第一表面的水平方向上彼此完全间隔开。每个下部微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。每个上部微电子元件的表面可以至少部分地覆盖在其对中的下部微电子元件的后表面。微电子封装还可以包括从每个下部微电子元件的至少一些触点延伸到至少一些端子的电连接。

73. 发明授权

US08338963B2 Multiple die face-down stacking for two or more die 有权
标题翻译：多个模具面朝下堆叠两个或更多个模具
公开(公告)号：US08338963B2
公开(公告)日：2012-12-25
申请号：US13306300
申请日：2011-11-29
申请人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
发明人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
IPC分类号： H01L23/52
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/18 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L25/0652 , H01L25/50 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/4824 , H01L2224/50 , H01L2224/73215 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06586 , H01L2225/06589 , H01L2924/09701 , H01L2924/15311 , H01L2924/00
摘要： A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned with the first opening, a rear surface remote therefrom, and an edge extending between the front and rear surfaces. The second microelectronic element has a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element aligned with the second opening.
摘要翻译：公开了一种微电子组件，其包括具有第一和第二开口的基板，第一微电子元件和面朝下位置的第二微电子元件。第一元件具有面向基板的前表面的活动表面和与第一开口对准的接合垫，与其远离的后表面以及在前表面和后表面之间延伸的边缘。第二微电子元件具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面，以及在第二微电子元件的前表面处与第二开口对准的接合焊盘。

74. 发明申请

US20120313228A1 IMPEDENCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL 有权
标题翻译：带金属片或2层RDL的受控控制包
公开(公告)号：US20120313228A1
公开(公告)日：2012-12-13
申请号：US13472081
申请日：2012-05-15
申请人： Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
发明人： Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
IPC分类号： H01L23/495 , H01L21/60 , H01L25/07
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/49816 , H01L23/552 , H01L24/06 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/02311 , H01L2224/02313 , H01L2224/02375 , H01L2224/02379 , H01L2224/05554 , H01L2224/0603 , H01L2224/06156 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48235 , H01L2224/4824 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06558 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with device contacts exposed thereat. The conductive plane overlies a portion of the front surface of the microelectronic device. Traces overlying a surface of the conductive plane are insulated therefrom and electrically connected with the element contacts. The traces also have substantial portions spaced a first height above and extending at least generally parallel to the conductive plane, such that a desired impedance is achieved for the traces. First bond element electrically connects the at least one conductive plane with the at least one reference contact. Second bond elements electrically connect device contacts with the traces.
摘要翻译：微电子组件包括互连元件，导电平面，微电子器件，多个迹线以及第一和第二接合元件。互连元件包括电介质元件，多个元件触点及其上的至少一个参考触点。该微电子器件包括一个正面，其中设有触点暴露在该表面上。导电平面覆盖微电子器件前表面的一部分。覆盖导电平面表面的迹线与其绝缘，并与元件触点电连接。迹线还具有在第一高度之上并且至少大致平行于导电平面延伸的基本部分，使得对于迹线实现期望的阻抗。第一接合元件将至少一个导电平面与至少一个参考触点电连接。第二接合元件将器件触点与迹线电连接。

75. 发明授权

US08304881B1 Flip-chip, face-up and face-down wirebond combination package 有权
标题翻译：倒装芯片，面朝上和面朝下的引线键合组合封装
公开(公告)号：US08304881B1
公开(公告)日：2012-11-06
申请号：US13306182
申请日：2011-11-29
申请人： Belgacem Haba , Richard Dewitt Crisp , Wael Zohni
发明人： Belgacem Haba , Richard Dewitt Crisp , Wael Zohni
IPC分类号： H01L23/02
CPC分类号： H01L25/071 , H01L23/3128 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32145 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06558 , H01L2225/06562 , H01L2924/01087 , H01L2924/09701 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/32245
摘要： A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having a front surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, and leads electrically connecting the contacts of the second microelectronic element with the terminals. The second microelectronic element can have contacts exposed at the front surface thereof beyond an edge of the first microelectronic element. The first microelectronic element can be configured to regenerate at least some signals received by the microelectronic assembly at the terminals and to transmit said signals to the second microelectronic element. The second microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function.
摘要翻译：微电子组件可以包括具有在其第一和第二表面之间延伸的孔的衬底，衬底在第一表面具有衬底触点，在第二表面具有端子。微电子组件可以包括具有面向第一表面的前表面的第一微电子元件，具有面向第一微电子元件的前表面的第二微电子元件，以及将第二微电子元件的触点与端子电连接的引线。第二微电子元件可以具有在其前表面处暴露于第一微电子元件的边缘之外的触点。第一微电子元件可以被配置为在端子处再生由微电子组件接收的至少一些信号，并将所述信号传输到第二微电子元件。第二微电子元件可以体现更多数量的有源器件以提供比任何其他功能的存储器阵列功能。

76. 发明申请

US20120267798A1 MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE 有权
标题翻译：用于两个或更多DIE的多个DIE面向下的堆叠
公开(公告)号：US20120267798A1
公开(公告)日：2012-10-25
申请号：US13306300
申请日：2011-11-29
申请人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
发明人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
IPC分类号： H01L23/50
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/18 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L25/0652 , H01L25/50 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/4824 , H01L2224/50 , H01L2224/73215 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06586 , H01L2225/06589 , H01L2924/09701 , H01L2924/15311 , H01L2924/00
摘要： A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned with the first opening, a rear surface remote therefrom, and an edge extending between the front and rear surfaces. The second microelectronic element has a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element aligned with the second opening.
摘要翻译：公开了一种微电子组件，其包括具有第一和第二开口的基板，第一微电子元件和面朝下位置的第二微电子元件。第一元件具有面向基板的前表面的活动表面和与第一开口对准的接合垫，与其远离的后表面以及在前表面和后表面之间延伸的边缘。第二微电子元件具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面，以及在第二微电子元件的前表面处与第二开口对准的接合焊盘。

77. 发明申请

US20120068365A1 METAL CAN IMPEDANCE CONTROL STRUCTURE 有权
标题翻译：金属CAN阻抗控制结构
公开(公告)号：US20120068365A1
公开(公告)日：2012-03-22
申请号：US12883811
申请日：2010-09-16
申请人： Belgacem Haba , Ellis Chau , Wael Zohni , Richard Dewitt Crisp
发明人： Belgacem Haba , Ellis Chau , Wael Zohni , Richard Dewitt Crisp
IPC分类号： H01L23/49 , H01L21/50
CPC分类号： H01L23/3128 , H01L23/49816 , H01L23/552 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06136 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48227 , H01L2224/48471 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/013 , H01L2924/00013
摘要： A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential.
摘要翻译：微电子组件包括互连元件，元件触点，第一和第二金属层，导电元件以及第一和第二微电子器件。第一金属层可以延伸超出第一微电子器件的至少一个边缘。导电元件可以分别延伸超过第一金属层的至少一个边缘。第一金属层可以具有以与导电元件的至少大部分基本上均匀的间隔设置的表面，使得可以为导电元件实现期望的阻抗。导电元件可以距金属层的距离远离导电元件距离第一微电子器件的前表面的距离。第二金属层可以连接到参考电位源。

78. 发明授权

US07545029B2 Stack microelectronic assemblies 有权
标题翻译：堆叠微电子组件
公开(公告)号：US07545029B2
公开(公告)日：2009-06-09
申请号：US11506472
申请日：2006-08-18
申请人： Stuart E. Wilson , Ronald Green , Richard Dewitt Crisp , Giles Humpston
发明人： Stuart E. Wilson , Ronald Green , Richard Dewitt Crisp , Giles Humpston
IPC分类号： H01L23/02 , H05K7/00 , H01L21/00
CPC分类号： H01L23/66 , H01L25/105 , H01L25/16 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/09701 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.
摘要翻译：堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。组件还具有覆盖在基底基板上的第二微电子子组件。第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。

79. 发明授权

US07317249B2 Microelectronic package having stacked semiconductor devices and a process for its fabrication 有权
标题翻译：具有堆叠半导体器件的微电子封装及其制造工艺
公开(公告)号：US07317249B2
公开(公告)日：2008-01-08
申请号：US11021627
申请日：2004-12-23
申请人： Richard Dewitt Crisp , Belgacem Haba , Giles Humpston
发明人： Richard Dewitt Crisp , Belgacem Haba , Giles Humpston
IPC分类号： H01L23/34
CPC分类号： H01L24/73 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/73207 , H01L2224/73257 , H01L2225/06572 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. The packaged microelectronic device is formed by using a transfer substrate to transfer solder masses onto at least some of the conductive posts extending from the first major surface of the first microelectronic element or contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts disposed on the surface of the second microelectronic element.
摘要翻译：具有第一和第二电互连微电子元件的封装微电子器件及其制造方法。导电柱从第一微电子元件的一个主表面延伸。第一微电子元件经由导电柱与第二微电子元件电互连。第一微电子元件优选地具有导电柱延伸的插入元件。第二微电子元件经由导电柱经由第二微电子元件上的触点而互连到插入元件。如此互连的微电子元件具有协调的功能，例如可编程逻辑器件，其中一个微电子元件是现场可编程门阵列，而另一微电子元件是存储器件。封装的微电子器件通过使用转移衬底来形成，以将焊料块转移到从第一微电子元件的第一主表面或第二微电子元件上的触点延伸的至少一些导电柱上。焊料块然后用于将导电柱与布置在第二微电子元件的表面上的触点电互连。

80. 发明授权

US07262368B2 Connection structures for microelectronic devices and methods for forming such structures 有权
标题翻译：微电子器件的连接结构和形成这种结构的方法
公开(公告)号：US07262368B2
公开(公告)日：2007-08-28
申请号：US10917978
申请日：2004-08-13
申请人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
发明人： Belgacem Haba , Masud Beroz , David B. Tuckerman , Giles Humpston , Richard Dewitt Crisp
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H01L23/49838 , H01L23/49827 , H01L2924/0002 , H05K1/115 , H05K3/041 , H05K3/06 , H05K3/202 , H05K3/4038 , H05K2201/09609 , H05K2201/097 , H05K2201/09827 , H05K2201/09881 , H05K2203/0733 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49149 , Y10T29/49165 , H01L2924/00
摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
摘要翻译：提供了用于微电子器件的连接结构和用于形成结构的方法。包括具有相对表面的基板和延伸穿过该表面的多个孔。还包括多个导电柱。每个柱从基部延伸到位于基板的相应孔内的尖端。可以提供另外的基底，使得每个柱的基部位于其表面上。可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。可选地，介电材料可以放置在基板和柱之间。

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