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71. 发明专利

DE69314830D1 未知
公开(公告)号：DE69314830D1
公开(公告)日：1997-12-04
申请号：DE69314830
申请日：1993-03-25
申请人： TOKYO SEIMITSU CO LTD
发明人： YOSHIDA HITOSHI
IPC分类号： G01B21/20 , G01B21/04 , G06F3/041 , G06F3/048 , G01B5/00
摘要： A coordinate measuring machine and the method of measuring therein, where the instruction of the geometic shape is prevented from mistaking and the geometic shape of the workpiece is measured without interrupting the joystick operation. The measuring direction of the probe (36) and the measured value of workpiece (48) are taken in the data receiving part (42). The geometic shape calculation part (44) calculates the errors of each geometic shape based on the measured value from the data receiving part and the formula which was input previously and represents the geometic shape such as "a straight line or circle". And, the geometic shape recognition part (46) compares respective shape errors such as "a straight line and circle" which are calculated in geometic shape calculation part (44) and recognizes the geometic shape having the lowest shape errors. Further, the optimal geometic shape is recognized again based on the geometic shape having the lowest recognized shape errors and the measuring direction of the probe (36) which is input from said data receiving part (42). Therefore, the step for inputting the geometic shape of the workpiece (48) by the key can be removed before measuring. Moreover, the geometic shape can be recognized in a short time, because the geometic shape of workpiece (48) can be automatically set based on the characteristic such as "a point, straight line or circle" whenever the definite measured point of the geometic shape of the workpiece (48) is obtained.

72. 发明专利

GB9714588D0 Semiconductor wafer polishing machine 未知
公开(公告)号：GB9714588D0
公开(公告)日：1997-09-17
申请号：GB9714588
申请日：1997-07-10
申请人： TOKYO SEIMITSU CO LTD
IPC分类号： B24B1/00 , B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304
摘要： A wafer mount plate is inserted loosely into a housing, and the wafer mount plate is supported in such a manner as to be swingable and movable vertically and horizontally with respect to a polishing pad. An air chamber is formed between the wafer mount plate and the housing. By controlling the internal pressure of the air chamber, it is possible to control polishing pressure applied on the wafer mount plate. Since the entire top side of the wafer mount plate can be uniformly pressured, the uniform polishing pressure can be applied on the entire surface of the semiconductor wafer. Further, the wafer mount plate inclines in accordance with variations in the inclination of the polishing pad so that the semiconductor wafer and the polishing pad can be maintained in a parallel position.

73. 发明专利

DE69120904T2 未知
公开(公告)号：DE69120904T2
公开(公告)日：1996-11-28
申请号：DE69120904
申请日：1991-11-21
申请人： TOKYO SEIMITSU CO LTD
发明人： TANAKA TOSHIYUKI , NAKAMURA MASAHARU
IPC分类号： B28D7/00 , H01L21/301 , H01L23/544 , H01L21/304

74. 发明专利

GB2293783A Wafer feed means for pressurizing wafer edge against grinding wheel permits chamfering and polishing in a single grinding apparatus 未知
公开(公告)号：GB2293783A
公开(公告)日：1996-04-10
申请号：GB9518614
申请日：1995-09-12
申请人： TOKYO SEIMITSU CO LTD
发明人： KAGAMIDA TAKESHI
IPC分类号： B24B9/00 , B24B9/06 , B24B41/02 , H01L21/304
摘要： A slide table is slidably supported on the slide stage which is moved by a guide screw. The slide table is connected with the slide stage by means of pressurization means. A rotatable wafer table is provided on the slide table. A grinding wheel for chamfering is used. The pressurization means is locked, so that the slide table is kept locked to the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is chamfered. A grinding wheel for polishing is used. The pressurization means is not locked, so that the slide table can be slide on the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is polished.

75. 发明专利

GB2269469B Method of exchanging an article and apparatus therefor 未知
公开(公告)号：GB2269469B
公开(公告)日：1996-01-03
申请号：GB9316115
申请日：1993-08-04
申请人： TOKYO SEIMITSU CO LTD , OHI CO LTD
发明人： OGIWARA HIDEO , IBA TERUMASA , SANADA TOMOHIRO
IPC分类号： G07F7/00 , G07F17/12 , G07C9/00
摘要： Under the receiving made, a control section automatically selects a vacant locker 14 to receive an article from a person (e.g. customer of a shop) and memorizes the number of the locker storing the article and an identification number keyed in 18A by the person, and further displays the identification number when the locker 14 is opened. Under the return mode, The control section memorizes the number of the new vacant locker storing the article and the identification number, and when the article is called for, indicates and unlocks the locker in response to keying in of the identification number. Operation is also dependent on payment 16 of a fee.

76. 发明专利

GB2272318A Traffic signals 未知
公开(公告)号：GB2272318A
公开(公告)日：1994-05-11
申请号：GB9309584
申请日：1993-05-10
申请人： TOKYO SEIMITSU CO LTD , OHI CO LTD
发明人： NAGATA KANETOSHI , SANADA TOMOHIRO , IBA TERUMASA
IPC分类号： G08G1/095 , G09F9/313 , G09F13/04 , G09F13/20 , G08G1/09 , G09F9/00
摘要： A display panel (20, Fig. 1) is positioned where it can be observed simultaneously with a traffic signal (10). Information including traffic information, traffic slogans, and advertisement is displayed on the panel (20). The display colour (e.g. the luminescent background colour of the information) or its on/off state is changed in response to changes in the traffic signal (10). A traffic signal may have a single luminescent area controllable to any of three colours, or may (Fig. 8) have separate areas 110A, 110B, 110C for respective directions, each controllable to any of three colours. A traffic signal lamp hood may have ventilation openings.

77. 发明专利

DE3684583D1 未知
公开(公告)号：DE3684583D1
公开(公告)日：1992-04-30
申请号：DE3684583
申请日：1986-06-11
申请人： TOKYO SEIMITSU CO LTD
发明人： MIYAKE YOSINOBU
IPC分类号： H02N1/08

78. 发明专利

GB2222886A Method and device for measuring a surface contour eg. roughness 未知
公开(公告)号：GB2222886A
公开(公告)日：1990-03-21
申请号：GB8921194
申请日：1989-09-19
申请人： TOKYO SEIMITSU CO LTD
发明人： SUZUKI TORU , ARAI MASATOSHI
IPC分类号： G01B21/20 , G01B7/28 , G01B11/30 , G01B21/30
摘要： Errors in gauging the roughness of a curved surface are corrected by using a least squares analysis of measurement signals to obtain a cubic equation describing the curve of the surface and then removing from the measurement signals a component corresponding to this equation to leave a signal indicative of roughness only. … …

79. 发明专利

NL2027333B1 Wafer machining system and wafer machining method 未知
公开(公告)号：NL2027333B1
公开(公告)日：2022-03-15
申请号：NL2027333
申请日：2021-01-18
申请人： TOKYO SEIMITSU CO LTD
发明人： TOMOKI FUKE
IPC分类号： B23K26/03 , H01L21/67 , B23K26/08 , B28D5/00 , B28D5/02 , H01L21/78
摘要： The invention provides a wafer machining system and a wafer machining method for performing appropriate blade machining on a laser-machined groove. The laser machining device machines a groove along a scribe line formed on a surface of a wafer with a laser beam, and acquires misalignment information indicating misalignment of the groove with respect to the scribe line by capturing an image of a surface of the wafer, and stores the misalignment information in a storage unit in association with wafer-specific information. The blade dicing device acquires misalignment information associated with the wafer- specific information of the wafer on which the groove has been formed from the storage unit, and cuts the wafer on which the groove has been formed, along the groove with the blade based on the acquired misalignment information.

80. 发明专利

NL2026427B1 LASER MACHINING APPARATUS 未知
公开(公告)号：NL2026427B1
公开(公告)日：2021-10-13
申请号：NL2026427
申请日：2020-09-08
申请人： TOKYO SEIMITSU CO LTD
发明人： HIROKAZU HAYASHI , AYUKA SHIMODA
IPC分类号： B23K26/06 , B23K26/067 , B23K26/08 , B23K26/364 , B23K26/402
摘要： Provided is a laser machining apparatus that can reduce tact time required for laser machining of the wafer. The laser machining apparatus includes: a first laser light source configured to emit a laser light with a condition corresponding to the edge cutting; a second laser light source configured to emit a laser light with a condition corresponding to the hollowing; a first light forming element configured to form two first laser lights from the laser light emitted from the first laser light source; a second light forming element configured to form second laser light from the laser light emitted from the second laser light source; a first condenser lens; two second condenser lenses arranged in a row with the first condenser lens interposed therebetween; and a connecting optical system configured to guide the two first laser lights emitted from the first light forming element to the first condenser lens and guide the second laser light emitted from the second light forming element selectively to the two second condenser lenses.

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