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61. 发明授权

US06501665B1 Structure of a ball grid array IC mounting seat 失效
标题翻译：球栅阵列IC安装座的结构
公开(公告)号：US06501665B1
公开(公告)日：2002-12-31
申请号：US09925499
申请日：2001-08-10
申请人： Ju Ted
发明人： Ju Ted
IPC分类号： H05K710
CPC分类号： H05K7/103 , H05K3/3426 , H05K7/1023 , Y02P70/613
摘要： An improved structure of a Ball Grid Array IC mounting seat is disclosed. The IC mounting sear is characterized in that the middle section of the elongated thin strap is provided with a notch such that when the thin strap is folded correspondingly, the folding is at the side wall of the notch and all regions of the side edge of the notch are curved to externally clip the clipping body of the ball edge of the solder ball and the solder ball is mounted to the bottom clipping body of the conductive plates, thereby the solder ball is secured. In application the pre-soldering of the solder ball onto the conductive clipping plate is avoided, and the production process is rapid.
摘要翻译：公开了一种改进的球栅阵列IC安装座的结构。 IC安装架的特征在于，细长薄带的中间部分设置有切口，使得当薄带相应地折叠时，折叠在凹口的侧壁处，并且侧边缘的所有区域凹口弯曲以外部夹住焊球的球边缘的夹持体，并且焊球安装到导电板的底部夹持体上，由此焊球被固定。在应用中，避免了将焊球预先焊接到导电夹板上，并且生产过程是快速的。

62. 发明授权

US06496385B1 Method and assembly for installation or removal of printed circuit card 有权
标题翻译：安装或拆卸印刷电路卡的方法和装配
公开(公告)号：US06496385B1
公开(公告)日：2002-12-17
申请号：US09408657
申请日：1999-09-29
申请人： Stephen D. Smithson , Bruce Garrett , Roger Ramseier , Steve J. Dean , Paul Wiley
发明人： Stephen D. Smithson , Bruce Garrett , Roger Ramseier , Steve J. Dean , Paul Wiley
IPC分类号： H05K710
CPC分类号： H05K7/1461
摘要： A printed circuit card carrier permits exchange of a card during continuous operation of electronic equipment, and thus without the need to remove an upper part of the enclosure to gain access to the card for upward removal from a motherboard connector. The carrier includes a movable printed circuit card holder that slides along the carrier, perpendicularly towards and away from the motherboard. An actuator accessible from outside the equipment and the holder are coupled together such that motion of the actuator is directed into perpendicular sliding motion of the holder. This either removes the printed circuit card from the motherboard connector or installs it into connector, depending on the direction of motion of the actuator. The carrier is particularly adapted for cards meeting the PCI standard.
摘要翻译：印刷电路卡载体允许在电子设备的连续操作期间交换卡，因此不需要移除外壳的上部以获得对卡的访问以从母板连接器向上移除。载体包括可移动的印刷电路卡保持器，其沿着载体垂直地朝向和远离主板滑动。从设备外部和保持器可接近的致动器联接在一起，使得致动器的运动被引导到保持器的垂直滑动运动。这可以从主板连接器移除印刷电路板，或者根据执行器的运动方向将其安装到连接器中。运营商特别适用于符合PCI标准的卡。

63. 发明授权

US06493230B2 Modular computer system mechanical interconnection 有权
标题翻译：模块化计算机系统机械互连
公开(公告)号：US06493230B2
公开(公告)日：2002-12-10
申请号：US09846984
申请日：2001-05-01
申请人： Jimmy Clidaras , Kenneth Kitlas
发明人： Jimmy Clidaras , Kenneth Kitlas
IPC分类号： H05K710
CPC分类号： H05K7/1429 , G06F1/181
摘要： A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
摘要翻译：模块化计算机系统机械互连包括具有第一开口的主底架和附接到主底架并具有第二开口的辅助底盘，其中第一开口和第二开口大致对准。该装置还包括覆盖对齐的第一开口和第二开口的背板。

64. 发明授权

US06473310B1 Insulated power multichip package 有权
标题翻译：绝缘电源多芯片封装
公开(公告)号：US06473310B1
公开(公告)日：2002-10-29
申请号：US09507558
申请日：2000-02-18
申请人： Paolo Casati , Carlo Cognetti
发明人： Paolo Casati , Carlo Cognetti
IPC分类号： H05K710
CPC分类号： H01L23/4334 , H01L21/565 , H01L25/0655 , H01L2224/48091 , H01L2224/49171 , H01L2924/00014
摘要： The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.
摘要翻译：本发明包括具有彼此电隔离的至少两个芯片的多芯片集成电路封装。在多芯片集成电路封装内是直接耦合到至少两个芯片的芯片，没有任何中间绝缘层。芯片在两个芯片之间的适当位置物理分离，从而有效地消除了两个芯片之间的电气干扰。使集成电路封装开始于将两个芯片直接连接到散热片上。散热片可以在芯片之间运行预切割槽。一旦芯片连接到芯块上，芯块就被模制成多芯片集成电路封装。然后，将塞子从下侧物理分离成两片，分离沿着预切槽延伸。通常，锯屑将被锯切割而分离。

65. 发明授权

US06473307B2 Method and apparatus for efficient electronics positioning and connection systems 有权
标题翻译：用于高效电子定位和连接系统的方法和装置
公开(公告)号：US06473307B2
公开(公告)日：2002-10-29
申请号：US09784470
申请日：2001-02-15
申请人： Michael J. Mallette
发明人： Michael J. Mallette
IPC分类号： H05K710
CPC分类号： G06F1/18 , H05K7/1457
摘要： The present invention provides a method and apparatus for efficient electronics positioning and connection systems. In one embodiment of the present invention, electronic components are inserted into a connection rack from the front such that connections face the front side of the connection rack. In another embodiment of the present invention, electronic components are inserted into a connection rack from a side such that connections face the front side of the connection rack. In one embodiment, a connection rack is positioned with the back side against a wall. In another embodiment two connection racks are positioned such that the back side of a first connection rack is against the back side of a second connection rack. In one embodiment, a power supply is positioned near the top of the connection rack. A common power line couples the power supply to the electronic components. Thus, the need for heat-producing power supplies in each component is eliminated. In one embodiment, the common power line has a contiguous connector (channel). This connector couples the common power line to electronic components without additional cable.
摘要翻译：本发明提供了一种用于高效电子定位和连接系统的方法和装置。在本发明的一个实施例中，将电子部件从前部插入到连接齿条中，使得连接面向连接齿条的前侧。在本发明的另一个实施例中，电子部件从一侧插入到连接齿条中，使得连接面向连接齿条的前侧。在一个实施例中，连接架被定位成使得后侧靠在墙壁上。在另一个实施例中，两个连接支架被定位成使得第一连接支架的后侧抵靠第二连接支架的后侧。在一个实施例中，电源位于连接支架的顶部附近。公共电源线将电源耦合到电子部件。因此，消除了在每个部件中对发热电源的需要。在一个实施例中，公共电力线具有连续的连接器（通道）。该连接器将公共电源线连接到电子元件，而无需额外的电缆。

66. 发明授权

US06437989B1 Circuit board with an electronic component and a method for producing a connection between the circuit board and the component 有权
标题翻译：具有电子元件的电路板和用于在电路板和部件之间产生连接的方法
公开(公告)号：US06437989B1
公开(公告)日：2002-08-20
申请号：US09577913
申请日：2000-05-24
申请人： Sergej Lopatin , Dietmar Birgel , Karl-Peter Hauptvogel
发明人： Sergej Lopatin , Dietmar Birgel , Karl-Peter Hauptvogel
IPC分类号： H05K710
CPC分类号： H01L24/73 , H01L24/81 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H05K1/189 , H05K3/321 , H05K3/3442 , H05K2201/094 , H05K2201/10083 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y10T29/49139 , Y10T29/49165
摘要： This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at least one of the electrical contacts is connected to the circuit board by soldering. The circuit board is suitable for fast mechanical mass production. Further a method for the manufacture of the connection between the circuit board and the electronic components is disclosed, in which a solder is applied to soldering points and a conductive adhesive is applied to adhesive points. The circuit board with the components is then placed in a furnace to connect the components to the circuit board.
摘要翻译：该电路板包含具有电触点的电子部件。电触点中的至少一个最初使用导电粘合剂粘合到电路板上，并且至少一个电触点通过焊接连接到电路板。电路板适用于快速机械批量生产。公开了一种用于制造电路板和电子部件之间的连接的方法，其中将焊料应用于焊接点，并将导电粘合剂施加到粘合点。然后将具有部件的电路板放置在炉中以将部件连接到电路板。

67. 发明授权

US06426877B1 Semiconductor device incorporating module structure 失效
公开(公告)号：US06426877B1
公开(公告)日：2002-07-30
申请号：US09598413
申请日：2000-06-21
申请人： Shinji Baba
发明人： Shinji Baba
IPC分类号： H05K710
CPC分类号： H01L23/3675 , H01L23/433 , H01L23/5385 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/1005 , H01L2225/1023 , H01L2225/107 , H01L2225/1094 , H01L2924/00014 , H01L2924/01057 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1627 , H01L2924/16315 , H01L2924/3511 , Y10S439/946 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device comprises a plurality of semiconductor block modules mounted on a system board. The semiconductor block module comprises a block socket and a module board fitted thereto. The block socket assumes an annular shape and has connection terminals on upper and lower peripheral surfaces thereof and has an inner groove formed on the inner surface thereof. The module board has at least a semiconductor chip mounted thereon and is fitted into the inner groove of the block socket. The module board is electrically connected to the block socket. The connection terminals on the upper peripheral surface of the module socket may be mechanically fitted into and electrically connected to the connection terminals on the lower peripheral surface of other block socket having the same structure.

68. 发明授权

US06388885B1 Controller with helical spring contacts 有权
标题翻译：带螺旋弹簧触点的控制器
公开(公告)号：US06388885B1
公开(公告)日：2002-05-14
申请号：US09643537
申请日：2000-08-22
申请人： Andrew D. Alexander , Heather L. Havlicsek , Kevin C. Loewe , Donald J. Zito
发明人： Andrew D. Alexander , Heather L. Havlicsek , Kevin C. Loewe , Donald J. Zito
IPC分类号： H05K710
CPC分类号： H05K3/308 , H01R13/33
摘要： A user-friendly controller provides a special dynamic interconnect which reliably connects terminals of electronic device, such as solenoids, to a circuit board to enhance vehicle performance and help obtain a smoother more comfortable ride. The special interconnect comprises a coil spring contact. The coiled spring contact can have an enlarged head which can be soldered to a contact on the circuit board. The central portion of the spring contact provides a terminal-receiving opening to slidably receive the terminal of the electronic device. The smaller end portion of the spring contact can compressively engage and dynamically contact the terminal of the electronic device. A cover can be provided to environmentally protect and cover the circuitry and circuit board. The cover can have chambers for receiving and engaging the spring contacts.
摘要翻译：用户友好的控制器提供了一种特殊的动态互连，可靠地将诸如螺线管的电子设备的端子连接到电路板，以增强车辆性能，并帮助获得更平滑更舒适的乘坐。该专用互连件包括螺旋弹簧接触件。螺旋弹簧触头可以具有可以被焊接到电路板上的触点的扩大头部。弹簧触点的中心部分提供端子接收开口以可滑动地接收电子装置的端子。弹簧触点的较小端部可以压缩地接合并动态地接触电子设备的端子。可以提供盖子来环境保护并覆盖电路板和电路板。盖可以具有用于接收和接合弹簧触点的腔室。

69. 发明授权

US06362957B1 External storage device 失效
标题翻译：外部存储设备
公开(公告)号：US06362957B1
公开(公告)日：2002-03-26
申请号：US09658456
申请日：2000-09-08
申请人： Hiroshi Iwasaki
发明人： Hiroshi Iwasaki
IPC分类号： H05K710
CPC分类号： G06K19/07747 , G06K7/0021 , G06K19/077 , G06K19/07741 , G06K19/07743 , G06K19/07745 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： An comprises an external storage device and an external storage device unit, wherein an external storage device main includes, a thin type external storage device module formed into a one-side sealed package from a storage medium series element containing at least one non-volatile semiconductor memory device, and a flat type external connection terminal connected to an input/output terminal of the storage medium series element and led and exposed to a backside of the external storage device module, and an external storage device unit includes, an external storage device main detachable section for engaging, insertedly attaching and detaching the external storage device main, an resilient contact electrically connecting to the external connection terminal of the external storage device main to be mounted, and at least a part of circuit function for driving and controlling the storage medium series element.
摘要翻译：一种外部存储装置和外部存储装置单元，其中外部存储装置主要包括从包含至少一个非易失性半导体的存储介质系列元件形成为单面密封封装的薄型外部存储装置模块存储装置和连接到存储介质串联元件的输入/输出端子并且被暴露到外部存储装置模块的背面的扁平型外部连接端子，并且外部存储装置单元包括：外部存储装置主体用于接合，插入和拆卸外部存储装置主体的可拆卸部分，电连接到要安装的外部存储装置主体的外部连接端子的弹性触点和用于驱动和控制存储介质的电路功能的至少一部分系列元素。

70. 发明授权

US06351391B1 Signal busses on printed board structures mounting ASIC chips with signal termination resistor devices using planar signal terminating devices 有权
标题翻译：在印刷电路板结构上的信号总线，使用平面信号端接装置安装具有信号终端电阻器件的ASIC芯片
公开(公告)号：US06351391B1
公开(公告)日：2002-02-26
申请号：US09571956
申请日：2000-05-15
申请人： Clint A. Beliveau , Wallace D. Doeling
发明人： Clint A. Beliveau , Wallace D. Doeling
IPC分类号： H05K710
CPC分类号： H05K1/167 , H01L23/647 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H05K1/023 , H05K1/0246 , H05K1/0298 , H05K1/141 , H05K2201/049 , H05K2201/10734 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A printed circuit board structure is provided where there is a circuitized dielectric substrate having a plurality of signal traces thereon. The circuitized substrate has first and second opposite faces. An ASIC chip assembly is mounted on the first face and connected to the surface by solder connections. Preferably, the ASIC chip assembly is mounted on the substrate as an IC chip mounted on a chip carrier with the chip carrier being mounted to the circuit board by solder connections, preferably in the form of a ball grid array. In one embodiment, a discrete signal termination device is provided which is disposed on the second face of the circuitized substrate directly opposite the ASIC chip assembly. In another embodiment, a discrete signal termination device is disposed between the ASIC chip assembly and the printed circuit board. The signal termination device includes a plurality of planar resistors embedded in a dielectric material with the resistors being electrically connected to the signal lines on the circuitized substrate, preferably by solder connections, again in the form of a ball grid array. In yet another embodiment, the signal termination device is formed as a part of the ASIC chip assembly by being incorporated in the chip carrier In all cases, the signal termination device need not be formed as a part of the circuit board but can be formed in discrete individual segments for attachment to either the circuit board or formed as part of the chip carrier, thus utilizing the entire structure of the termination device to form resistors.
摘要翻译：提供了一种印刷电路板结构，其中存在其上具有多个信号迹线的电路化电介质基板。电路化基板具有第一和第二相对面。 ASIC芯片组件安装在第一面上，并通过焊接连接连接到表面。优选地，ASIC芯片组件作为安装在芯片载体上的IC芯片安装在基板上，其中芯片载体通过焊接连接安装到电路板，优选地以球栅阵列的形式。在一个实施例中，离散提供信号终端装置，其设置在与ASIC芯片组件正对的电路化基板的第二面上。在另一个实施例中，离散信号终端装置设置在ASIC芯片组件和印刷电路板之间。信号终端装置包括嵌入电介质材料中的多个平面电阻器，其中电阻器电连接到电路化的衬底，优选地通过焊料连接，再次以球栅阵列的形式。在另一个实施例中，信号终端装置通过结合在芯片载体中而形成为ASIC芯片组件的一部分。在所有情况下，信号终端装置不需要形成为电路板的一部分，而是可以形成在离散的各个片段中，用于附接到电路板或形成为芯片载体的一部分，从而利用终端装置的整个结构来形成电阻器。

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