专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20010014372A1 Substrate processing method and substrate processing apparatus 失效
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20010014372A1
公开(公告)日：2001-08-16
申请号：US09737473
申请日：2000-12-18
申请人： Tokyo Electron Limited
发明人： Takayuki Katano , Hidefumi Matsui , Junichi Kitano , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura
IPC分类号： B05D003/00 , B05C013/00
CPC分类号： H01L21/67178 , B05C11/08 , H01L21/67248 , H01L21/67742 , H01L21/67748 , H01L21/67754
摘要： A developing unit, a coating unit and a plurality of cooling plates are arranged in a process station which performs a resist coating and so on and a wafer is transferred among them by a substrate transfer device. The temperature of an area to where the wafer is transferred is detected by a temperature/humidity detector and the temperature of the wafer which is cooled by the cooling plates is adjusted accordingly based on a detected value so that the temperature of the wafer when transferred to the coating unit becomes a coating temperature of a processing solution. Thereby, the wafer is transferred to the coating unit while maintaining its temperature with high accuracy to be coated with a resist solution, so that a formation of an uneven processing due to the temperature change can be prevented and a uniform processing can be performed.
摘要翻译：显影单元，涂布单元和多个冷却板布置在执行抗蚀剂涂层等的处理站中，并且通过基板传送装置在晶片之间转印晶片。通过温度/湿度检测器检测晶片转移到的区域的温度，并且基于检测值相应地调节由冷却板冷却的晶片的温度，使得晶片转移到涂布单元成为处理溶液的涂布温度。由此，将晶片转印到涂布单元，同时高精度地保持其温度以涂覆抗蚀剂溶液，从而可以防止由温度变化引起的不均匀处理的形成，并且可以进行均匀的处理。

62. 发明申请

US20010013684A1 Edge handling wafer chuck 有权
公开(公告)号：US20010013684A1
公开(公告)日：2001-08-16
申请号：US09836655
申请日：2001-04-17
申请人： KLA-Tencor Corporation
发明人： Rodney C. Smedt , George L. Coad
IPC分类号： B05C013/00 , B23B031/18
CPC分类号： H01L21/68728 , B25B5/06 , B25B11/005 , H01L21/68735 , H01L21/68785 , Y10T279/18
摘要： An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes through a center hole in the cylindrical plate and is dispersed to the atmosphere using multiple pressure relief openings in the cylindrical plate. The purpose of this gas arrangement is to stabilize the wafer due to spinning vortex effects. The cylindrical plate has mounted therein an ertalyte ring which provides an area of angled contact for the wafer. The gas arrangement operates to pass gas to the slight space between the semiconductor wafer and the cylindrical plate, thereby contacting a lower surface of the wafer, and subsequently out of the arrangement using the pressure relief holes. The pressure for the arrangement is chosen to provide sufficient force to flatten the wafer and counter the top pressure caused by the spinning vortex.

63. 发明申请

US20010003966A1 Film forming apparatus 审中-公开
标题翻译：成膜装置
公开(公告)号：US20010003966A1
公开(公告)日：2001-06-21
申请号：US09735902
申请日：2000-12-14
申请人： TOKYO ELECTRON LIMITED
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05C011/00 , B05C013/00 , B05C013/02
CPC分类号： H01L21/6715
摘要： A discharge nozzle in a film forming apparatus of the present invention includes a substantially cylindrical support member and a thin plate or a thin plate portion supported on a face on a substrate side of the support member and closing the face on the substrate side, and a discharge port for discharging a coating solution is provided in the thin plate or the thin plate portion. It is possible to form a smaller discharge port in the thin plate or the thin plate portion by laser processing, punching, or the like than that obtainable by conventional injection molding processing. An amount of discharge and a discharge area on the substrate of the coating solution can be controlled more precisely. The film forming apparatus of the present invention includes a cleaning device for cleaning the discharge nozzle which includes a cleaning solution jet port for jetting a cleaning solution for cleaning to the discharge port of the discharge nozzle and a suction port for sucking an atmosphere in the vicinity of the discharge port. Contaminants adhering to the discharge port are removed more completely than before. Accordingly, the cleaning can be conducted effectively even if the diameter of the discharge port is very small. The suction port can suck and drain properly the cleaning solution jetted to the discharge port, preventing scatter of the cleaning solution and contamination around the discharge port.
摘要翻译：本发明的成膜装置中的排出喷嘴包括基本上圆柱形的支撑构件和支撑在支撑构件的基板侧的面上的薄板或薄板部分，并且封闭基板侧的面，并且用于排出涂布溶液的排出口设置在薄板或薄板部分中。通过激光加工，冲孔等可以在薄板或薄板部分中形成比通过常规注塑加工可获得的更小的排出口。可以更精确地控制涂布液的基板上的排出量和排出面积。本发明的成膜装置包括一个用于清洗排放喷嘴的清洁装置，该清洗装置包括一个用于将清洗用清洗液喷射到排出喷嘴的排出口的清洗液喷射口和吸附附近的气氛的吸入口的排放口。附着在排出口的污染物比以前更完全地去除。因此，即使排出口的直径非常小，也可以有效地进行清洗。吸入口可以正确地吸入和排出喷射到排出口的清洁溶液，防止清洁溶液的散射和排出口周围的污染。

64. 发明申请

US20040226506A1 Coated wafer processing equipment 审中-公开
标题翻译：涂层晶圆加工设备
公开(公告)号：US20040226506A1
公开(公告)日：2004-11-18
申请号：US10438552
申请日：2003-05-14
发明人： David Mark Lynn
IPC分类号： B05C013/00 , B05C013/02
CPC分类号： H01L21/67316 , H01L21/67057 , H01L21/67086
摘要： The present invention comprises a wafer boat, bath, or related components that are covered with a fluoropolymer coating. In a preferred form, the components have standard quartz structures that are covered with a protective fluoropolymer coating. In alternate embodiments, glass, plastic, or even metal is used for the structure of the boat or related components, then covered with a protective layer of fluoropolymer. In accordance with another preferred aspect, the coating is clear. In alternate embodiments, however, the coating includes a pigment. In some preferred embodiments, the coating comprises multiple layers with different colors for each layer so that wear will be readily apparent.
摘要翻译：本发明包括用氟聚合物涂层覆盖的晶片舟，浴槽或相关部件。在优选形式中，组分具有被保护性氟聚合物涂层覆盖的标准石英结构。在替代实施例中，玻璃，塑料或甚至金属用于船或相关部件的结构，然后用氟聚合物的保护层覆盖。根据另一个优选的方面，涂层是透明的。然而，在替代实施例中，涂层包括颜料。在一些优选的实施方案中，涂层包括用于每层的不同颜色的多层，使得磨损将容易明显。

65. 发明申请

US20040216664A1 Liquid coating device with barometric pressure compensation 失效
标题翻译：具有大气压力补偿的液体涂层装置
公开(公告)号：US20040216664A1
公开(公告)日：2004-11-04
申请号：US10628598
申请日：2003-07-28
发明人： Joseph W. Daggett , Daniel J. Williams , Kevin G. Kemp , Joseph W. Cayton
IPC分类号： B05C013/00
CPC分类号： H01L21/67253 , B05C9/14 , B05C11/08 , B05C11/1042
摘要： A liquid coating device and method for coating a coatable composition on a workpiece to form a coating, wherein a parameter indicative of barometric pressure is measured and at least one thickness-affecting process parameter is adjusted in order to compensate for the effects of variations in barometric pressure on coating thickness uniformity.

66. 发明申请

US20040081756A1 Workpiece coating apparatus 审中-公开
标题翻译：工件涂装设备
公开(公告)号：US20040081756A1
公开(公告)日：2004-04-29
申请号：US10433497
申请日：2003-11-24
发明人： Timothy D. Coots , Will Stephau
IPC分类号： B05D003/02 , B05D003/12 , B05C013/00
CPC分类号： B05D7/574 , B05B13/0221 , B05B16/20 , B05D3/002 , B05D3/0254 , B05D7/534 , B05D7/544
摘要： A workpiece coating apparatus (12) for applying a coating to each of a plurality of workpieces (11). A coating system (14) includes a coating chamber (18) that receives the workpieces (11) for coating. A curing system (16) includes a curing chamber (20) that receives workpieces (11) for curing. A conveyor system (22) rotates the workpieces (11) about horizontal axes (38) while serially transporting them first through the coating chamber (18) for coating and then through the curing chamber (20) for curing. The coating chamber (18) and curing chamber (20) are stacked to minimize floor space requirements.
摘要翻译：一种用于对多个工件（11）中的每一个施加涂层的工件涂覆装置（12）。涂覆系统（14）包括接收用于涂覆的工件（11）的涂覆室（18）。固化系统（16）包括固化室（20），其固化用于固化的工件（11）。输送机系统（22）围绕水平轴线（38）旋转工件（11），同时首先通过涂覆室（18）串联输送它们，然后通过固化室（20）固化。堆叠涂层室（18）和固化室（20）以最小化占地空间要求。

67. 发明申请

US20040062852A1 Method for applying a drug coating to a medical device 有权
标题翻译：将药物涂层施加到医疗装置的方法
公开(公告)号：US20040062852A1
公开(公告)日：2004-04-01
申请号：US10260659
申请日：2002-09-30
申请人： Medtronic, Inc.
发明人： Peter T. Schroeder , Kimberly A. Chaffin
IPC分类号： A61L002/00 , B05D003/02 , B05C013/00
CPC分类号： A61N1/0568 , A61N1/0575 , A61N1/375
摘要： A method for coating a medical device with a drug is provided. Energy, preferably thermal energy, is applied to a crystalline deposit of a drug on the surface of a medical device to increase the molecular mobility and form a conformable drug coating with a low density of micro-cracks and other mechanical defects that can degrade the coating toughness and effective adhesion to the device surface. In a preferred embodiment, solution evaporation methods are used to deposit a crystalline coating of an anti-inflammatory steroid on a medical electrode. Heat applied at a controlled temperature, for a predetermined amount of time, induces a solid-state phase change of the drug coating providing a smooth, uniform, well-attached, conformable coating to form a layer that will elute from the electrode over time when implanted in a patient's body.
摘要翻译：提供了一种用药物涂覆医疗器械的方法。将能量，优选热能施加到医疗装置表面上的药物的结晶沉积物以增加分子迁移率并形成具有低密度的微裂纹和其它可能降解涂层的机械缺陷的适形药物涂层韧性和对装置表面的有效粘附。在优选的实施方案中，使用溶液蒸发方法将抗炎类固醇的结晶涂层沉积在医用电极上。在受控温度下施加的热量达预定时间量，引起药物涂层的固态相变，提供平滑，均匀，良好附着的贴合涂层，以形成随时间从电极洗脱的层植入患者的身体。

68. 发明申请

US20040020427A1 Device and process for liquid treatment of wafer-shaped articles 有权
标题翻译：晶片状物品的液体处理装置及方法
公开(公告)号：US20040020427A1
公开(公告)日：2004-02-05
申请号：US10632962
申请日：2003-08-04
申请人： SEZ AG
发明人： Kurt Langen
IPC分类号： B05C013/00
CPC分类号： H01L21/68735 , H01L21/67051 , H01L21/67057 , H01L21/6708 , Y10S134/902
摘要： A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
摘要翻译：将液体施加到第一表面的边缘附近的晶片状物品，特别是晶片的限定区域液体处理的装置基本上沿径向流动到外部的外围边缘晶片状制品，并且在该边缘周围的第二表面上，液体润湿在第二表面上的边缘附近的限定部分，随后从晶片状制品上移除。

69. 发明申请

US20030217693A1 Substrate support assembly having an edge protector 审中-公开
标题翻译：基板支撑组件，具有边缘保护器
公开(公告)号：US20030217693A1
公开(公告)日：2003-11-27
申请号：US10267987
申请日：2002-10-08
申请人： Applied Materials, Inc.
发明人： Michael B. Rattner , Rolf A. Guenther , Jeffrey D. Chinn
IPC分类号： B05C013/00 , B05C021/00
CPC分类号： H01L21/68721 , H01L21/67075 , H01L21/68728 , H01L21/68735 , H01L21/68785
摘要： A substrate support assembly for processing a substrate in a processing chamber comprises a substrate carrier having a bottom surface positioned in contact with a substrate support. The substrate carrier has a recess formed into a top surface. The recess has a support surface and a support region between the bottom surface and the support surface. A shadow ring is positioned proximate the substrate carrier to partially shield the support surface of the substrate carrier.
摘要翻译：用于处理处理室中的衬底的衬底支撑组件包括具有与衬底支撑件接触的底表面的衬底载体。衬底载体具有形成为顶表面的凹部。凹部具有支撑表面和底表面与支撑表面之间的支撑区域。阴影环定位成靠近衬底载体以部分地屏蔽衬底载体的支撑表面。

70. 发明申请

US20030183340A1 Fixing structures and supporting structures of ceramic susceptors, and supporting members thereof 有权
标题翻译：陶瓷基座的固定结构和支撑结构及其支撑构件
公开(公告)号：US20030183340A1
公开(公告)日：2003-10-02
申请号：US10395536
申请日：2003-03-24
申请人： NGK Insulators, Ltd.
发明人： Kazuaki Yamaguchi , Yoshinobu Goto
IPC分类号： B05C013/00 , H01L021/306 , C23C016/00
CPC分类号： H01L21/68792 , B32B2315/02 , C04B37/005 , C04B2237/066 , Y10T279/23
摘要： A supporting structure is provided to reduce thermal stress in the joining portion of a ceramic susceptor and supporting member and to prevent joining defects in the joining face so that fine cracks or gas leakage in the joining portion may be prevented. The supporting structure has a ceramic susceptor 1A to be heated and having mounting face 2a and back face 2b. A supporting member 3 is joined with the back face 2b of the susceptor 1A. The supporting member 3 has an outer wall surface 3h, a joining face joined with the susceptor and an end face opposite to the joining face. A curved part 20 is formed between the outer wall surface 3h and back face 2b, and has a radius of curvature R of not smaller than 4 mm and not larger than 25 mm in the longitudinal direction of the supporting member 3. Furthermore, the width D1 of the joining face 3b at the outer profile thereof is smaller than the width D2 of the end face 3f at the outer profile thereof.
摘要翻译：提供支撑结构以减少陶瓷基座和支撑构件的接合部分中的热应力并且防止接合面中的接合缺陷，从而可以防止接合部分中的细小裂缝或气体泄漏。支撑结构具有待加热的陶瓷基座1A，并具有安装面2a和背面2b。支撑构件3与基座1A的背面2b接合。支撑构件3具有外壁面3h，与基座接合的接合面和与接合面相反的端面。在外壁表面3h和背面2b之间形成弯曲部分20，并且在支撑构件3的纵向上具有不小于4mm且不大于25mm的曲率半径R。此外，宽度接合面3b的外轮廓的D1小于端面3f的外轮廓的宽度D2。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式