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61. 发明申请

WO2015048973A1 COOLING SYSTEM WITH THERMOSIPHON, USE AND METHOD OF OPERATING SUCH A SYSTEM 审中-公开
标题翻译：冷却系统与热管，使用和操作这种系统的方法
公开(公告)号：WO2015048973A1
公开(公告)日：2015-04-09
申请号：PCT/DK2014/050307
申请日：2014-10-01
申请人： DANTHERM COOLING A/S
发明人： ESPERSEN, Morten
IPC分类号： F28D15/02 , H05K7/20
CPC分类号： H05K7/20245 , F28D15/0266 , F28D15/06 , F28F27/00
摘要： A cooling system (2) comprising at least one thermosiphon (3) which thermsiphon (3) comprises a valve (18) is disclosed. It is the object of the invention to achieve a limited flow of liquid refrigerant from the condenser (10) back to the evaporator (4) in situations where the valve (18) is forced to open by high pressure of liquid refrigerant above the valve (18). This can be achieved by a second tubing (16) of the cooling system (2) comprising at least one liquid storage volume (20) for storing liquid refrigerant, which liquid storage volume (20) is placed between the valve (18) and the evaporator (4), which liquid storage volume (20) comprises an inlet (22) connected to the valve (18) and an outlet (24) connected to the evaporator (4), which outlet (24) comprises at least one flow restriction (26), which liquid storage volume (20) reduces any effect of rapid opening of the valve (18) to prevent flooding of the evaporator (4). Hereby can thermo shock in the evaporator (4) be prevented because the storage volume will in critical situations fill up the storage with cold liquid refrigerant and reduce the flow back to the evaporator (4) so that only small amount of liquid refrigerant is flowing to the evaporator (4) where normal operation therefore can be performed because flooding of the evaporator (4) is avoided. In a normal situation for the operation of the thermosiphon (3) the extra volume has a very limited effect on the function.
摘要翻译：公开了一种包括至少一个热虹吸管（3）的冷却系统（2），其中热虹吸管（3）包括阀门（18）。本发明的目的是在液体制冷剂从冷凝器（10）返回到蒸发器（4）的有限流动的情况下，其中阀门（18）被迫通过阀上方的高压液体制冷剂打开 18）。这可以通过冷却系统（2）的第二管道（16）来实现，所述第二管道（16）包括用于存储液体制冷剂的至少一个液体存储容积（20），所述液体储存容积（20）被放置在阀（18）和蒸发器（4），所述液体储存容积（20）包括连接到所述阀（18）的入口（22）和连接到所述蒸发器（4）的出口（24），所述出口（24）包括至少一个流动限制（26），所述液体储存容积（20）减少了所述阀（18）的快速打开的任何影响，以防止蒸发器（4）的溢流。因此，可以防止蒸发器（4）中的热冲击，因为在危急情况下的储存容积将冷却液体制冷剂填充在储存器中并减少流向蒸发器（4）的流动，使得只有少量的液体制冷剂流入因此避免了因蒸发器（4）的溢流而正常操作的蒸发器（4）。在正常情况下，热虹吸（3）的操作，额外的体积对功能的影响非常有限。

62. 发明申请

WO2012051510A3 ACTIVELY COOLED ELECTRICAL CONNECTION 审中-公开
标题翻译：电动冷却电气连接
公开(公告)号：WO2012051510A3
公开(公告)日：2014-04-10
申请号：PCT/US2011056319
申请日：2011-10-14
申请人： MARK GREGORY THOMAS
发明人： MARK GREGORY THOMAS
IPC分类号： H01R4/60
CPC分类号： H01R13/005 , B60L11/1809 , B60L11/1816 , B60L11/1818 , B60L2230/12 , G06F1/20 , H01R9/11 , H01R13/00 , H02J7/0042 , H05K7/20245 , H05K7/20272 , Y02T10/7005 , Y02T10/7088 , Y02T90/121 , Y02T90/14
摘要： A method and electrical connection for providing electrical power is disclosed. The electrical connection comprises an electrical connector connected to an electrical conductor assembly. A current greater than a rated current capacity of at least one of the electrical connector and electrical conductor assembly may be passed through the electrical conductor assembly and electrical connector. The electrical connector and electrical conductor may be actively cooled with a flow of heat transfer medium flowing substantially along a length of the electrical conductor assembly and through the electrical connector to increase the current capacity of the electrical connection.
摘要翻译：公开了一种用于提供电力的方法和电连接。电连接包括连接到电导体组件的电连接器。大于电连接器和电导体组件中的至少一个的额定电流容量的电流可以通过电导体组件和电连接器。电连接器和电导体可以通过基本上沿着电导体组件的长度流动并通过电连接器流动的传热介质流动而被冷却，以增加电连接的电流容量。

63. 发明申请

WO2010150064A1 HEAT SPREADING DEVICE AND METHOD THEREFORE 审中-公开
标题翻译：热传递装置及其方法
公开(公告)号：WO2010150064A1
公开(公告)日：2010-12-29
申请号：PCT/IB2010/001351
申请日：2010-05-18
申请人： HUAWEI TECHNOLOGIES CO. LTD. , TSOI, Vadim , HENNINGSSON, Uno , HONG, Yu Ping , PENG, Feng , YANG, Hua , LI, Hai Peng
发明人： TSOI, Vadim , HENNINGSSON, Uno , HONG, Yu Ping , PENG, Feng , YANG, Hua , LI, Hai Peng
IPC分类号： H05K7/20
CPC分类号： F28F21/084 , F28D15/0233 , F28D15/0283 , F28F3/048 , F28F13/06 , H01L23/427 , H01L2924/0002 , H05K7/20245 , H05K7/20336 , Y10T29/4935 , H01L2924/00
摘要： A heat spreading device comprises a section forming a first chamber portion and a second chamber portion, a plurality of first onduits (Hn, 12n), and at least two second conduits (13, 14) An interconnection of the first and second chamber portions is provided by he at least two second conduits Integral parts/portions are provided, such as cavities (4), barriers (1108) and fins (23)
摘要翻译：散热装置包括形成第一室部分和第二室部分的部分，多个第一导管（Hn，12n）和至少两个第二导管（13,14）。第一和第二室部分的互连是由他提供至少两个第二导管提供整体部分/部分，例如空腔（4），屏障（1108）和翅片（23）

64. 发明申请

WO1989002569A1 THERMOSIPHON 审中-公开
标题翻译：热虹吸
公开(公告)号：WO1989002569A1
公开(公告)日：1989-03-23
申请号：PCT/CH1988000152
申请日：1988-09-06
申请人： HASLER AG , ULRICH, Bohdan
发明人： HASLER AG
IPC分类号： F29D15/02
CPC分类号： H05K7/20245
摘要： A thermosiphon (50) comprises a pressure-sealed closed vessel (51) divided into a flat heat-absorbing region (52) and a tubular heat-output region (54) arranged at the side of the latter. The thermosiphon (50) as a whole is filled with a boiling liquid (59) so that the heat-absorbing region (52) is completely filled and the heat-output region (54) is filled up to a small fluid-free zone (28) with the boiling liquid. A cooling pipe (62) which conveys a cooling liquid is arranged in the heat-output region (54) so as to be completely surrounded by the wall of the siphon vessel (51) as far as the pipe connections (55, 56). A plurality of these horizontally-mounted thermosiphons (50) is used in a main frame computer for conveying the heat lost to the frame by the computer to a central cooling circuit.
摘要翻译：热虹吸（50）包括被分成扁平吸热区域（52）的压力密封的密闭容器（51）和布置在其上的管状热输出区域（54）。热虹吸管（50）整体上充满沸腾的液体（59），使得吸热区域（52）被完全填充，并且热输出区域（54）被填充到小的无流体区域 28）与沸腾的液体。输送冷却液的冷却管（62）配置在热输出区域（54）内，以使其被虹吸管（51）的壁完全包围，直至管连接部（55,56）为止。多个这些水平安装的热虹吸管（50）用于主框架计算机中，用于将由计算机输送到框架的热量输送到中央冷却回路。

65. 发明申请

WO2016053227A1 FAN CONTROLLED AMBIENT AIR COOLING OF EQUIPMENT IN A CONTROLLED AIRFLOW ENVIRONMENT 审中-公开
标题翻译：控制气流环境下风机控制设备的空气冷却
公开(公告)号：WO2016053227A1
公开(公告)日：2016-04-07
申请号：PCT/US2014/057949
申请日：2014-09-29
申请人： HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
发明人： RAU, Timothy M. , NEUMANN, Matthew
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20745 , G05B15/02 , G06F1/20 , H05K7/20145 , H05K7/20172 , H05K7/20181 , H05K7/20245 , H05K7/20736 , H05K7/20772 , H05K7/20836
摘要： In some examples, a system uses ambient air from outside a controlled airflow environment to cool equipment within the controlled airflow environment. The system can include ductwork that seals the ambient air from air outside of the ductwork within the controlled airflow environment. The system can further include a passive heat exchanger connected to the equipment and extending into an interior of the ductwork to allow heat exchange between the equipment and the ambient air. The system can further include a fan to flow the ambient air through the ductwork, the fan being connectable to the equipment to allow the equipment to control the operation of the fan.
摘要翻译：在一些示例中，系统使用来自受控气流环境之外的环境空气来冷却受控气流环境中的设备。该系统可以包括在受控气流环境中将环境空气与管道系统外部的空气密封的管道系统。该系统还可以包括连接到设备并延伸到管道系统的内部的被动热交换器，以允许设备和环境空气之间的热交换。该系统还可以包括风扇以使环境空气流过管道系统，风扇可连接到设备，以允许设备控制风扇的操作。

66. 发明申请

WO2014184300A3 A SUBSEA UNIT WITH CONDUCTION AND CONVECTION COOLING 审中-公开
标题翻译：具有导电和对流冷却的SUBSEA单元
公开(公告)号：WO2014184300A3
公开(公告)日：2015-05-28
申请号：PCT/EP2014059970
申请日：2014-05-15
申请人： ABB TECHNOLOGY LTD
发明人： KOLSTAD HELGE , WIIK JAN
IPC分类号： E21B41/00 , E21B47/01 , H05K7/20
CPC分类号： H05K7/20245 , E21B41/0007 , E21B47/011 , H05K7/20236 , H05K7/2039 , H05K7/20927
摘要： The present disclosure relates to a subsea unit (10; 12; 14; 16; 18) comprising a housing (20) containing a dielectric liquid (30), a first heat generating component (40) and a second heat generating component (50). The first heat generating component (40) is arranged in thermal connection with the housing (20) and the second heat generating component (50) is arranged at a distance from the housing (20). A method of cooling heat generating components contained in a housing of a subsea unit is also presented.
摘要翻译：本公开涉及一种包括包含电介质液体（30）的壳体（20），第一发热部件（40）和第二发热部件（50）的海底单元（10; 12; 14; 16; 18）。第一发热部件（40）被布置成与壳体（20）热连接，并且第二发热部件（50）布置成与壳体（20）一定距离。还提供了一种冷却包含在海底单元的壳体中的发热部件的方法。

67. 发明申请

WO2014184300A2 A SUBSEA UNIT WITH CONDUCTION AND CONVECTION COOLING 审中-公开
标题翻译：具有导电和对流冷却的SUBSEA单元
公开(公告)号：WO2014184300A2
公开(公告)日：2014-11-20
申请号：PCT/EP2014/059970
申请日：2014-05-15
申请人： ABB TECHNOLOGY LTD
发明人： KOLSTAD, Helge , WIIK, Jan
CPC分类号： H05K7/20245 , E21B41/0007 , E21B47/011 , H05K7/20236 , H05K7/2039 , H05K7/20927
摘要： The present disclosure relates to a subsea unit (10; 12; 14; 16; 18) comprising a housing (20) containing a dielectric liquid (30), a first heat generating component (40) and a second heat generating component (50). The first heat generating component (40) is arranged in thermal connection with the housing (20) and the second heat generating component (50) is arranged at a distance from the housing (20). A method of cooling heat generating components contained in a housing of a subsea unit is also presented.
摘要翻译：本公开涉及一种包括包含电介质液体（30）的壳体（20），第一发热部件（40）和第二发热部件（50）的海底单元（10; 12; 14; 16; 18）。第一发热部件（40）被布置成与壳体（20）热连接，并且第二发热部件（50）布置成与壳体（20）一定距离。还提供了一种冷却包含在海底单元的壳体中的发热部件的方法。

68. 发明申请

WO2006071790A2 COMMUNICATION SYSTEMS INCORPORATING CONTROL MESHES 审中-公开
标题翻译：通讯系统管理控制网
公开(公告)号：WO2006071790A2
公开(公告)日：2006-07-06
申请号：PCT/US2005046841
申请日：2005-12-21
申请人： CH CAPITAL INC AKA CH CAPITAL , POPVICH JOHN M
发明人： POPVICH JOHN M
IPC分类号： H04B10/20
CPC分类号： F28F1/405 , F28F1/122 , F28F3/022 , H01L23/473 , H01L2224/29499 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12041 , H04B10/00 , H05K7/20245 , H01L2924/00
摘要： The method of communicating with circuitry that includes providing a woven mesh having elongated conductive elements extending in array forming directions relative to the circuitry, establishing communication sites associated with the mesh elements, located in spaced apart relation, and operating the sites via the mesh to communicate optically with the circuitry, having detection capability.
摘要翻译：与电路通信的方法包括提供具有相对于电路在阵列形成方向上延伸的细长导电元件的编织网，建立与网格元件相关联的与间隔开关系的通信位置，以及经由网格操作该位点以进行通信与电路光学地具有检测能力。

69. 发明申请

WO2018170217A1 NATURAL CONVECTION COOLING FOR POWER ELECTRONICS SYSTEMS HAVING DISCRETE POWER DISSIPATION COMPONENTS 审中-公开
公开(公告)号：WO2018170217A1
公开(公告)日：2018-09-20
申请号：PCT/US2018/022566
申请日：2018-03-15
申请人： AMERICAN SUPERCONDUCTOR CORPORATION
发明人： YUAN, Jie , HANSEN, Peter , BRUBAKER, John , FLANNERY, Patrick , WINN, Peter
IPC分类号： H02J3/18 , H02B1/56 , H05K7/18 , H05K7/20 , H02B1/26
CPC分类号： H05K7/20245 , F28D2021/0031 , H01F27/125 , H05K7/20236 , H05K7/209 , H05K7/20927
摘要： A power electronics based system using natural, convection cooling, includes an enclosure housing a plurality of discrete components distributed in a vertical direction from a bottom portion to a top portion of the enclosure and having a heat density weighted average center at a first height along the vertical direction. There is a heat exchanger adjacent to the enclosure, including an inlet port and an outlet port in fluid communication with the enclosure. The heat exchanger has a vertical cooling average center at a second height. There is a cooling fluid disposed in the enclosure and in the heat exchanger to cool the discrete components. The discrete components are positioned in the vertical direction in the enclosure such that the first height of the heat density weighted average center along the vertical direction is below the second height of the vertical cooling average center of the heat exchanger.

70. 发明申请

WO2015000699A1 CANISTER COOLING 审中-公开
标题翻译：冰箱冷却
公开(公告)号：WO2015000699A1
公开(公告)日：2015-01-08
申请号：PCT/EP2014/062720
申请日：2014-06-17
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： VOLENT, Kjetil Zsolt , KRISTIANSEN, Karstein
IPC分类号： H05K5/06 , H05K7/20
CPC分类号： H05K5/06 , H05K7/20127 , H05K7/20245
摘要： The present invention relates to a canister (100) for housing an electronic component (140). The canister (100) comprises a wall section with an inner wall surface which is directed to an inner volume (Vi) of the canister (100), wherein the inner wall surface comprises an air guiding structure with at least one air guiding channel (101) for guiding air inside the inner volume (Vi) along the inner wall surface.
摘要翻译：本发明涉及一种用于容纳电子部件（140）的罐（100）。罐（100）包括壁部分，内壁表面指向罐（100）的内部容积（Vi），其中内壁表面包括具有至少一个空气引导通道（101）的空气引导结构），用于沿着内壁表面引导内部容积（Vi）内的空气。

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