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61. 发明申请

US20150207216A1 WIRELESS MODULE 审中-公开
标题翻译：无线模块
公开(公告)号：US20150207216A1
公开(公告)日：2015-07-23
申请号：US14420247
申请日：2014-05-23
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Suguru Fujita , Ryosuke Shiozaki , Kentaro Watanabe
IPC分类号： H01Q1/40
CPC分类号： H01Q1/40 , H01L23/49838 , H01L23/49855 , H01L23/66 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15313 , H01L2924/15323 , H01L2924/15333 , H01Q1/2283 , H05K1/0243 , H05K1/186 , H05K2201/10098 , H01L2924/00
摘要： A wireless module capable of preventing deterioration of the antenna characteristics is provided. The wireless module includes a substrate including a first substrate, an antenna unit disposed on one end side of the substrate, a conductive member disposed on the other end side of one of two surfaces of the first substrate, and a molding section that covers the one of the two surfaces of the first substrate.
摘要翻译：提供能够防止天线特性恶化的无线模块。无线模块包括：基板，包括第一基板，设置在基板的一端侧的天线单元;布置在第一基板的两个表面中的一个的另一端侧的导电部件;以及模制部，的第一衬底的两个表面。

62. 发明申请

US20150133001A1 METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION 审中-公开
标题翻译：用于微地板阵列制造的金属冶金方法
公开(公告)号：US20150133001A1
公开(公告)日：2015-05-14
申请号：US14482242
申请日：2014-09-10
申请人： International Business Machines Corporation
发明人： Gareth Hougham , Gerard McVicker , Xiaoxiong Gu
IPC分类号： H01L23/00 , H01R13/02 , H01R13/24 , H01L25/00 , H01L21/48
CPC分类号： H01L24/14 , H01L21/486 , H01L23/48 , H01L23/49827 , H01L24/11 , H01L24/17 , H01L24/81 , H01L25/50 , H01L2224/11622 , H01L2224/1182 , H01L2224/13014 , H01L2224/13017 , H01L2224/1607 , H01L2224/16145 , H01L2224/81101 , H01L2224/81208 , H01L2224/81899 , H01L2225/06513 , H01L2924/0002 , H01L2924/12042 , H01L2924/15313 , H01L2924/15323 , H01L2924/15333 , H01R13/02 , H01R13/2421 , H01R43/16 , H05K3/064 , H05K3/326 , H05K3/4092 , H05K2201/0355 , H05K2201/0382 , H05K2201/10265 , H05K2201/10378 , Y10T29/49126 , Y10T29/49208 , Y10T29/49218 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.
摘要翻译：一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。具有彼此成镜像关系的第一和第二部分的螺旋形接触件。

63. 发明授权

US08558637B2 Circuit device with signal line transition element 有权
标题翻译：具有信号线过渡元件的电路装置
公开(公告)号：US08558637B2
公开(公告)日：2013-10-15
申请号：US12778130
申请日：2010-05-12
申请人： Duixian Liu , Ho-Chung Chen , Brian Allan Floyd
发明人： Duixian Liu , Ho-Chung Chen , Brian Allan Floyd
IPC分类号： H03H7/38
CPC分类号： H01P5/028 , H01L2223/6677 , H01L2224/16227 , H01L2224/73253 , H01L2924/15153 , H01L2924/15313 , H01L2924/15323
摘要： A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.
摘要翻译：电路装置包括多层电路载体，第一信号传输线，第二信号传输线，信号线过渡元件，第一阻抗变压器和第二阻抗变压器。多层电路载体包括第一层和第二层。第一信号传输线在第一层的表面上。第二信号传输线在第二层的表面上。信号线过渡元件通过第一层和第二层，并具有第一信号端和第二信号端。第一阻抗变换器位于第一层的表面上并电连接在第一信号传输线和第一信号端之间。第二阻抗变换器位于第二层的表面上并电连接在第二信号传输线和第二信号端之间。

64. 发明申请

US20110128100A1 HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE WIRING BOARD 有权
标题翻译：高频接线板和使用接线板的高频模块
公开(公告)号：US20110128100A1
公开(公告)日：2011-06-02
申请号：US12674221
申请日：2008-07-24
申请人： Risato Ohhira
发明人： Risato Ohhira
IPC分类号： H01P3/08
CPC分类号： H05K1/0219 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2224/48091 , H01L2224/48227 , H01L2924/01019 , H01L2924/09701 , H01L2924/15192 , H01L2924/15313 , H01L2924/15323 , H01L2924/16195 , H01L2924/19033 , H01L2924/3011 , H01P1/047 , H01P3/08 , H05K1/0253 , H05K1/0298 , H05K2201/0715 , H05K2201/093 , H05K2201/09363 , H05K2201/09618 , H05K2201/09663 , H01L2924/00014 , H01L2924/00
摘要： The high-frequency wiring board of the present invention includes: first coplanar lines provided with a first signal line and a first planar ground pattern formed on the same wiring layer as the first signal line; second coplanar lines provided with a second signal line formed on a different wiring layer than the first signal line and a second planar ground pattern formed on the same wiring layer as the second signal line; and a first ground pattern formed on the same wiring layer as the first coplanar lines. The first coplanar lines and the second coplanar lines are connected. At least the first ground pattern and the first planar ground pattern are separated in a region following the second signal line from the connection of the first signal line and the second signal line.
摘要翻译：本发明的高频布线基板包括：第一共面线，设置有与第一信号线在同一布线层上形成的第一信号线和第一平面接地图案; 第二共面线设置有形成在与第一信号线不同的布线层上的第二信号线和形成在与第二信号线相同的布线层上的第二平面接地图案; 以及形成在与第一共面线相同的布线层上的第一接地图案。第一共面线和第二共面线被连接。至少第一接地图案和第一平面接地图案在第二信号线之后的区域中与第一信号线和第二信号线的连接分开。

65. 发明申请

US20090256752A1 RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES 有权
标题翻译：无线电频率（RF）集成电路（IC）包装与环形和/或偏移CAVIENS中的集成光纤耦合天线
公开(公告)号：US20090256752A1
公开(公告)日：2009-10-15
申请号：US12102051
申请日：2008-04-14
申请人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q9/04 , H01P11/00
CPC分类号： H01Q21/065 , G06K19/07749 , G06K19/07786 , H01L23/3121 , H01L23/66 , H01L2223/6677 , H01L2224/16 , H01L2224/16227 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15323 , H01Q1/2283 , H01Q1/38 , H01Q9/0457 , H01Q21/061 , H01Q23/00 , Y10T29/49016
摘要： A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.
摘要翻译：射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。。接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线其中N个大体平面的贴片位于其中。还公开了“岛”和“偏移”结构以及制造方法。

66. 发明授权

US06838759B1 Small memory card 失效
标题翻译：小存储卡
公开(公告)号：US06838759B1
公开(公告)日：2005-01-04
申请号：US10705801
申请日：2003-11-10
申请人： Pierre Liu
发明人： Pierre Liu
IPC分类号： G06K19/02 , G06K19/077 , H05K1/02 , H05K1/11 , H05K3/28 , H01L23/02
CPC分类号： G06K19/07703 , G06K19/02 , G06K19/07743 , H01L2224/48091 , H01L2224/48227 , H01L2924/15323 , H05K1/0269 , H05K1/117 , H05K3/284 , H05K2201/10106 , H05K2201/10159
摘要： A small memory card with a monitor includes a substrate, at least one memory chip, at least one monitor, and a glue layer. The substrate is formed with an upper surface and a lower surface, the upper surface is formed with a plurality of connected points and a plurality of golden fingers electrically connected to the plurality of connected points. The substrate is used to arrange in an electric device, the memory chip, which is mounted on the upper surface of the substrate, electrically connected to the plurality of connected points of the upper surface. The monitor is mounted on the side of the upper surface of the substrate, so that the aspect and location of the plurality of the golden fingers may be recognized. The glue layer is encapsulated and protected the memory chip. Thus, the display of the monitor may be recognized the operating aspect.
摘要翻译：具有监视器的小存储卡包括基板，至少一个存储芯片，至少一个监视器和胶层。基板形成有上表面和下表面，上表面形成有多个连接点和多个金指，电连接到多个连接点。基板用于布置在电气装置中，安装在基板的上表面上的存储芯片电连接到上表面的多个连接点。显示器安装在基板的上表面的一侧，从而可以识别多个金手指的方面和位置。胶层被封装并保护存储芯片。因此，监视器的显示可以被识别为操作方面。

67. 发明申请

US20030025572A1 Antenna duplexer and communication apparatus 失效
标题翻译：天线双工器和通信设备
公开(公告)号：US20030025572A1
公开(公告)日：2003-02-06
申请号：US10202799
申请日：2002-07-25
发明人： Tomoya Maekawa , Hiroyuki Nakamura , Toru Yamada , Toshio Ishizaki
IPC分类号： H03H007/46
CPC分类号： H01P1/2135 , H01L2223/6677 , H01L2224/16227 , H01L2224/81192 , H01L2924/15153 , H01L2924/15159 , H01L2924/15192 , H01L2924/15313 , H01L2924/15323 , H01L2924/3511 , H03H9/0576 , H03H9/725 , H03H2007/013
摘要： An antenna duplexer has a receiving filter having a surface acoustic wave device; a transmitting filter having a dielectric resonator; and a matching circuit for matching the receiving filter and the transmitting filter with an antenna respectively, wherein the transmitting filter, receiving filter, and matching circuit are integrated with each other.
摘要翻译：天线双工器具有具有表面声波装置的接收滤波器; 具有介质谐振器的发射滤波器; 以及用于将接收滤波器和发射滤波器分别与天线匹配的匹配电路，其中发射滤波器，接收滤波器和匹配电路彼此集成。

68. 发明申请

WO2015115388A1 圧電デバイス用パッケージ及び圧電デバイス审中-公开
标题翻译：压电元件封装和压电器件
公开(公告)号：WO2015115388A1
公开(公告)日：2015-08-06
申请号：PCT/JP2015/052094
申请日：2015-01-27
申请人：日本電波工業株式会社
发明人：浅水孝司
IPC分类号： H01L23/12 , H01L23/08 , H03B5/32 , H03H9/02 , H03H9/10
CPC分类号： H03H9/1021 , H01L23/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/16227 , H01L2924/00014 , H01L2924/15156 , H01L2924/15313 , H01L2924/15323 , H01L2924/16195 , H03H9/0547 , H03H9/0552 , H01L2224/05599
摘要：　圧電振動片をパッケージ本体に搭載する際、圧電振動片の裏面に沿って拡がる接着剤の流れの方向を規制することにより、接着剤が振動部に向けて拡がるのを抑制し、圧電振動片のＣＩ値の悪化を防止する。　圧電振動片５０を保持するパッケージ本体１０ａを有し、圧電振動片５０に形成された励振電極５３、５４と電気的に接続される接続電極２３、２４をパッケージ本体１０ａに備える圧電デバイス用パッケージ１０であって、接続電極２３、２４は、パッケージ本体１０ａに保持される圧電振動片５０の振動部５１側を切り欠いた状態の切り欠き部２５、２６を備える。
摘要翻译：在本发明中，当在主包装体中安装压电振动片时，通过限制粘合剂沿着压电振动片的后表面扩散的方向来缓和粘合剂到振动单元的扩散，并且CI值可以防止压电振动片的恶化。一种压电器件封装（10）具有用于保持压电振荡片（50）的主封装体（10a）和与形成在压电振荡器上的激励电极（53,54）电连接的连接电极（23,24）片（50）设置在主包装体（10a）中。连接电极（23,24）设置有形成在保持在主包装体（10a）中的压电振荡片（50）的振荡部（51）侧的切口（25,26）。

69. 发明申请

WO2011142769A1 CIRCUIT DEVICE WITH SIGNAL LINE TRANSITION ELEMENT 审中-公开
标题翻译：具有信号线过渡元件的电路装置
公开(公告)号：WO2011142769A1
公开(公告)日：2011-11-17
申请号：PCT/US2010/035491
申请日：2010-05-20
申请人： MEDIATEK INC. , INTERNATIONAL BUSINESS MACHINES CORPORATION , LIU, Duixian , CHEN, Ho-Chung , FLOYD, Brian Allan
发明人： LIU, Duixian , CHEN, Ho-Chung , FLOYD, Brian Allan
IPC分类号： H01Q13/10
CPC分类号： H01P5/028 , H01L2223/6677 , H01L2224/16227 , H01L2224/73253 , H01L2924/15153 , H01L2924/15313 , H01L2924/15323
摘要： A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.
摘要翻译：电路装置包括多层电路载体，第一信号传输线，第二信号传输线，信号线过渡元件，第一阻抗变压器和第二阻抗变压器。多层电路载体包括第一层和第二层。第一信号传输线在第一层的表面上。第二信号传输线在第二层的表面上。信号线过渡元件通过第一层和第二层，并具有第一信号端和第二信号端。第一阻抗变换器位于第一层的表面上并电连接在第一信号传输线和第一信号端之间。第二阻抗变换器位于第二层的表面上并电连接在第二信号传输线和第二信号端之间。

70. 发明申请

WO2011054554A1 METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION 审中-公开
标题翻译：用于微地板阵列制造的金属冶金方法
公开(公告)号：WO2011054554A1
公开(公告)日：2011-05-12
申请号：PCT/EP2010/061902
申请日：2010-08-16
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , HOUGHAM, Gareth, Geoffrey , MCVICKER, Gerard , GU, Xiaoxiong
发明人： HOUGHAM, Gareth, Geoffrey , MCVICKER, Gerard , GU, Xiaoxiong
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： H01L24/14 , H01L21/486 , H01L23/48 , H01L23/49827 , H01L24/11 , H01L24/17 , H01L24/81 , H01L25/50 , H01L2224/11622 , H01L2224/1182 , H01L2224/13014 , H01L2224/13017 , H01L2224/1607 , H01L2224/16145 , H01L2224/81101 , H01L2224/81208 , H01L2224/81899 , H01L2225/06513 , H01L2924/0002 , H01L2924/12042 , H01L2924/15313 , H01L2924/15323 , H01L2924/15333 , H01R13/02 , H01R13/2421 , H01R43/16 , H05K3/064 , H05K3/326 , H05K3/4092 , H05K2201/0355 , H05K2201/0382 , H05K2201/10265 , H05K2201/10378 , Y10T29/49126 , Y10T29/49208 , Y10T29/49218 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.
摘要翻译：一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。具有彼此成镜像关系的第一和第二部分的螺旋形接触件。

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