专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US08188154B2 Decomposition reaction apparatus, system for producing raw material for recycled resin composition, method for producing raw material for recycled resin composition, raw material for recycled resin composition, and formed article 有权
标题翻译：分解反应装置，再生树脂组合物原料的制造系统，再生树脂组合物的原料的制造方法，再生树脂组合物的原料，成形体
公开(公告)号：US08188154B2
公开(公告)日：2012-05-29
申请号：US11667107
申请日：2005-10-07
申请人： Junya Goto , Sumiya Miyake , Masaki Ishikawa , Kazunori Shimoyachi
发明人： Junya Goto , Sumiya Miyake , Masaki Ishikawa , Kazunori Shimoyachi
IPC分类号： C08J11/04 , B01J8/00
CPC分类号： C08J11/18 , B01J3/00 , B01J3/008 , B01J4/008 , B01J19/20 , B01J19/243 , B01J2219/00033 , B01J2219/0009 , B01J2219/00135 , B01J2219/00162 , B01J2219/00164 , B01J2219/00166 , B01J2219/00168 , B01J2219/00184 , B01J2219/00252 , B01J2219/185 , B01J2219/1944 , Y02P20/544 , Y02P20/582 , Y02W30/706
摘要： A decomposition reaction apparatus for the decomposition treatment of a thermosetting resin, which comprises a reaction apparatus comprising an introduction section for introducing a resin composition containing the thermosetting resin and a solvent containing a monomer component of the thermosetting resin or a component similar to the monomer component, a decomposition reaction section for heating and pressuring the resin composition and the above solvent so as for the solvent to have a supercritical state or a subcritical state, to thereby prepare a treated and recovered product containing a recycled resin formed by the reduction of the molecular weight of the above thermosetting resin, and a discharge section for discharging the treated and recovered product. In the above reaction apparatus, the introduction of the resin composition and the solvent, the decomposition treatment of the thermosetting resin in the decomposition reaction section and the discharge of the treated and recovered product from the discharge section are all carried out continuously, and therefore, a raw material for a recycled resin composition using an industrial or general waste containing a thermosetting resin as the above resin composition can be produced continuously.
摘要翻译：一种用于热固性树脂的分解处理的分解反应装置，其包括反应装置，该反应装置包括用于引入含有热固性树脂的树脂组合物的引入部分和含有热固性树脂的单体组分的溶剂或类似于单体组分的组分，用于对树脂组合物和上述溶剂进行加压和加压以使溶剂具有超临界状态或亚临界状态的分解反应部分，从而制备含有通过还原分子形成的再循环树脂的处理和回收产物上述热固性树脂的重量，以及用于排出经处理和回收的产品的排出部分。在上述反应装置中，引入树脂组合物和溶剂，分解反应部中的热固性树脂的分解处理和从排出部排出的处理回收产物全部连续进行，可以连续生产使用含有热固性树脂的工业或一般废物作为上述树脂组合物的回收树脂组合物的原料。

62. 发明授权

US08169090B2 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same 有权
标题翻译：用于预应用的封装树脂组合物，用其制备的半导体器件及其制造方法
公开(公告)号：US08169090B2
公开(公告)日：2012-05-01
申请号：US11915806
申请日：2006-05-30
申请人： Satoru Katsurayama , Yushi Sakamoto , Masaya Koda
发明人： Satoru Katsurayama , Yushi Sakamoto , Masaya Koda
IPC分类号： H01L23/29
CPC分类号： C08G59/40 , C08G59/18 , C08L63/00 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2224/83856 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01059 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mmφ and at most 5 gf/5 mmφ, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability.
摘要翻译：一种用于预应用的封装树脂组合物，包括（a）环氧树脂和（b）具有助焊剂活性的固化剂，其中B阶段后的粘性至少为0gf / 5mm。至多为5gf /5mmφ，130℃下的熔融粘度为0.01Pa·s以上1.0Pa·s以下。使用该组合物的预先施加的封装组件和半导体器件及其制造方法。在半导体芯片的临时放置期间，树脂组合物不易受到空气滞留的影响，并且操作性和可靠性优异。

63. 发明申请

US20120070474A1 POLYMER COMPOUND FOR BIOMEDICAL USE AND BIOCHIP SUBSTRATE USING SUCH A POLYMER COMPOUND 有权
标题翻译：用于生物医学用途的聚合物化合物和使用这种聚合物化合物的生物基质
公开(公告)号：US20120070474A1
公开(公告)日：2012-03-22
申请号：US13306240
申请日：2011-11-29
申请人： Mitsutaka MATSUMOTO , Sumio SHIBAHARA , Takayuki MATSUMOTO , Kanehisa YOKOYAMA , Sohei FUNAOKA , Daisuke MASUDA , Michael Patrick COLEMAN , Dominic ZICHI
发明人： Mitsutaka MATSUMOTO , Sumio SHIBAHARA , Takayuki MATSUMOTO , Kanehisa YOKOYAMA , Sohei FUNAOKA , Daisuke MASUDA , Michael Patrick COLEMAN , Dominic ZICHI
IPC分类号： A61K31/711 , C09D143/04 , B05D3/00 , A61K31/715 , A61K38/17 , B05D5/00 , C08F230/08 , A61K9/00
CPC分类号： C08J7/047 , C08F220/28 , C08F220/30 , C08F220/36 , C08F220/38 , C08F2220/286 , C08F2220/306 , C08J2365/00 , C08J2443/00 , G01N33/54393 , Y10T428/31504 , Y10T428/31938
摘要： A biochip substrate capable of realizing the high detection accuracy by restricting a nonspecific adsorption or bonding of a substance to be detected, when used for a detection or analysis of protein, nucleic acids and the like. The biochip substrate is for fixing a biologically active substance on a surface of a solid substrate, and characterized in that it has a layer comprising a polymer compound obtained by copolymerizing an ethylenically unsaturated polymerizable monomer having an alkylene glycol residue, an ethylenically unsaturated polymerizable monomer having a functional group for fixing a biologically active substance and an ethylenically unsaturated polymerizable monomer having a cross-linkable functional group, on the surface of the substrate.
摘要翻译：一种生物芯片基板，当用于检测或分析蛋白质，核酸等时，能够通过限制待检测物质的非特异性吸附或结合来实现高检测精度。生物芯片基板用于将生物活性物质固定在固体基材的表面上，其特征在于，其具有包含通过使具有亚烷基二醇残基的烯属不饱和可聚合单体和具有亚烷基二醇残基的烯键式不饱和可聚合单体共聚得到的聚合物，用于固定生物活性物质的官能团和具有可交联官能团的烯属不饱和可聚合单体。

64. 发明申请

US20110308848A1 RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：接线板用树脂组合物，导线板用树脂片，复合体，生产复合体的方法及半导体器件
公开(公告)号：US20110308848A1
公开(公告)日：2011-12-22
申请号：US13148774
申请日：2010-02-08
申请人： Yuka Ito , Kenichi Kaneda , Yasuaki Mitsui , Iji Onozuka , Noriyuki Ohigashi , Hideki Hara
发明人： Yuka Ito , Kenichi Kaneda , Yasuaki Mitsui , Iji Onozuka , Noriyuki Ohigashi , Hideki Hara
IPC分类号： H05K1/18 , H05K3/00 , B32B3/00
CPC分类号： H05K3/045 , H05K3/107 , H05K3/281 , H05K3/421 , H05K3/465 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , Y10T29/49124 , Y10T428/24355
摘要： Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body.The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 μm or more and 10 μm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less, and/or wherein the resin layer has a via hole having a diameter of 1 μm or more and 25 μm or less; the electroconductive layer is inside the via hole; and a surface of the resin layer of the inside of the via hole has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less. The resin composition comprises an inorganic filler and a thermosetting resin, wherein the inorganic filler contains coarse particles having a diameter of more than 2 μm in an amount of 500 ppm or less. The resin sheet comprises a resin layer and a substrate, wherein the resin layer is on the substrate and comprises the resin composition.
摘要翻译：公开了一种复合体，该复合体的制造方法以及半导体装置，该复合体包括树脂层和在该树脂层中形成的精细布线和/或通孔，具有高粘合性和高可靠性，并且能够高频率。还公开了树脂组合物和树脂片，两者都可以提供这种复合体。复合体包括树脂层和导电层，其中在树脂层的表面上具有最大宽度为1μm以上且10μm以下的槽; 导电层在槽内; 并且与导电层接触的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下，和/或其中树脂层具有直径为1μm的通孔以上且25μm以下; 导电层在通孔内; 通孔内侧的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下。树脂组合物包含无机填料和热固性树脂，其中无机填料含有直径大于2μm的粗颗粒的量在500ppm以下。树脂片包括树脂层和基材，其中树脂层在基材上并包含树脂组合物。

65. 发明授权

US07999354B2 Resin composition, filling material, insulating layer and semiconductor device 失效
标题翻译：树脂组合物，填充材料，绝缘层和半导体器件
公开(公告)号：US07999354B2
公开(公告)日：2011-08-16
申请号：US12664003
申请日：2008-06-11
申请人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
发明人： Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
IPC分类号： H01L29/40
CPC分类号： C08L63/10 , H01L21/76898 , H01L23/481 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , Y10T428/24273 , H01L2924/014
摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.
摘要翻译：本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。本发明的填充材料由上述树脂组合物的固化物形成。本发明的绝缘层由上述树脂组合物的固化物形成。绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。本发明的半导体器件包括上述绝缘层。

66. 发明授权

US07977412B2 Epoxy resin composition and semiconductor device 有权
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：US07977412B2
公开(公告)日：2011-07-12
申请号：US12566732
申请日：2009-09-25
申请人： Yasuhiro Mizuno
发明人： Yasuhiro Mizuno
IPC分类号： C08K3/36 , C08K5/13 , C08L63/00 , H01L23/29
CPC分类号： H01L23/296 , C08L63/00 , C08L83/06 , H01L2924/0002 , Y10T428/31511 , C08L2666/04 , H01L2924/00
摘要： An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.
摘要翻译：一种用于封装半导体的环氧树脂组合物，其包含作为必要组分（A）环氧树脂，（B）酚醛树脂，（C）固化促进剂，（D）无机填料和（E）包含（e1）具有羧基的丁二烯 - 丙烯腈共聚物和/或（e2）（e1）具有羧基的丁二烯 - 丙烯腈共聚物与环氧树脂的反应产物，其中，环氧树脂组合物中的组分（e1）的含量为0.01〜 1重量％。该组合物在成型时表现出优异的脱模性能，连续成型性能和耐回焊性。

67. 发明授权

US07808083B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07808083B2
公开(公告)日：2010-10-05
申请号：US11663924
申请日：2005-09-29
申请人： Junya Kusunoki , Takashi Hirano
发明人： Junya Kusunoki , Takashi Hirano
IPC分类号： H01L23/48
CPC分类号： H01L23/3114 , C08G59/3218 , H01L23/293 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/00 , H01L2924/00014
摘要： Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like.
摘要翻译：公开了一种具有晶片级封装结构的半导体器件，其特征在于包含由在250℃以下可固化的树脂组合物构成的树脂层。具有晶片级封装结构的这种半导体器件的低应力性，耐溶剂性，低吸水性，电绝缘性，粘合性等优异。

68. 发明授权

US07780430B2 Mandrel, and apparatus and process for resin film production with mandrel 有权
标题翻译：心轴，以及用心轴制造树脂膜的装置和方法
公开(公告)号：US07780430B2
公开(公告)日：2010-08-24
申请号：US11795380
申请日：2006-01-18
申请人： Takeshi Takeuchi , Shingo Yoshida
发明人： Takeshi Takeuchi , Shingo Yoshida
IPC分类号： A01J21/02 , A21C3/04 , A23G1/20 , D01D5/24 , B29C39/14 , B29B15/00
CPC分类号： B29C55/285 , B29C47/0021 , B29C47/0026 , B29C47/003 , B29C47/34 , B29C47/8805 , B29C47/8815 , B29C47/883 , B29C47/8835 , B29C47/884 , B29C47/8845 , B29C47/90 , B29C47/903 , B29C47/906 , B29C2947/92514 , B29K2101/10
摘要： To provide an apparatus and method for producing a resin film product from a thermoplastic resin in a stable manner without damage to the product, wherein the resin film product is thin and has a uniform, flat surface.A mandrel 7 that comes into proximity or contact with the surface of a moving resin film to guide the movement of the resin film when a resin film in continuous form is continuously produced, the mandrel comprising: a mandrel main body 71 having an opening; and a guide part 72 that is composed of an elastic member attached to the opening 71a and that can advance and retract relative to the resin film, and an apparatus and method for producing a resin film using the mandrel.
摘要翻译：为了提供从热塑性树脂制备树脂薄膜产品的方法，其稳定的方式不会损坏产品，其中树脂薄膜产品薄而具有均匀的平坦表面。在连续形成连续形式的树脂膜时，与移动的树脂膜的表面接近或接触以引导树脂膜的运动的心轴7，心轴包括：具有开口的心轴主体71; 以及引导部72，其由附接到开口71a并且能够相对于树脂膜前进和缩回的弹性构件组成，以及使用该心轴制造树脂膜的装置和方法。

69. 发明申请

US20100065315A1 RESIN COMPOSITION, INSULATING SHEET WITH BASE, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 有权
标题翻译：树脂组合物，绝缘基片，PREPREG，多层印刷线路板和半导体器件绝缘片
公开(公告)号：US20100065315A1
公开(公告)日：2010-03-18
申请号：US12443822
申请日：2007-10-02
申请人： Michio KIMURA
发明人： Michio KIMURA
IPC分类号： H05K1/00 , B32B27/38 , C08K3/36 , C08L101/10 , C08G67/00
CPC分类号： H05K3/4626 , B32B5/022 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/16 , B32B27/18 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/0261 , B32B2262/0269 , B32B2262/0276 , B32B2262/0284 , B32B2262/10 , B32B2262/101 , B32B2264/102 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2307/308 , B32B2307/50 , B32B2307/538 , B32B2307/72 , B32B2307/7265 , B32B2457/00 , B32B2457/08 , C08K5/5425 , C08K5/548 , C08L63/00 , H05K3/389 , H05K2201/0209 , Y10T428/24917 , Y10T428/24994 , Y10T428/249994 , Y10T428/252 , Y10T428/254 , Y10T428/287 , Y10T428/31511 , Y10T428/31663
摘要： The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 μm to 0.8 μm, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.
摘要翻译：本发明提供一种树脂组合物，其可以在树脂组合物为热塑性树脂组合物为热塑性树脂组合物时，能够制造在冷热循环等热冲击试验中不产生剥离和裂纹的多层印刷布线板，并且具有高耐热性和低热膨胀特性用于多层印刷线路板的绝缘层; 以及设置在基底上的绝缘片，预浸料，多层印刷线路板和使用其的半导体器件。树脂组合物用于形成多层印刷线路板的绝缘层，其中绝缘层的表面粗糙度参数Rvk值为0.1μm至0.8μm，在用树脂组合物形成绝缘层之后测量，并且对象进行粗糙处理。

70. 发明授权

US07652125B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same 失效
标题翻译：树脂组合物，聚酰亚胺树脂组合物，聚苯并恶唑树脂组合物，清漆，树脂膜和使用其的半导体器件
公开(公告)号：US07652125B2
公开(公告)日：2010-01-26
申请号：US11663854
申请日：2005-09-29
申请人： Takashi Enoki , Atsushi Izumi , Yumiko Yamamoto , Takahiro Harada
发明人： Takashi Enoki , Atsushi Izumi , Yumiko Yamamoto , Takahiro Harada
IPC分类号： C08G65/40 , C08G65/38
CPC分类号： C08L79/08 , C08L79/04 , C09D179/04 , C09D179/08 , H01L51/052
摘要： A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.
摘要翻译：通过具有由通式（1）表示的结构的化合物的树脂组合物提供热处理后的耐热性和介电常数低的树脂组合物，其清漆和使用该树脂组合物的半导体装置：其中“Ar “是一个芳香族群; “a”为0或1; R11是具有一个或多个碳原子的有机基团，并且至少一个是具有脂环结构的基团; 当“q”为2以上的整数时，R 11可以相同也可以不同， R 1〜R 5中的至少一个和各苯环上的R 6〜R 10中的至少一个为Ar结合位点或R 11结合位点，其中R 1〜R 5，R 6〜R 10为氢，具有脂环结构具有1-10个碳原子的有机基团，羟基或羧基; 当“a”为0时，R 1至R 5和R 6至R 10中的至少一个为具有脂环结构的基团; “q”为1以上的整数， “X”是-O-，-NHCO-，-COHN-，-COO-和-OCO-中的任何一个。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式