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61. 发明申请

US20140085212A1 TOUCH PANEL APPARATUS, SYSTEM AND OPERATION METHOD THEREOF 有权
标题翻译：触摸板设备，其系统和操作方法
公开(公告)号：US20140085212A1
公开(公告)日：2014-03-27
申请号：US13624815
申请日：2012-09-21
申请人： Tzung-Min Su , Chih-Hsin Lin , Han-Ping Cheng , Ming-Tsan Kao
发明人： Tzung-Min Su , Chih-Hsin Lin , Han-Ping Cheng , Ming-Tsan Kao
IPC分类号： G06F3/041
CPC分类号： G06F3/04883 , G06F3/0416
摘要： The present invention discloses a touch panel apparatus, system and an operation method using for the same system. The apparatus recognizes a track of an object for executing a corresponding gesture function, and it includes: a touch control surface for the object to move on or above to form the track; at least one image sensor for capturing a plurality of continuous pictures including images of the object; and a processor for obtaining a plurality of displacement vectors according to changes in positions of the images of the object, comparing the displacement vectors with a set of basic vectors to obtain a code or a set of codes, and recognizing the code or the set of codes to execute the corresponding gesture function.
摘要翻译：本发明公开了一种用于同一系统的触摸面板装置，系统和操作方法。该装置识别用于执行相应的手势功能的对象的轨道，并且其包括：用于该对象在其上或之上移动以形成轨道的触摸控制表面; 至少一个图像传感器，用于捕获包括所述对象的图像的多个连续图像; 以及处理器，用于根据对象的图像的位置的变化来获得多个位移向量，将位移矢量与一组基本向量进行比较以获得代码或一组代码，并且识别代码或一组代码执行相应的手势功能。

62. 发明申请

US20140035807A1 AMBIENT LIGHT SENSING DEVICE AND METHOD, AND INTERACTIVE DEVICE USING SAME 审中-公开
标题翻译：环境光感测装置和方法，以及使用相同的交互装置
公开(公告)号：US20140035807A1
公开(公告)日：2014-02-06
申请号：US13931878
申请日：2013-06-29
申请人： Chuan-Hsin Lee
发明人： Chuan-Hsin Lee
IPC分类号： G06F3/03 , G06K9/46
CPC分类号： G06F3/0304 , G06K9/4661
摘要： The invention provides an ambient light sensing device which receives at least one visible light image sensed by an image sensor. The ambient light sensing device includes an image sampling unit and an analyzing unit. The image sampling unit divides the visible light image into plural image blocks, extracts at least one sample data in each image block, and generates a comparison data according to a difference between the sample data extracted at different time points. The analyzing unit analyzes the comparison data and generates an output analysis signal accordingly.
摘要翻译：本发明提供了一种环境光感测装置，其接收由图像传感器感测的至少一个可见光图像。环境光感测装置包括图像采样单元和分析单元。图像采样单元将可见光图像分割为多个图像块，提取每个图像块中的至少一个采样数据，并根据在不同时间点提取的样本数据之间的差异生成比较数据。分析单元分析比较数据，并相应地生成输出分析信号。

63. 发明授权

US08529773B2 Method for making micro-electro-mechanical system device 失效
标题翻译：制造微机电系统装置的方法
公开(公告)号：US08529773B2
公开(公告)日：2013-09-10
申请号：US13632020
申请日：2012-09-30
申请人： Chuan Wei Wang , Sheng Ta Lee
发明人： Chuan Wei Wang , Sheng Ta Lee
IPC分类号： C23F1/00
CPC分类号： B81C1/00246 , B81C2203/0714
摘要： The present invention discloses a method for making a MEMS device, comprising: providing a zero-layer substrate; forming a MEMS device region on the substrate, wherein the MEMS device region is provided with a first sacrificial region to separate a suspension structure of the MEMS device from another part of the MEMS device; removing the first sacrificial region by etching; and micromachining the zero-layer substrate.
摘要翻译：本发明公开了一种制造MEMS器件的方法，包括：提供零层衬底; 在所述衬底上形成MEMS器件区域，其中所述MEMS器件区域设置有第一牺牲区域以将所述MEMS器件的悬架结构与所述MEMS器件的另一部分分离; 通过蚀刻去除第一牺牲区域; 并微加工零层衬底。

64. 发明授权

US08303827B2 Method for making micro-electro-mechanical system device 有权
标题翻译：制造微机电系统装置的方法
公开(公告)号：US08303827B2
公开(公告)日：2012-11-06
申请号：US12270804
申请日：2008-11-13
申请人： Chuan Wei Wang , Sheng Ta Lee
发明人： Chuan Wei Wang , Sheng Ta Lee
IPC分类号： C23F1/00
CPC分类号： B81C1/00246 , B81C2203/0714
摘要： The present invention discloses a method for making a MEMS device, comprising: providing a zero-layer substrate; forming a MEMS device region on the substrate, wherein the MEMS device region is provided with a first sacrificial region to separate a suspension structure of the MEMS device from another part of the MEMS device; removing the first sacrificial region by etching; and micromachining the zero-layer substrate.
摘要翻译：本发明公开了一种制造MEMS器件的方法，包括：提供零层衬底; 在所述衬底上形成MEMS器件区域，其中所述MEMS器件区域设置有第一牺牲区域以将所述MEMS器件的悬架结构与所述MEMS器件的另一部分分离; 通过蚀刻去除第一牺牲区域; 并微加工零层衬底。

65. 发明申请

US20120235255A1 MEMS acoustic pressure sensor device and method for making same 审中-公开
标题翻译： MEMS声压传感器装置及其制造方法
公开(公告)号：US20120235255A1
公开(公告)日：2012-09-20
申请号：US13068554
申请日：2011-05-14
申请人： Chuan-Wei Wang
发明人： Chuan-Wei Wang
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： G01L9/0073
摘要： The present invention discloses a Micro-Electro-Mechanical System (MEMS) acoustic pressure sensor device and a method for making same. The MEMS device includes: a substrate; a fixed electrode provided on the substrate; and a multilayer structure, which includes multiple metal layers and multiple metal plugs, wherein the multiple metal layers are connected by the multiple metal plugs. A cavity is formed between the multilayer structure and the fixed electrode. Each metal layer in the multilayer structure includes multiple metal sections. The multiple metal sections of one metal layer and those of at least another metal layer are staggered to form a substantially blanket surface as viewed from a moving direction of an acoustic wave.
摘要翻译：本发明公开了一种微机电系统（MEMS）声压传感器装置及其制造方法。 MEMS器件包括：衬底; 设置在基板上的固定电极; 以及包括多个金属层和多个金属插塞的多层结构，其中多个金属层通过多个金属插塞连接。在多层结构和固定电极之间形成空腔。多层结构中的每个金属层包括多个金属部分。从声波的移动方向观察，一个金属层的多个金属部分和至少另一个金属层的多个金属部分交错以形成基本上覆盖的表面。

66. 发明授权

US08117919B2 Micro-electro-mechanical system device 有权
标题翻译：微机电系统装置
公开(公告)号：US08117919B2
公开(公告)日：2012-02-21
申请号：US12535572
申请日：2009-08-04
申请人： Chuan Wei Wang , Sheng Ta Lee
发明人： Chuan Wei Wang , Sheng Ta Lee
IPC分类号： H04R19/00
CPC分类号： G01P15/125 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2203/019 , B81B2207/015 , G01P15/0802 , H04R31/00 , H04R2201/003
摘要： The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a substrate with at least one opening; and a membrane supported on the substrate, the membrane including at least two thin segments and a thick segment connected together, wherein the two thin segments are not at the same level, and the thick segment is formed by a plurality of layers including at least two metal layers and a via layer, such that the membrane has a curve cross section.
摘要翻译：本发明公开了一种微电子机械系统（MEMS）装置，包括：具有至少一个开口的基板; 以及支撑在所述基板上的膜，所述膜包括至少两个细段和连接在一起的厚段，其中所述两个细段不在同一水平，并且所述厚段由多个层形成，所述多个层包括至少两个金属层和通孔层，使得膜具有曲线横截面。

67. 发明授权

US08000549B2 Digital image processing apparatus and method for the same 有权
标题翻译：数字图像处理装置及其方法
公开(公告)号：US08000549B2
公开(公告)日：2011-08-16
申请号：US11510979
申请日：2006-08-28
申请人： Chuan-Hsin Lee , Tzu-Yi Chao , Hsin-Chia Chen
发明人： Chuan-Hsin Lee , Tzu-Yi Chao , Hsin-Chia Chen
IPC分类号： G06K9/40 , H04N5/208
CPC分类号： H04N1/4092
摘要： A digital image processing method is disclosed, which comprises the steps of: (A) capturing a digital image; (B) selecting at least a target pixel within the digital image according to a predetermined rule; (C) performing a first filtering on a graphic region including the target pixel and its neighboring pixels within the digital image, to generate a set of first filtered values; and (D) performing a second filtering on the set of first filtered values to generate a set of second filtered values, and performing a digital image adjustment process on the digital image according to the set of second filtered values.
摘要翻译：公开了一种数字图像处理方法，包括以下步骤：（A）拍摄数字图像; （B）根据预定规则选择所述数字图像内的至少目标像素; （C）在包括数字图像内的目标像素及其相邻像素的图形区域上执行第一滤波，以生成一组第一滤波值; 和（D）对所述一组第一滤波值执行第二滤波以生成一组第二滤波值，并且根据所述第二滤波值的集合对所述数字图像执行数字图像调整处理。

68. 发明授权

US07989246B2 Package method of micro-electro-mechanical system chip 有权
标题翻译：微机电系统芯片封装方法
公开(公告)号：US07989246B2
公开(公告)日：2011-08-02
申请号：US12557805
申请日：2009-09-11
申请人： Chuan-Wei Wang
发明人： Chuan-Wei Wang
IPC分类号： H01L21/00 , H01L21/30 , H01L21/302
CPC分类号： B81C1/00333 , B81C2203/0714
摘要： The present invention proposes a MEMS chip and a package method thereof. The package method comprises; making a capping wafer by: providing a first substrate and forming an etch stop layer on the first substrate; making a device wafer by: providing a second substrate and forming a MEMS device and a material layer surrounding the MEMS device on the second substrate; bonding the capping wafer and the device wafer; after bonding, etching the first substrate to form at least one via; etching the etch stop layer through the via; etch the material layer; and forming a sealing layer on the first substrate.
摘要翻译：本发明提出一种MEMS芯片及其封装方法。包装方法包括：通过以下方式制造封盖晶片：提供第一衬底并在第一衬底上形成蚀刻停止层; 通过以下方式制造器件晶片：提供第二衬底并在第二衬底上形成MEMS器件和围绕MEMS器件的材料层; 接合封盖晶片和器件晶片; 在接合之后，蚀刻第一基板以形成至少一个通孔; 通过所述通孔蚀刻所述蚀刻停止层; 蚀刻材料层; 以及在所述第一基板上形成密封层。

69. 发明申请

US20110049565A1 OPTOELECTRONIC DEVICE AND PROCESS FOR MAKING SAME 审中-公开
标题翻译：光电器件及其制造方法
公开(公告)号：US20110049565A1
公开(公告)日：2011-03-03
申请号：US12552856
申请日：2009-09-02
申请人： Hsin-Hui Hsu , Ho-Ching Chien , Ching-Wei Chen , Sen-Huang Huang
发明人： Hsin-Hui Hsu , Ho-Ching Chien , Ching-Wei Chen , Sen-Huang Huang
IPC分类号： H01L31/102 , H01L21/20
CPC分类号： H01L21/0262 , H01L21/02381 , H01L21/02529 , H01L21/02532 , H01L21/02658 , H01L27/14689 , H01L31/103 , H01L31/1812 , Y02E10/50
摘要： The present invention discloses an optoelectronic device, comprising: a substrate made of a first material; a region in the substrate, the region being made of a second material different from the first material; and a photo diode formed in the region by ion implantation. The second material for example is silicon germanium (Si1-xGex) or silicon carbide (Si1-yCy), wherein 0
摘要翻译：本发明公开了一种光电器件，包括：由第一材料制成的衬底; 所述区域由所述第一材料不同的第二材料制成; 以及通过离子注入在该区域中形成的光电二极管。第二种材料例如是硅锗（Si1-xGex）或碳化硅（Si1-yCy），其中0

70. 发明申请

US20100289065A1 MEMS INTEGRATED CHIP WITH CROSS-AREA INTERCONNECTION 审中-公开
标题翻译： MEMS集成芯片与交叉区域互连
公开(公告)号：US20100289065A1
公开(公告)日：2010-11-18
申请号：US12464375
申请日：2009-05-12
申请人： Hsin-Hui Hsu , Chuan-Wei Wang , Sheng-Ta Lee
发明人： Hsin-Hui Hsu , Chuan-Wei Wang , Sheng-Ta Lee
IPC分类号： H01L29/84
CPC分类号： B81C1/00801 , B81B2207/015
摘要： The present invention discloses a MEMS (Micro-Electro-Mechanical System) integrated chip with cross-area interconnection, comprising: a substrate; a MEMS device area on the substrate; a microelectronic device area on the substrate; a guard ring separating the MEMS device area and the microelectronic device area; and a conductive layer on the surface of the substrate below the guard ring, or a well in the substrate below the guard ring, as a cross-area interconnection electrically connecting the MEMS device area and the microelectronic device area.
摘要翻译：本发明公开了一种具有跨区域互连的MEMS（微电子机械系统）集成芯片，包括：基板; 衬底上的MEMS器件区域; 衬底上的微电子器件区域; 分离MEMS器件区域和微电子器件区域的保护环; 以及位于保护环下方的衬底的表面上的导电层，或保护环下方的衬底中的阱，作为将MEMS器件区域和微电子器件区域电连接的跨区域互连。

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