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61. 发明授权

US08576517B1 Magnetic recording transducer having side shields between the coils and the air-bearing surface 有权
标题翻译：磁记录传感器在线圈和空气轴承表面之间具有侧屏蔽
公开(公告)号：US08576517B1
公开(公告)日：2013-11-05
申请号：US13597091
申请日：2012-08-28
申请人： Ut Tran , Zhigang Bai
发明人： Ut Tran , Zhigang Bai
IPC分类号： G11B5/127
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/3116 , G11B5/315
摘要： A magnetic recording transducer is provided. The magnetic recording transducer comprises a main pole including a nose portion, the nose portion terminating at an air-bearing surface (ABS). The magnetic recording transducer further comprises at least one coil having a coil front distal from the ABS, and at least one side shield. The at least one side shield extends from at the ABS to not further than the coil front.
摘要翻译：提供磁记录传感器。磁记录传感器包括一个主极，它包括一个鼻部，鼻部终止于空气轴承表面（ABS）。磁记录传感器还包括至少一个具有远离ABS的线圈前端的线圈和至少一个侧屏蔽。所述至少一个侧护罩从ABS处延伸到不超过线圈前端。

62. 发明授权

US08520337B1 Perpendicular magnetic recording writer pole with leading and trailing bevel side wall angles at air bearing surface 有权
标题翻译：垂直磁记录笔杆，空气轴承表面具有前后斜面侧壁角
公开(公告)号：US08520337B1
公开(公告)日：2013-08-27
申请号：US13436712
申请日：2012-03-30
申请人： Feng Liu , Zhigang Bai , Yugang Wang , Jinqiu Zhang , Ying Hong , Tao Pan
发明人： Feng Liu , Zhigang Bai , Yugang Wang , Jinqiu Zhang , Ying Hong , Tao Pan
IPC分类号： G11B5/127
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/315
摘要： A perpendicular magnetic recording transducer with leading and trailing bevel side wall angles at air bearing surface for use in a data storage device is provided. The transducer includes a magnetic writer pole having a pole tip facing an air bearing surface (ABS). The pole tip includes a pole tip face having a leading edge, a trailing edge, a first side wall, and a second side wall. The first side wall includes a first side wall section adjoining the leading edge and a second side wall section adjoining the trailing edge. The first side wall section is at a first angle measured from a perpendicular center line dividing the trailing edge. The second side wall section is at a second angle measured from a perpendicular center line dividing the trailing edge. The second angle is greater than three degrees. The first angle is greater than the second angle.
摘要翻译：提供了一种用于数据存储装置的在空气轴承表面具有前后倾斜侧壁角度的垂直磁记录传感器。换能器包括具有面向空气轴承表面（ABS）的极尖的磁性写入极。极尖包括具有前缘，后缘，第一侧壁和第二侧壁的极尖端面。第一侧壁包括邻接前缘的第一侧壁部分和与后缘相邻的第二侧壁部分。第一侧壁部分是从分割后缘的垂直中心线测量的第一角度。第二侧壁部分是从分割后缘的垂直中心线测量的第二角度。第二个角度大于三度。第一角度大于第二角度。

63. 发明申请

US20130196473A1 MOLD CHASE 有权
标题翻译：模具刀
公开(公告)号：US20130196473A1
公开(公告)日：2013-08-01
申请号：US13794789
申请日：2013-03-12
申请人： Zhigang Bai , Jinzhong Yao
发明人： Zhigang Bai , Jinzhong Yao
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H03K19/018521 , H01L2924/00014
摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.
摘要翻译：用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

64. 发明授权

US08373945B1 Magnetic writer having a split yoke 有权
标题翻译：磁性刻录机具有分叉
公开(公告)号：US08373945B1
公开(公告)日：2013-02-12
申请号：US11789190
申请日：2007-04-23
申请人： Peng Luo , Zhigang Bai , Yugang Wang , Kroum S. Stoev , Francis H. Liu
发明人： Peng Luo , Zhigang Bai , Yugang Wang , Kroum S. Stoev , Francis H. Liu
IPC分类号： G11B5/31 , G11B5/17
CPC分类号： G11B5/1278 , G11B5/3123
摘要： A method and system for providing a magnetic transducer are described. The magnetic transducer includes a first pole, a write gap, a second pole, a first coil, and a second coil. The first pole has a front portion on which at least a portion of the write gap resides. The second pole includes a split yoke that includes a first portion and a second portion. At least a portion of the first coil resides between the first portion of the split yoke and the first pole. At least a portion of the second coil resides between the second portion of the split yoke and the first pole.
摘要翻译：描述了一种用于提供磁换能器的方法和系统。磁换能器包括第一极，写间隙，第二极，第一线圈和第二线圈。第一极具有前部，至少部分写入间隙位于该前部。第二极包括分开轭，其包括第一部分和第二部分。第一线圈的至少一部分位于分叉轭的第一部分和第一极之间。第二线圈的至少一部分位于分叉轭的第二部分和第一极之间。

65. 发明授权

US08339738B1 Method for providing a magnetic recording transducer having a hybrid moment pole 有权
标题翻译：提供具有混合力矩极的磁记录换能器的方法
公开(公告)号：US08339738B1
公开(公告)日：2012-12-25
申请号：US13528007
申请日：2012-06-20
申请人： Ut Tran , Zhigang Bai
发明人： Ut Tran , Zhigang Bai
IPC分类号： G11B5/127
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3163
摘要： A method for fabricating a magnetic transducer having an air-bearing surface (ABS) is provided. The method comprises providing an underlayer, and providing a main pole residing on the underlayer and having a front and a rear. The step of providing a main pole further includes providing a first portion having a first magnetic moment, the first portion having a front face at the ABS and terminating between the ABS and the rear of the main pole, and providing a second portion having a second magnetic moment. A part of the second portion resides on the first portion, and another part of the second portion resides between the first portion of the main pole and the rear of the main pole. The first magnetic moment is less than the second magnetic moment.
摘要翻译：提供一种制造具有空气轴承表面（ABS）的磁换能器的方法。该方法包括提供底层，并提供驻留在底层上并具有前后的主极。提供主极的步骤还包括提供具有第一磁矩的第一部分，第一部分在ABS处具有前表面并终止于ABS和主极的后部之间，并且提供具有第二磁体的第二部分磁力矩第二部分的一部分位于第一部分上，第二部分的另一部分位于主极的第一部分和主极的后部之间。第一个磁矩小于第二个磁矩。

66. 发明授权

US08209848B2 Method of making a PMR writer with seamless shields 有权
标题翻译：制作具有无缝屏蔽的PMR写入器的方法
公开(公告)号：US08209848B2
公开(公告)日：2012-07-03
申请号：US12798560
申请日：2010-04-07
申请人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
发明人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
IPC分类号： G11B5/17 , G11B5/23
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/4906
摘要： A process (and the structure resulting therefrom) is described for manufacturing a magnetic write head in which there is no physical interface between the first and second trailing shields. This is achieved by laying down a sacrificial layer which is patterned to extend inwards towards the top yoke whereby the dimensions and shapes of the shields are defined.
摘要翻译：描述了一种用于制造其中在第一和第二后挡板之间没有物理接口的磁写头的过程（以及由此产生的结构）。这通过铺设牺牲层来实现，该牺牲层被图案化以朝向顶部轭部向内延伸，由此限定了屏蔽件的尺寸和形状。

67. 发明授权

US08166631B1 Method for fabricating a magnetic recording transducer having side shields 有权
标题翻译：制造具有侧屏蔽的磁记录换能器的方法
公开(公告)号：US08166631B1
公开(公告)日：2012-05-01
申请号：US12199624
申请日：2008-08-27
申请人： Ut Tran , Zhigang Bai , Kevin K. Lin
发明人： Ut Tran , Zhigang Bai , Kevin K. Lin
IPC分类号： G11B5/17 , H04R31/00
CPC分类号： G11B5/315 , G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method provides a magnetic transducer that includes an underlayer and a nonmagnetic layer on the underlayer. The method includes providing a plurality of trenches in the nonmagnetic layer. A first trench of corresponds to a main pole, while at least one side trench corresponds to at least one side shield. The method also includes providing mask covering the side trench(es) and providing the main pole. At least a portion of the main pole resides in the first trench. The method also includes removing at least a portion of the nonmagnetic layer residing between the side trench(es) and the main pole. The method also includes providing at least one side shield. The shield(s) extend from at least an air-bearing surface location to not further than a coil front location.
摘要翻译：一种方法提供一种磁传感器，其包括底层上的底层和非磁性层。该方法包括在非磁性层中提供多个沟槽。第一沟槽对应于主极，而至少一个侧沟槽对应于至少一个侧屏蔽。该方法还包括提供覆盖侧沟槽并提供主极的掩模。主极的至少一部分位于第一沟槽中。该方法还包括去除位于侧沟槽和主极之间的非磁性层的至少一部分。该方法还包括提供至少一个侧屏蔽。屏蔽件至少从空气轴承表面位置延伸到不超过线圈前部位置。

68. 发明申请

US20110316130A1 THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US20110316130A1
公开(公告)日：2011-12-29
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

69. 发明申请

US20150294924A1 COMBINED QFN AND QFP SEMICONDUCTOR PACKAGE 有权
标题翻译：组合QFN和QFP半导体封装
公开(公告)号：US20150294924A1
公开(公告)日：2015-10-15
申请号：US14552497
申请日：2014-11-25
申请人： Zhigang Bai , Jinzhong Yao , Lan Chu Tan
发明人： Zhigang Bai , Jinzhong Yao , Lan Chu Tan
IPC分类号： H01L23/495 , H01L21/56 , H01L23/58 , H01L23/00 , H01L23/31
CPC分类号： H01L24/85 , H01L21/565 , H01L23/3121 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/2919 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/456 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.
摘要翻译：半导体封装包括具有第一类型的封装引线和预成型部分的第一引线框架型和具有围绕芯片焊盘并由预模制部分支撑的第二类型的封装引线的第二引线框架型。集成电路附接到管芯焊盘并且用接合线电连接到第一和第二类型的引线。形成模具帽的模具复合体覆盖第一和第二引线框架类型，集成电路和接合线。第一引线框类型可以是QFP型，第二引线框类型可以是QFN型。

70. 发明授权

US08901721B1 Lead frame based semiconductor die package 有权
标题翻译：引线框架半导体芯片封装
公开(公告)号：US08901721B1
公开(公告)日：2014-12-02
申请号：US13972885
申请日：2013-08-21
申请人： Zhigang Bai , Jinzhong Yao , Yuan Zang
发明人： Zhigang Bai , Jinzhong Yao , Yuan Zang
IPC分类号： H01L23/48 , H01L23/495 , H01L23/00
CPC分类号： H01L23/49517 , H01L23/3107 , H01L23/49555 , H01L23/49575 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06135 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.
摘要翻译：基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。模具通过接合线电连接到引线指。管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。密封剂包括用于接收第二组的引导指的槽或槽。

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