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61. 发明授权

US08196645B2 Heat sink with heat pipes 有权
标题翻译：带热管的散热器
公开(公告)号：US08196645B2
公开(公告)日：2012-06-12
申请号：US11964919
申请日：2007-12-27
申请人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
发明人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
IPC分类号： F28D15/02 , F28F7/00 , H05K7/20
CPC分类号： F28F1/126 , F28D15/0233 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.
摘要翻译：用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板。下板包括接触热管的面板，从面板向上延伸并与热管分离的两个侧壁，以及两个从两个侧壁相反延伸并焊接在上板上的凸缘。热管是S形并列并且从头到尾直接接触。

62. 发明授权

US07757751B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07757751B2
公开(公告)日：2010-07-20
申请号：US11626716
申请日：2007-01-24
申请人： Zhi-Yong Zhou , Min-Qi Xiao , Zeng-Jun Gao
发明人： Zhi-Yong Zhou , Min-Qi Xiao , Zeng-Jun Gao
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.
摘要翻译：散热装置包括：底座，其包括由第一导热材料制成的基板和由导热率低于第一导热材料的第二导热材料制成的基板。衬底包括具有窗口的框架，窗口在其中容纳基板，并且跨越窗口的接合板。翅片组包括彼此平行并间隔开的多个翅片，并且安装在基座上。热管具有夹在基板和接合板之间的蒸发部分，以及延伸穿过翅片组并与其热连接的两个冷凝部分。蒸发部分具有大致V形的构造。

63. 发明授权

US07746642B2 Heat sink and a method for manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US07746642B2
公开(公告)日：2010-06-29
申请号：US12202393
申请日：2008-09-01
申请人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
发明人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F3/02 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
摘要翻译：用于冷却电子部件的散热器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板下板形成从其向下突出的突起。突起的底面被研磨成平坦和平滑的，由此底部表面可以紧密接触电子部件。一种用于制造散热器的方法，包括：铣削从下板向下冲压的突起的底面，由此底表面可以平坦和平滑，足以与电子元件紧密接触，并且将上板依次焊接在下板和分别在下板和上板上的多个翅片。

64. 发明授权

US07489513B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07489513B2
公开(公告)日：2009-02-10
申请号：US11684457
申请日：2007-03-09
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Cui-Jun Lu
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Cui-Jun Lu
IPC分类号： H05K7/20 , H02M7/48
CPC分类号： H01L23/367 , H01L21/4882 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending from the first base with a plurality of first channels defined therebetween. The second heat sink includes a second base and a plurality of second fins extending from the second base with a plurality of second channels defined therebetween. The second fins extend beyond a common edge of the first base and the second base to extend into first channels of the first heat sink.
摘要翻译：散热装置包括与第一散热器并置的第一散热器和第二散热器。第一散热器包括第一基座和从第一基座延伸的多个第一翅片，其间限定有多个第一通道。第二散热器包括第二基座和从第二基座延伸的多个第二翅片，其间限定有多个第二通道。第二散热片延伸超过第一基座和第二基座的共同边缘以延伸到第一散热器的第一通道。

65. 发明申请

US20060051222A1 Miniature pump for liquid cooling system 审中-公开
标题翻译：液体冷却系统微型泵
公开(公告)号：US20060051222A1
公开(公告)日：2006-03-09
申请号：US11047867
申请日：2005-02-01
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
IPC分类号： F04B17/00 , F04B35/04
CPC分类号： F04D13/0666 , F04D13/064
摘要： A miniature pump in accordance with the present invention comprises a pump casing (1) and a liquid circulating unit (2) received in the pump casing. The pump casing defines an enclosed space (15) for storing liquid therein. A spacing plate (12) is arranged in the pump casing to divide the enclosed space into a first chamber (16) and a second chamber. The spacing plate defines a through opening (122) at a center portion thereof to make the first and second chambers communicate with each other. An inlet (104) and an outlet (110) are formed on the pump casing respectively communicating with the first and second chambers. The liquid circulating unit is mounted in the second chamber for circulating the liquid in a liquid cooling system.
摘要翻译：根据本发明的微型泵包括容纳在泵壳体中的泵壳体（1）和液体循环单元（2）。泵壳体限定用于在其中储存液体的封闭空间（15）。间隔板（12）布置在泵壳体中以将封闭空间分成第一室（16）和第二室。间隔板在其中心部分形成通孔（122），以使第一和第二腔室彼此连通。在泵壳体上形成有与第一和第二腔室连通的入口（104）和出口（110）。液体循环单元安装在第二室中，用于使液体在液体冷却系统中循环。

66. 发明申请

US20050045311A1 Heat dissipating device incorporating clip 失效
标题翻译：散热装置结合夹子
公开(公告)号：US20050045311A1
公开(公告)日：2005-03-03
申请号：US10900553
申请日：2004-07-27
申请人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Lee , Cheng-Tien Lai , Zhi-Yong Zhou
发明人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Lee , Cheng-Tien Lai , Zhi-Yong Zhou
IPC分类号： H05K7/20 , H01L23/40 , H01L23/467 , F28D15/00
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.
摘要翻译：散热装置包括散热器（50）和用于将散热器安装到围绕电子部件（65）的保持模块（60）的两个夹子（10）。散热器提供两个肩部（72）。每个夹子包括支撑在一个肩部上的带子（21），具有枢转地连接到带子上的凸轮的杠杆（40），可枢转地连接到带子的相对端部的两个腿部（30），以及两个弹簧指从带的相对端延伸。在组装中，带子被向下按压，并且保持模块推动腿部以便将脚从原始状态转移到强制状态。当腿部到达保持模块的开口时，手指推动腿进入开口。然后，杠杆枢转以推动带子向上移动，从而使腿部牢固地接合在开口中。

67. 发明授权

US08388195B2 Illumination device with heat dissipation structures 失效
标题翻译：具有散热结构的照明装置
公开(公告)号：US08388195B2
公开(公告)日：2013-03-05
申请号：US12824208
申请日：2010-06-27
申请人： Cheng-Tien Lai , Chi-Yuan Lai , Zhi-Yong Zhou
发明人： Cheng-Tien Lai , Chi-Yuan Lai , Zhi-Yong Zhou
IPC分类号： B60Q1/06 , B60Q1/26 , F21V29/00
CPC分类号： F21V29/83 , F21V29/507 , F21V29/745 , F21V29/80 , F21Y2105/10 , F21Y2115/10 , H05K1/0203 , H05K2201/09063 , H05K2201/10106
摘要： An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.
摘要翻译：示例性照明装置包括外壳，容纳在外壳中的半导体光源以及与外壳接合并覆盖半导体光源的外壳。由半导体光源产生的光可以穿过信封突出并且离开照明装置。半导体光源包括彼此独立的多个光源模块。在每个光源模块中限定多个空气通道，用于穿过其中的空气将半导体光源产生的热量散发到环境空气中。

68. 发明授权

US08069909B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08069909B2
公开(公告)日：2011-12-06
申请号：US12399028
申请日：2009-03-06
申请人： Ji-Yun Qin , Zhi-Yong Zhou
发明人： Ji-Yun Qin , Zhi-Yong Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.
摘要翻译：散热装置包括与电子部件热接触的第一散热器，连接到第一散热器的第二散热器和将第一散热器与第二散热器热连接的热管。第一散热器具有在其侧面限定切口的第一基座。第二个散热器有第二个基座。热管包括设置在基座上的蒸发部分，设置在第二基座上的冷凝部分和将蒸发部分与冷凝部分相互连接的连接部分。插入部从第二基部突出并且嵌合地插入到切口中。热管的连接部分延伸穿过插入部分。

69. 发明授权

US07813132B2 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US07813132B2
公开(公告)日：2010-10-12
申请号：US12248897
申请日：2008-10-10
申请人： Zhi-Yong Zhou , Ji-Yun Qin , Xiao-Jian He
发明人： Zhi-Yong Zhou , Ji-Yun Qin , Xiao-Jian He
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/34 , H01L23/3737 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein.
摘要翻译：散热组件具有容纳装置，其防止热界面材料不必要地移动到散热器的顶表面上的周围区域。容纳装置包括对应地覆盖热界面材料的帽和从帽的底端向下延伸并附接到散热器的顶部的周边的环形框架。盖包括天花板和从天花板的边缘向下和向外延伸的多个倾斜的侧壁，从而在盖子内形成保护空间，与散热片的顶表面结合以封闭热界面材料。两个耳朵从框架向外延伸并且容纳线夹的邻接体的相对端部。

70. 发明授权

US07742306B2 LED lamp with a heat sink assembly 失效
标题翻译： LED灯带散热器组件
公开(公告)号：US07742306B2
公开(公告)日：2010-06-22
申请号：US12041679
申请日：2008-03-04
申请人： Chun-Jiang Shuai , Guang Yu , Zhi-Yong Zhou
发明人： Chun-Jiang Shuai , Guang Yu , Zhi-Yong Zhou
IPC分类号： H05K7/20
CPC分类号： F21V29/004 , F21V29/51 , F21V29/717 , F21V29/75 , F21V29/763 , F21V29/83 , F21W2131/103 , F21Y2115/10 , F28D15/0266 , F28F1/12
摘要： An LED lamp includes a first heat sink, a pair of second heat sinks arranged at two opposite sides of the first heat sink, a plurality of heat pipes connecting the first heat sink to the pair of second heat sinks, and an LED module mounted on the first heat sink. With the help of good heat conducting capability of the heat pipes, heat generated by LEDs of the LED module can be conducted to the first heat sink and the pair of second heat sinks rapidly, which then dissipate the heat to the ambient air. Each second heat sink consists of a plurality of sheets defining a plurality of gaps therebetween; the gaps extend through top and bottom of each second heat sink. Each second heat sink has a lower portion below a bottom surface of the first heat sink.
摘要翻译： LED灯包括第一散热器，布置在第一散热器的两个相对侧的一对第二散热器，将第一散热器连接到一对第二散热器的多个热管，以及安装在第一个散热片借助于热管的良好导热能力，LED模块的LED产生的热可以快速地传导到第一散热器和一对第二散热器，从而将热量散发到环境空气中。每个第二散热器由限定其间的多个间隙的多个片组成; 间隙延伸穿过每个第二散热器的顶部和底部。每个第二散热器在第一散热器的底表面下方具有下部。

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