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61. 发明授权

US08387685B2 Heat sink for power module 失效
标题翻译：电源模块散热片
公开(公告)号：US08387685B2
公开(公告)日：2013-03-05
申请号：US11919368
申请日：2006-04-19
申请人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： F28F7/00 , F28F3/12
CPC分类号： H01L23/473 , F28F3/086 , F28F3/12 , H01L23/3731 , H01L23/3736 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.
摘要翻译：提供了能够实现进一步提高散热性能的功率模块的散热器，并且进一步提高了安装特性。用于功率模块的散热器1具有层叠体20，第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21，多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分面22对层叠方向的各平行流路50形成传热路径70a。在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a，26b接合主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂流路由流入路径30a，每个平行流路50和流出路径40a构成。

62. 发明授权

US08198539B2 Heat radiator and power module 失效
标题翻译：散热器和电源模块
公开(公告)号：US08198539B2
公开(公告)日：2012-06-12
申请号：US11994896
申请日：2006-07-05
申请人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
发明人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
IPC分类号： H05K1/00
CPC分类号： H05K3/0061 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/341 , H05K2201/0373 , H05K2201/1028 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
摘要翻译：散热器1包括第一侧用作发热元件安装侧的绝缘基板3和固定到绝缘基板3的第二侧的散热片5.金属层7形成在第二侧绝缘基板3与发热元件安装侧相反。由高导热材料形成的应力松弛部件4介于绝缘基板3的金属层7和散热片5之间，并且包括板状体10和在一侧形成为间隔的多个突起11 板状体10的突起11的端面钎焊到金属层7，而没有形成突起11的板状体10的侧面钎焊到该散热器1的材料成本低，散热性能优异。

63. 发明授权

US08074702B2 Cooling system for forming mold and method of cooling forming mold 有权
标题翻译：成型模具冷却系统和冷却成型模具的方法
公开(公告)号：US08074702B2
公开(公告)日：2011-12-13
申请号：US12374601
申请日：2007-05-30
申请人： Yuichi Furukawa
发明人： Yuichi Furukawa
IPC分类号： B22D27/04 , C21B7/10 , B22D41/005
CPC分类号： B29C33/046 , B22C9/065 , B22D17/2218 , B29C35/007 , B29C35/16 , B29C45/73 , B29C2035/1691
摘要： In a forming mold equipped with a cooling channel for circulation of a refrigerant composed of a cooling gas and a atomized cooling liquid, any increase of back pressure attributed to evaporation of the refrigerant fed to the cooling channel is inhibited to thereby attain cooling acceleration, and further any occurrence of rust or scale by the refrigerant circulated through the cooling channel is prevented. Accordingly, a channel for supply of the refrigerant to the cooling channel of the forming mold is provided with air pressure source for trapping of air in the supply channel and pressure feeding of the same; oxygen separation means for separation removal of oxygen from the pressure fed air to thereby lower the oxygen concentration of the air; and atomizing means for spraying of the cooling liquid into the air with oxygen concentration lowered. The oxygen separated from the air by the oxygen separation means is returned to the refrigerant forcedly emitted from the cooling channel by means of forced exhaust means.
摘要翻译：在配备有用于循环由冷却气体和雾化冷却液构成的制冷剂的冷却通道的成型模具中，抑制了供给到冷却通道的制冷剂的蒸发引起的背压的任何增加，从而获得冷却加速，防止通过冷却通道循环的制冷剂进一步发生锈蚀或锈蚀。因此，用于向成形模具的冷却通道供应制冷剂的通道设置有用于在供给通道中捕获空气的空气压力源和其供给压力; 氧分离装置，用于从加压空气中分离除去氧气，从而降低空气的氧气浓度; 以及用于将冷却液喷射到空气中的氧化浓度降低的雾化装置。通过氧气分离装置从空气中分离的氧气通过强制排气装置返回到从冷却通道强制排放的制冷剂。

64. 发明申请

US20090314474A1 HEAT SINK FOR POWER MODULE 失效
标题翻译：电源模块散热器
公开(公告)号：US20090314474A1
公开(公告)日：2009-12-24
申请号：US11919368
申请日：2006-04-19
申请人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H05K7/20 , F28D15/00 , F28F3/12
CPC分类号： H01L23/473 , F28F3/086 , F28F3/12 , H01L23/3731 , H01L23/3736 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.
摘要翻译：提供了能够实现进一步提高散热性能的功率模块的散热器，并且进一步提高了安装特性。用于功率模块的散热器1具有层叠体20，第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21，多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分面22对层叠方向的各平行流路50形成传热路径70a。在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a，26b接合主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂流路由流入路径30a，每个平行流路50和流出路径40a构成。

65. 发明申请

US20090302458A1 Heat Sink For Power Module 失效
标题翻译：功率模块散热片
公开(公告)号：US20090302458A1
公开(公告)日：2009-12-10
申请号：US11922945
申请日：2006-06-27
申请人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
摘要翻译：用于功率模块的散热器（1）能够将功率器件（101）安装在散热器的至少一个表面上。散热器包括散发由动力装置（101）产生的热量的冷却介质流动的制冷剂通路（1d）和布置在制冷剂通路（1d）中的波纹状散热片体（1a）。波纹状散热片体（1a）具有在冷却介质的流动方向上延伸的波峰（21b）和槽（21c），以及各个顶部（21b）的相应一个与相邻的顶部一个槽（21c）。布置在相邻侧壁（21a）之间的每个相邻的一对侧壁（21a）和相应的一个峰（21b）或相应的一个槽（21c）形成翅片（21）。每个侧壁（21a）具有操作以使至少旋转在相关联的翅片（21）中流动的冷却介质的百叶窗（31）。因此，散热器（1）具有进一步改善的散热性能。

66. 发明申请

US20090200065A1 HEAT DISSIPATION DEVICE AND POWER MODULE 失效
标题翻译：散热装置和电源模块
公开(公告)号：US20090200065A1
公开(公告)日：2009-08-13
申请号：US11994896
申请日：2006-07-05
申请人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
发明人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
IPC分类号： H05K7/20
CPC分类号： H05K3/0061 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/341 , H05K2201/0373 , H05K2201/1028 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
摘要翻译：散热器1包括第一侧用作发热元件安装侧的绝缘基板3和固定到绝缘基板3的第二侧的散热片5.金属层7形成在第二侧绝缘基板3与发热元件安装侧相反。由高导热材料形成的应力松弛部件4介于绝缘基板3的金属层7和散热片5之间，并且包括板状体10和在一侧形成为间隔的多个突起11 板状体10的突起11的端面钎焊到金属层7，而没有形成突起11的板状体10的侧面钎焊到该散热器1的材料成本低，散热性能优异。

67. 发明授权

US6115252A Heat sink device for electronic devices 失效
标题翻译：电子设备散热装置
公开(公告)号：US6115252A
公开(公告)日：2000-09-05
申请号：US343459
申请日：1999-06-30
申请人： Keiichiro Ohta , Yuichi Furukawa
发明人： Keiichiro Ohta , Yuichi Furukawa
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： G06F1/203 , F28D15/0233 , G06F2200/201
摘要： A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a heat removal opening. A heat sink disposed within the housing comprises a metal body having a heat pipe portion, and a radiation fin attached to the body in the vicinity of the heat removal opening and opposed to the opening. The heat-generating electronic component, such as CPU, is held in contact with the metal body at a location away from the fin attached portion thereof.
摘要翻译：一种用于电子装置的散热装置，用于将电子装置的壳体外部的大气散发到设置在壳体内的电子部件产生的热量。壳体具有形成有散热开口的周壁。设置在壳体内的散热器包括具有热管部分的金属体和在除热开口附近并与开口相对的散热片。诸如CPU的发热电子部件在远离其翅片连接部分的位置处与金属体保持接触。

68. 发明授权

US5599467A Aluminum weldment and method of welding aluminum workpieces 失效
标题翻译：铝焊接件和铝合金工件焊接方法
公开(公告)号：US5599467A
公开(公告)日：1997-02-04
申请号：US340520
申请日：1994-11-16
申请人： Shinji Okabe , Takashi Iwasa , Takushi Irie , Yuichi Furukawa , Ichiro Iwai
发明人： Shinji Okabe , Takashi Iwasa , Takushi Irie , Yuichi Furukawa , Ichiro Iwai
IPC分类号： B23K11/18 , B23K35/00 , B23K35/28
CPC分类号： B23K35/286 , B23K11/185 , B23K35/002
摘要： An aluminum weldment is produced by resistance-welding aluminum workpieces, and has a nugget formed between the aluminum workpieces which contains more magnesium than the base material of the aluminum workpieces. The nugget contains 5.about.17 wt % of magnesium which forms a solid solution with aluminum.
摘要翻译：通过电焊铝工件制造铝焊件，并且在铝工件之间形成有比铝工件的基材更多的镁的熔核。该熔核含有5重量％的与铝形成固溶体的镁。

69. 发明授权

US5076351A Heat pipe 失效
标题翻译：热管
公开(公告)号：US5076351A
公开(公告)日：1991-12-31
申请号：US553297
申请日：1990-07-17
申请人： Masaaki Munekawa , Chuichi Takahashi , Kaoru Hasegawa , Koichiro Fukui , Yuichi Furukawa
发明人： Masaaki Munekawa , Chuichi Takahashi , Kaoru Hasegawa , Koichiro Fukui , Yuichi Furukawa
IPC分类号： F28D15/02
CPC分类号： F28D15/0283 , F28D15/0233 , F28F1/24 , F28F3/02 , F28F3/025 , F28F3/046
摘要： In a heat pipe container having a working fluid enclosed therein, the container includes a container body in the form of a horizontal straight tube and having an evaporator portion, a heat insulating portion and a condenser portion as arranged from one end of the body to the other end thereof, and an upward hollow projecting portion provided on the condenser portion of the container body.

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