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61. 发明授权

US08670212B2 PMR writer device with multi-level tapered write pole 有权
标题翻译： PMR写入器，具有多级锥形写入极
公开(公告)号：US08670212B2
公开(公告)日：2014-03-11
申请号：US13608321
申请日：2012-09-10
申请人： Zhigang Bai , Kowang Liu , Yan Wu , Moris Dovek
发明人： Zhigang Bai , Kowang Liu , Yan Wu , Moris Dovek
IPC分类号： G11B5/31
CPC分类号： G11B5/398 , G11B5/1278 , G11B5/3116 , G11B5/315 , G11B5/3163 , G11B5/3183 , G11B5/3186 , Y10T29/49032 , Y10T29/49041 , Y10T29/49044 , Y10T29/49048
摘要： A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on a leading edge or a trailing edge, on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the main pole, giving the head a stepped profile. The yoke can be a single yoke formed on one side of the main pole or it can be two yokes formed on both the leading and trailing sides of the main pole. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities.
摘要翻译：垂直磁记录（PMR）头用多级锥形写柱制造。写极包括在前缘或后缘具有锥形尖端的主极，在其上形成有至少一个具有锥形边缘的轭。轭的边缘从主极的ABS凹入，使头部呈阶梯状。轭可以是形成在主极的一侧上的单个磁轭，或者它可以是形成在主极的前侧和后侧的两个轭。写磁极结构产生磁通量到磁极尖端的ABS表面的有效的通道，其产生高区域密度的磁记录场。

62. 发明授权

US08643156B2 Lead frame for assembling semiconductor device 有权
标题翻译：用于组装半导体器件的引线框架
公开(公告)号：US08643156B2
公开(公告)日：2014-02-04
申请号：US13605990
申请日：2012-09-06
申请人： Shunan Qiu , Zhigang Bai , Haiyan Liu
发明人： Shunan Qiu , Zhigang Bai , Haiyan Liu
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49558 , H01L23/3107 , H01L23/49541 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.
摘要翻译：引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘。内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

63. 发明授权

US08576517B1 Magnetic recording transducer having side shields between the coils and the air-bearing surface 有权
标题翻译：磁记录传感器在线圈和空气轴承表面之间具有侧屏蔽
公开(公告)号：US08576517B1
公开(公告)日：2013-11-05
申请号：US13597091
申请日：2012-08-28
申请人： Ut Tran , Zhigang Bai
发明人： Ut Tran , Zhigang Bai
IPC分类号： G11B5/127
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/3116 , G11B5/315
摘要： A magnetic recording transducer is provided. The magnetic recording transducer comprises a main pole including a nose portion, the nose portion terminating at an air-bearing surface (ABS). The magnetic recording transducer further comprises at least one coil having a coil front distal from the ABS, and at least one side shield. The at least one side shield extends from at the ABS to not further than the coil front.
摘要翻译：提供磁记录传感器。磁记录传感器包括一个主极，它包括一个鼻部，鼻部终止于空气轴承表面（ABS）。磁记录传感器还包括至少一个具有远离ABS的线圈前端的线圈和至少一个侧屏蔽。所述至少一个侧护罩从ABS处延伸到不超过线圈前端。

64. 发明申请

US20130196473A1 MOLD CHASE 有权
标题翻译：模具刀
公开(公告)号：US20130196473A1
公开(公告)日：2013-08-01
申请号：US13794789
申请日：2013-03-12
申请人： Zhigang Bai , Jinzhong Yao
发明人： Zhigang Bai , Jinzhong Yao
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H03K19/018521 , H01L2924/00014
摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.
摘要翻译：用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

65. 发明授权

US08373945B1 Magnetic writer having a split yoke 有权
标题翻译：磁性刻录机具有分叉
公开(公告)号：US08373945B1
公开(公告)日：2013-02-12
申请号：US11789190
申请日：2007-04-23
申请人： Peng Luo , Zhigang Bai , Yugang Wang , Kroum S. Stoev , Francis H. Liu
发明人： Peng Luo , Zhigang Bai , Yugang Wang , Kroum S. Stoev , Francis H. Liu
IPC分类号： G11B5/31 , G11B5/17
CPC分类号： G11B5/1278 , G11B5/3123
摘要： A method and system for providing a magnetic transducer are described. The magnetic transducer includes a first pole, a write gap, a second pole, a first coil, and a second coil. The first pole has a front portion on which at least a portion of the write gap resides. The second pole includes a split yoke that includes a first portion and a second portion. At least a portion of the first coil resides between the first portion of the split yoke and the first pole. At least a portion of the second coil resides between the second portion of the split yoke and the first pole.
摘要翻译：描述了一种用于提供磁换能器的方法和系统。磁换能器包括第一极，写间隙，第二极，第一线圈和第二线圈。第一极具有前部，至少部分写入间隙位于该前部。第二极包括分开轭，其包括第一部分和第二部分。第一线圈的至少一部分位于分叉轭的第一部分和第一极之间。第二线圈的至少一部分位于分叉轭的第二部分和第一极之间。

66. 发明授权

US08339738B1 Method for providing a magnetic recording transducer having a hybrid moment pole 有权
标题翻译：提供具有混合力矩极的磁记录换能器的方法
公开(公告)号：US08339738B1
公开(公告)日：2012-12-25
申请号：US13528007
申请日：2012-06-20
申请人： Ut Tran , Zhigang Bai
发明人： Ut Tran , Zhigang Bai
IPC分类号： G11B5/127
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3163
摘要： A method for fabricating a magnetic transducer having an air-bearing surface (ABS) is provided. The method comprises providing an underlayer, and providing a main pole residing on the underlayer and having a front and a rear. The step of providing a main pole further includes providing a first portion having a first magnetic moment, the first portion having a front face at the ABS and terminating between the ABS and the rear of the main pole, and providing a second portion having a second magnetic moment. A part of the second portion resides on the first portion, and another part of the second portion resides between the first portion of the main pole and the rear of the main pole. The first magnetic moment is less than the second magnetic moment.
摘要翻译：提供一种制造具有空气轴承表面（ABS）的磁换能器的方法。该方法包括提供底层，并提供驻留在底层上并具有前后的主极。提供主极的步骤还包括提供具有第一磁矩的第一部分，第一部分在ABS处具有前表面并终止于ABS和主极的后部之间，并且提供具有第二磁体的第二部分磁力矩第二部分的一部分位于第一部分上，第二部分的另一部分位于主极的第一部分和主极的后部之间。第一个磁矩小于第二个磁矩。

67. 发明授权

US08209848B2 Method of making a PMR writer with seamless shields 有权
标题翻译：制作具有无缝屏蔽的PMR写入器的方法
公开(公告)号：US08209848B2
公开(公告)日：2012-07-03
申请号：US12798560
申请日：2010-04-07
申请人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
发明人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
IPC分类号： G11B5/17 , G11B5/23
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/4906
摘要： A process (and the structure resulting therefrom) is described for manufacturing a magnetic write head in which there is no physical interface between the first and second trailing shields. This is achieved by laying down a sacrificial layer which is patterned to extend inwards towards the top yoke whereby the dimensions and shapes of the shields are defined.
摘要翻译：描述了一种用于制造其中在第一和第二后挡板之间没有物理接口的磁写头的过程（以及由此产生的结构）。这通过铺设牺牲层来实现，该牺牲层被图案化以朝向顶部轭部向内延伸，由此限定了屏蔽件的尺寸和形状。

68. 发明授权

US08166631B1 Method for fabricating a magnetic recording transducer having side shields 有权
标题翻译：制造具有侧屏蔽的磁记录换能器的方法
公开(公告)号：US08166631B1
公开(公告)日：2012-05-01
申请号：US12199624
申请日：2008-08-27
申请人： Ut Tran , Zhigang Bai , Kevin K. Lin
发明人： Ut Tran , Zhigang Bai , Kevin K. Lin
IPC分类号： G11B5/17 , H04R31/00
CPC分类号： G11B5/315 , G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method provides a magnetic transducer that includes an underlayer and a nonmagnetic layer on the underlayer. The method includes providing a plurality of trenches in the nonmagnetic layer. A first trench of corresponds to a main pole, while at least one side trench corresponds to at least one side shield. The method also includes providing mask covering the side trench(es) and providing the main pole. At least a portion of the main pole resides in the first trench. The method also includes removing at least a portion of the nonmagnetic layer residing between the side trench(es) and the main pole. The method also includes providing at least one side shield. The shield(s) extend from at least an air-bearing surface location to not further than a coil front location.
摘要翻译：一种方法提供一种磁传感器，其包括底层上的底层和非磁性层。该方法包括在非磁性层中提供多个沟槽。第一沟槽对应于主极，而至少一个侧沟槽对应于至少一个侧屏蔽。该方法还包括提供覆盖侧沟槽并提供主极的掩模。主极的至少一部分位于第一沟槽中。该方法还包括去除位于侧沟槽和主极之间的非磁性层的至少一部分。该方法还包括提供至少一个侧屏蔽。屏蔽件至少从空气轴承表面位置延伸到不超过线圈前部位置。

69. 发明申请

US20110316130A1 THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US20110316130A1
公开(公告)日：2011-12-29
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

70. 发明授权

US07888186B2 Method for assembling stackable semiconductor packages 有权
标题翻译：堆叠式半导体封装的组装方法
公开(公告)号：US07888186B2
公开(公告)日：2011-02-15
申请号：US12499788
申请日：2009-07-08
申请人： Zhigang Bai , Weimin Chen , Zhijie Wang
发明人： Zhigang Bai , Weimin Chen , Zhijie Wang
IPC分类号： H01L21/00
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L25/105 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2225/1058 , H01L2924/01013 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15331 , H01L2924/181 , Y10T29/41 , Y10T29/51 , H01L2924/00014 , H01L2924/00012
摘要： A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.
摘要翻译：一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。第一表面包括接合焊盘和一个或多个管芯焊盘。导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。

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