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    • 68. 发明授权
    • Electrostatic discharge (ESD) protection structure
    • 静电放电(ESD)保护结构
    • US07067852B1
    • 2006-06-27
    • US09660386
    • 2000-09-12
    • Vladislav VashchenkoPeter J. HopperManuel Carneiro
    • Vladislav VashchenkoPeter J. HopperManuel Carneiro
    • H01L29/74H01L23/62
    • H01L27/0262H01L29/86H01L29/8618H01L2924/0002H01L2924/00
    • An ESD protection structure includes a semiconductor substrate of a first conductivity type, and first and second well regions of a second conductivity type disposed in the substrate. The first and second well regions are separated by a gap region of the substrate. Also included are first and second floating regions (of the second conductivity type) disposed in the first and second well regions adjacent to the gap region, respectively. The ESD protection structure also includes first and second contact regions of the first conductivity type disposed on the first and second well regions, respectively, and spaced apart from the first and second floating regions, respectively. The ESD protection structure also includes first and second contact regions of the second conductivity type disposed on the first and second well regions, respectively, and spaced apart from the first and second floating regions, respectively.
    • ESD保护结构包括第一导电类型的半导体衬底和设置在衬底中的第二导电类型的第一和第二阱区。 第一和第二阱区域被衬底的间隙区域分开。 还包括设置在与间隙区域相邻的第一和第二阱区域中的第一和第二浮动区域(第二导电类型)。 ESD保护结构还包括分别设置在第一和第二阱区上并分别与第一和第二浮动区分开的第一导电类型的第一和第二接触区域。 ESD保护结构还包括分别设置在第一和第二阱区上并分别与第一和第二浮动区隔开的第二导电类型的第一和第二接触区域。