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    • 66. 发明授权
    • Multi-level cell programming of PCM by varying the reset amplitude
    • 通过改变复位幅度对PCM进行多级单元编程
    • US07944740B2
    • 2011-05-17
    • US12564904
    • 2009-09-22
    • Chung H. LamMing-Hsiu LeeThomas NirschiBipin Rajendran
    • Chung H. LamMing-Hsiu LeeThomas NirschiBipin Rajendran
    • G11C11/00
    • G11C13/0004G11C11/5678G11C13/0069G11C2013/0083G11C2013/0092
    • A phase change memory device and a method for programming the same. The method includes determining a characterized lowest SET current and corresponding SET resistance for the phase change memory device. The method includes determining a characterized RESET current slope for the phase change memory device. The method also includes calculating a first current amplitude for a RESET pulse based on the characterized lowest SET current and the characterized RESET current slope. The method includes applying the RESET pulse to a target memory cell in the phase change memory device and measuring the resistance of the target memory cell. If the measured resistance is substantially less than a target resistance, the method further includes applying one or more additional RESET pulses. In one embodiment of the invention, the one or more additional RESET pulses have current amplitudes greater than a previously applied RESET pulse.
    • 相变存储器件及其编程方法。 该方法包括确定用于相变存储器件的特征最低的SET电流和相应的SET电阻。 该方法包括确定用于相变存储器件的特征化的RESET电流斜率。 该方法还包括基于所表征的最低SET电流和表征的RESET电流斜率来计算RESET脉冲的第一电流幅度。 该方法包括将RESET脉冲施加到相变存储器件中的目标存储单元并测量目标存储单元的电阻。 如果所测量的电阻远小于目标电阻,该方法还包括应用一个或多个附加的RESET脉冲。 在本发明的一个实施例中,一个或多个附加的RESET脉冲的电流幅度大于先前施加的RESET脉冲。
    • 67. 发明授权
    • Set algorithm for phase change memory cell
    • 相变存储单元的集合算法
    • US07869270B2
    • 2011-01-11
    • US12345384
    • 2008-12-29
    • Ming-Hsiu Lee
    • Ming-Hsiu Lee
    • G11C11/00
    • G11C13/0038G11C13/0004G11C13/0069G11C2013/0071G11C2013/009G11C2013/0092G11C2213/79
    • Memory devices and methods for operating such devices are described herein. A method is described herein for operating a memory cell comprising phase change material and programmable to a plurality of resistance states including a high resistance state and a lower resistance state. The method comprises applying a first bias arrangement to the memory cell to establish the lower resistance state, the first bias arrangement comprising a first voltage pulse. The method further comprises determining whether the memory cell is in the lower resistance state, and if the memory cell is not in the lower resistance state then applying a second bias arrangement to the memory cell. The second bias arrangement comprises a second voltage pulse having a pulse height greater than that of the first voltage pulse.
    • 这里描述了用于操作这样的设备的存储器件和方法。 本文描述了一种用于操作包括相变材料并且可编程为包括高电阻状态和较低电阻状态的多个电阻状态的存储单元的方法。 该方法包括将第一偏置装置施加到存储器单元以建立较低电阻状态,第一偏置装置包括第一电压脉冲。 该方法还包括确定存储器单元是处于较低电阻状态,以及如果存储单元不处于较低电阻状态,则向存储单元施加第二偏置布置。 第二偏置装置包括具有大于第一电压脉冲的脉冲高度的第二电压脉冲。
    • 70. 发明申请
    • NONVOLATITLE MEMORY ARRAY AND METHOD FOR OPERATING THEREOF
    • 非易失性存储器阵列及其操作方法
    • US20070291551A1
    • 2007-12-20
    • US11530585
    • 2006-09-11
    • Hao-Ming LienMing-Hsiu Lee
    • Hao-Ming LienMing-Hsiu Lee
    • G11C16/04
    • G11C16/0466H01L27/115H01L27/11568H01L29/66833H01L29/792
    • A mixed nonvolatile memory array. In the mixed nonvolatile memory array, each nonvolatile memory cell has at least one depletion mode memory cell. The depletion mode region is composed of a gate structure and a doped region. Since the thickness of the doped region is relatively thin, a voltage is applied on the gate structure to invert the conductive type of the doped region under the gate structure. Meanwhile, a bias is applied at both terminals of the doped region so as to control the operation of the depletion mode memory cell. In addition, each nonvolatile memory cell of the mixed nonvolatile memory array further comprises an enhanced mode memory cell. Therefore, each nonvolatile memory cell provides at least four carrier storage spaces so that the numbers of bits storing in a unit memory device is increased.
    • 混合非易失性存储器阵列。 在混合非易失性存储器阵列中,每个非易失性存储单元具有至少一个耗尽型存储单元。 耗尽模式区域由栅极结构和掺杂区域组成。 由于掺杂区域的厚度相对较薄,所以在栅极结构上施加电压以反转栅极结构下的掺杂区域的导电类型。 同时,在掺杂区域的两个端子处施加偏压,以便控制耗尽型存储单元的工作。 此外,混合非易失性存储器阵列的每个非易失性存储单元还包括增强型存储单元。 因此,每个非易失性存储单元提供至少四个载波存储空间,使得存储在单元存储器件中的位数增加。