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61. 发明申请

US20120300522A1 Semiconductor Device, Power Semiconductor Module and Power Conversion Device Equipped with Power Semiconductor Module 有权
标题翻译：半导体器件，功率半导体模块和配备功率半导体模块的电源转换器件
公开(公告)号：US20120300522A1
公开(公告)日：2012-11-29
申请号：US13499520
申请日：2010-08-24
申请人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Hideaki Ishikawa , Nobutake Tsuyuno , Shigeo Amagi
发明人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Hideaki Ishikawa , Nobutake Tsuyuno , Shigeo Amagi
IPC分类号： H01L23/52 , H02M7/48
CPC分类号： H02M7/003 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L24/34 , H01L25/072 , H01L2224/33 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/8484 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/1432 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.
摘要翻译：一种半导体器件包括：形成有开口的壳体; 容纳在壳体内的半导体元件; 容纳在壳体内并位于半导体元件的一个表面侧的第一导体板; 第二导体板，容纳在所述壳体内并且位于所述半导体元件的另一表面侧; 电连接到第一导体板的正母线，通过其提供直流电力; 电连接到第二导体板的负母线，通过其提供直流电力; 封闭壳体上的开口的第一树脂构件; 以及第二树脂构件，其密封半导体元件，第一导体板和第二导体板，并且由构成第一树脂构件的材料以外的材料构成。

62. 发明申请

US20110064433A1 Imaging device and image forming apparatus 有权
标题翻译：成像装置和图像形成装置
公开(公告)号：US20110064433A1
公开(公告)日：2011-03-17
申请号：US12805987
申请日：2010-08-27
申请人： Akira Asaoka , Atsushi Sampe , Toshiya Satoh
发明人： Akira Asaoka , Atsushi Sampe , Toshiya Satoh
IPC分类号： G03G15/00 , G03G21/00
CPC分类号： G03G21/00
摘要： An imaging device includes an image carrying member; a developing unit for forming a toner image by developing an electrostatic latent image that has been formed on the image carrying member in a charged state; a cleaning unit for cleaning a toner that remains on the image carrying member after the toner image has been transferred from the image carrying member onto a transfer material; a lubricant applying unit for applying a lubricant on the image carrying member; and a control unit for performing drive control of the image carrying member, the developing unit, the cleaning unit, and the lubricant applying unit. Before the imaging device starts an imaging operation, the control unit controls the image carrying member, the developing unit, and the cleaning unit to perform respective operations; while controls the lubricant applying unit to repeat performing and suspending the operation in an intermittent manner.
摘要翻译：成像装置包括图像承载部件; 显影单元，用于通过在已充电状态下显影已经形成在图像承载部件上的静电潜像来形成调色剂图像; 清洁单元，用于清洁在调色剂图像已经从图像承载构件转印到转印材料上之后残留在图像承载构件上的调色剂; 用于在图像承载部件上施加润滑剂的润滑剂施加单元; 以及用于执行图像承载构件，显影单元，清洁单元和润滑剂施加单元的驱动控制的控制单元。在成像装置开始成像操作之前，控制单元控制图像承载构件，显影单元和清洁单元以执行各自的操作; 同时控制润滑剂施加单元以间歇的方式重复执行和暂停操作。

63. 发明申请

US20100021205A1 LUBRICANT APPLICATOR AND IMAGE FORMING APPARATUS INCLUDING SAME 有权
标题翻译：润滑剂应用者和图像形成装置，包括它们
公开(公告)号：US20100021205A1
公开(公告)日：2010-01-28
申请号：US12571640
申请日：2009-10-01
申请人： Kenji Honjoh , Toshiya Satoh , Hiroyuki Nagashima , Fumihito Itoh , Hiroshi Ono , Ken Amemiya , Masahiko Shakuto , Toshio Koike , Yuji Arai , Nobuo Kuwabara , Michiya Okamoto
发明人： Kenji Honjoh , Toshiya Satoh , Hiroyuki Nagashima , Fumihito Itoh , Hiroshi Ono , Ken Amemiya , Masahiko Shakuto , Toshio Koike , Yuji Arai , Nobuo Kuwabara , Michiya Okamoto
IPC分类号： G03G21/00 , F16N7/14
CPC分类号： F16N7/24
摘要： A lubricant applicator includes a solid mold lubricant, a lubricant application roller, and a flicker member. The lubricant application roller scrapes and applies the lubricant to an image bearing member. The flicker member removes a powder substance adhered to the surface of the lubricant application roller and is disposed upstream of the solid mold lubricant in a direction of rotation of the lubricant application roller. The lubricant application roller, the flicker member, and the solid mold lubricant define a sealed space therebetween. A lubricant applicator includes the solid mold lubricant, the lubricant application roller, the flicker member, and an adherence prevention member that prevents the substance removed by the flicker member from adhering again to the lubricant application roller. A lubricant applicator includes the solid mold lubricant, the lubricant application roller, and a lubricant receiver that receives the scraped lubricant from the lubricant application roller.
摘要翻译：润滑剂涂布器包括固体模具润滑剂，润滑剂施加辊和闪烁构件。润滑剂施加辊刮擦并将润滑剂施加到图像承载部件上。闪烁部件除去附着在润滑剂涂布辊的表面上的粉末物质，并且在润滑剂涂布辊的旋转方向上设置在固体润滑剂的上游。润滑剂涂布辊，闪光部件和实心模具润滑剂在其间形成密封空间。润滑剂涂布器包括固体模具润滑剂，润滑剂施加辊，闪烁构件和防止由闪烁构件去除的物质再次粘附到润滑剂施加辊上的防粘附构件。润滑剂涂抹器包括固体模具润滑剂，润滑剂施加辊和从润滑剂施加辊接收刮擦的润滑剂的润滑剂接收器。

64. 外观设计

USD601499S1 Portions of capacitor module for power inverter 有权
标题翻译：电力变频器电容器模块部分
公开(公告)号：USD601499S1
公开(公告)日：2009-10-06
申请号：US29311341
申请日：2009-02-26
申请人： Takeshi Matsuo , Kinya Nakatsu , Fusanori Nishikimi , Toshiya Satoh
设计人： Takeshi Matsuo , Kinya Nakatsu , Fusanori Nishikimi , Toshiya Satoh

65. 发明申请

US20090231811A1 Electric Power Conversion Apparatus 有权
标题翻译：电力转换装置
公开(公告)号：US20090231811A1
公开(公告)日：2009-09-17
申请号：US12388910
申请日：2009-02-19
申请人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Keisuke Horiuchi , Toshiya Satoh , Hideki Miyazaki
发明人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Keisuke Horiuchi , Toshiya Satoh , Hideki Miyazaki
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , B60K6/26 , B60K6/28 , B60K6/46 , B60K17/16 , B60L11/1803 , B60L15/007 , B60L2210/40 , B60L2220/14 , B60L2240/429 , B60Y2200/92 , H01L23/3121 , H01L23/36 , H01L23/3675 , H01L23/473 , H01L23/492 , H01L23/49517 , H01L24/45 , H01L25/072 , H01L2224/40137 , H01L2924/00014 , H01L2924/0002 , H01L2924/1203 , H01L2924/13055 , H02M7/003 , H02M7/537 , H02P27/06 , H05K1/0262 , H05K7/2089 , Y10S903/906 , Y10S903/907 , Y10S903/909 , H01L2924/00 , H01L2224/45099
摘要： An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
摘要翻译：电力转换装置包括：形成冷却水通道的通道壳体; 包括逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括直流正极端子，直流负极端子和突出到外部的交流电流端子。通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。

66. 外观设计

USD598846S1 Portion of power module for power inverter 有权
标题翻译：电力变频器电源模块部分
公开(公告)号：USD598846S1
公开(公告)日：2009-08-25
申请号：US29311339
申请日：2009-02-26
申请人： Toshiya Satoh , Ryuichi Saito , Toshiki Kurosu , Michiaki Hiyoshi , Kinya Nakatsu , Katsunori Azuma
设计人： Toshiya Satoh , Ryuichi Saito , Toshiki Kurosu , Michiaki Hiyoshi , Kinya Nakatsu , Katsunori Azuma

67. 发明授权

US07378333B2 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07378333B2
公开(公告)日：2008-05-27
申请号：US11168460
申请日：2005-06-29
申请人： Toshiya Satoh , Masahiko Ogino , Tadanori Segawa , Yoshihide Yamaguchi , Hiroyuki Tenmei , Atsushi Kazama , Ichiro Anjo , Asao Nishimura
发明人： Toshiya Satoh , Masahiko Ogino , Tadanori Segawa , Yoshihide Yamaguchi , Hiroyuki Tenmei , Atsushi Kazama , Ichiro Anjo , Asao Nishimura
IPC分类号： H01L21/301
CPC分类号： H01L24/11 , H01L23/3192 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/0236 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05548 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： The present invention is a semiconductor device having the semiconductor element obtained by cutting a semiconductor wafer with the electrode pad formed on one side along a scribe line, a semiconductor element protective layer on the semiconductor element which has a opening on the pad, a stress cushioning layer on the layer which has the opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and the conductor protective layer on the layers, the layer and the conductor protective layer forming the respective end faces on the end surface of the semiconductor element inside the scribe line and exposing the range from the end face of the end surface to the inside of the scribe line.
摘要翻译：本发明是一种具有半导体元件的半导体器件，该半导体器件通过沿着划线在一侧形成电极焊盘切割半导体晶片而获得，半导体元件保护层在半导体元件上具有在该焊盘上的开口，应力缓冲在该焊盘上具有开口的层上的引线部分，经由开口从电极焊盘到达层的引线部分，引线部分上的外部电极和层上的导体保护层，层和导体保护层层，形成在划线内的半导体元件的端面上的各个端面，并露出从端面的端面到划线的内侧的范围。

68. 发明申请

US20050030823A1 Electronic circuit device 失效
标题翻译：电子电路装置
公开(公告)号：US20050030823A1
公开(公告)日：2005-02-10
申请号：US10910903
申请日：2004-08-04
申请人： Nobutake Tsuyuno , Toshiaki Ishii , Toshiya Satoh , Mitsuhiro Masuda
发明人： Nobutake Tsuyuno , Toshiaki Ishii , Toshiya Satoh , Mitsuhiro Masuda
IPC分类号： H01L23/28 , H01L21/56 , H01L23/36 , H01L25/04 , H01L25/16 , H01L25/18 , H05K1/03 , H05K3/00 , H05K3/28 , H05K3/38 , G11C8/02
CPC分类号： H01L23/4951 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/165 , H01L25/18 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2224/85099 , H01L2224/85205 , H01L2224/85399 , H01L2924/01012 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K3/386 , H05K2201/0209 , H05K2203/0315 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a module structure made by packing a whole multi-layer circuit board which connects a semiconductor operating element, semiconductor memory elements, and passive elements thereon and part of a supporting material on which said multi-layer circuit board is placed into a single package by transfer-molding; wherein said multi-layer circuit board and said supporting material are bonded together with a compound metallic material made up from copper oxide and at least one metal selected from a set of gold, silver, and copper.
摘要翻译：为了提供具有高紧凑性，小弯曲性，高气密性，高成型性，高质量生产率，高耐热冲击可靠性和高耐油可靠性的低成本高散热电子电路装置，模块结构通过将通过转印成型将半导体操作元件，半导体存储元件和无源元件及其上放置有多层电路板的支撑材料的一部分封装在单个封装中的整个多层电路板制成; 其中所述多层电路板和所述支撑材料用由氧化铜和至少一种选自金，银和铜的金属组成的复合金属材料结合在一起。

69. 发明授权

US06638631B2 Thermal stable low elastic modulus material and device using the same 失效
公开(公告)号：US06638631B2
公开(公告)日：2003-10-28
申请号：US10188961
申请日：2002-07-05
申请人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
发明人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
IPC分类号： B32B904
CPC分类号： H01L24/10 , C08L79/08 , C08L83/10 , H01L23/293 , H01L23/3114 , H01L23/3171 , H01L23/49894 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/351 , H05K1/0271 , Y10T428/31663 , C08L83/00 , H01L2224/13099 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.

70. 发明授权

US06627997B1 Semiconductor module and method of mounting 失效
标题翻译：半导体模块及其安装方法
公开(公告)号：US06627997B1
公开(公告)日：2003-09-30
申请号：US09463431
申请日：2000-01-27
申请人： Shuji Eguchi , Akira Nagai , Haruo Akahoshi , Takumi Ueno , Toshiya Satoh , Masahiko Ogino , Asao Nishimura , Ichiro Anjo , Hideki Tanaka
发明人： Shuji Eguchi , Akira Nagai , Haruo Akahoshi , Takumi Ueno , Toshiya Satoh , Masahiko Ogino , Asao Nishimura , Ichiro Anjo , Hideki Tanaka
IPC分类号： H01L2348
CPC分类号： H01L24/97 , H01L21/561 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81815 , H01L2224/97 , H01L2225/1005 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the semiconductor chips are covered with a single heat spread plate, and the whole space around the semiconductor chips, sandwiched between the wiring board and the heat spread plate, is filled with resin. The semiconductor chips are interconnected through the resin so that any stress exerted on any chips is dispersed. This diminishes the occurrence of cracks caused by stress concentration. Since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.
摘要翻译：在多芯片模块中，多个半导体芯片安装在单个布线板上。半导体芯片的上表面被单个扩散板覆盖，并且夹在布线板和扩散板之间的半导体芯片周围的整个空间填充有树脂。半导体芯片通过树脂相互连接，从而分散施加在任何芯片上的任何应力。这减少了由应力集中引起的裂纹的发生。由于半导体芯片和热扩散板与树脂粘合在一起，即使芯片的尺寸有变化，两者也可以容易地结合。此外，所有芯片和散热板的接合可以在单个工艺中完成。

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