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    • 62. 发明授权
    • Electrical connections for anodized thin film structures
    • 阳极氧化薄膜结构的电气连接
    • US08826528B2
    • 2014-09-09
    • US13131740
    • 2009-12-03
    • Steven D. TheissMichael A. Haase
    • Steven D. TheissMichael A. Haase
    • H05K3/00H01L21/768H05K3/40H01L27/12
    • H01L21/76802H01L27/1214H01L27/124H01L2224/24137H05K3/4092Y10T29/49002Y10T29/49124Y10T29/49147Y10T428/12396
    • Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier. The second metallization layer is disposed over the anodized layer, making electrical contact with the first electrically conductive layer in the via connection region.
    • 描述了形成电路的方法,通过该电路将第一薄膜金属化层电连接到第二薄膜金属化层。 通孔形成涉及在阳极氧化第一金属化层之前使用设置在通孔连接区域中的阳极氧化屏障和/或补充焊盘。 用于形成屏障的材料在阳极氧化期间对于阳极氧化溶液是基本上不可渗透的,并且破坏导电层和阻挡层之间的氧化物的形成。 辅助垫是非阳极氧化的,并被屏障覆盖,以在阳极氧化期间基本上防止电流流过垫。 阳极氧化后,屏障被去除。 如果补充垫具有足够的导电性,则可以在去除屏障之后留在第一金属化层上。 第二金属化层设置在阳极氧化层上,与通孔连接区域中的第一导电层电接触。
    • 64. 发明授权
    • Stable light source
    • 稳定的光源
    • US08748911B2
    • 2014-06-10
    • US13003491
    • 2009-07-14
    • Michael A. HaaseJames A. ThielenCatherine A. LeatherdaleBilly L. WeaverTerry L. Smith
    • Michael A. HaaseJames A. ThielenCatherine A. LeatherdaleBilly L. WeaverTerry L. Smith
    • H01L29/18
    • H05B33/0812H01L25/0753H01L33/502H01L33/507H05B33/0857Y02B20/343
    • Light emitting systems are disclosed. The light emitting system emits an output light that has a first color. The light emitting system includes a first electroluminescent device that emits light at a first wavelength in response to a first signal. The first wavelength is substantially independent of the first signal. The intensity of the emitted first wavelength light is substantially proportional to the first signal. The light emitting system further includes a first luminescent element that includes a second electroluminescent device and a first light converting layer. The second electroluminescent device emits light at a second wavelength in response to a second signal. The first light converting layer includes a semiconductor potential well and converts at least a portion of light at the second wavelength to light at a third wavelength that is longer than the second wavelength. The light emitting system combines light at the first wavelength with light at the third wavelength to form the output light at the first color. When one of the first and second signals changes from about 50% of a maximum rating of the signal to about 100% of the maximum rating, but the ratio of the first signal to the second signal remains substantially unchanged, the first color of the output light remains substantially unchanged.
    • 公开了发光系统。 发光系统发射具有第一颜色的输出光。 发光系统包括响应于第一信号发射第一波长的光的第一电致发光器件。 第一波长基本上与第一信号无关。 所发射的第一波长光的强度基本上与第一信号成比例。 发光系统还包括第一发光元件,其包括第二电致发光器件和第一光转换层。 第二电致发光器件响应于第二信号发射第二波长的光。 第一光转换层包括半导体势阱,并将第二波长的至少一部分光转换成比第二波长长的第三波长的光。 发光系统将第一波长的光与第三波长的光组合,以形成第一颜色的输出光。 当第一和第二信号中的一个信号从信号的最大额定值的约50%变化到最大额定值的约100%时,但是第一信号与第二信号的比率基本保持不变,输出的第一颜色 光线基本保持不变。
    • 66. 发明授权
    • Monochromatic light source
    • 单色光源
    • US08385380B2
    • 2013-02-26
    • US13060643
    • 2009-07-28
    • Catherine A. LeatherdaleMichael A. Haase
    • Catherine A. LeatherdaleMichael A. Haase
    • H01S5/00
    • H01S5/041H01S5/02476H01S5/183H01S5/423
    • Light emitting systems are disclosed. The light emitting system includes an electroluminescent device that emits light at a first wavelength. The light emitting system further includes an optical cavity that enhances emission of light from a top surface of the light emitting system and suppresses emission of light from one or more sides of the light emitting system. The optical cavity includes a semiconductor multilayer stack that receives the emitted first wavelength light and converts at least a portion of the received light to light of a second wavelength. The semiconductor multilayer stack includes a II-VI potential well. The integrated emission intensity of all light at the second wavelength that exit the light emitting system is at least 10 times the integrated emission intensity of all light at the first wavelength that exit the light emitting system.
    • 公开了发光系统。 发光系统包括发射第一波长的光的电致发光器件。 发光系统还包括光腔,其增强来自发光系统的顶表面的光的发射并抑制来自发光系统的一个或多个侧面的光的发射。 光腔包括半导体多层堆叠,其接收所发射的第一波长光,并将接收到的光的至少一部分转换成第二波长的光。 半导体多层堆叠包括II-VI势阱。 离开发光系统的第二波长的所有光的集成发射强度是离开发光系统的第一波长的所有光的集成发射强度的至少10倍。
    • 69. 发明申请
    • Electrical Connections for Anodized Thin Film Structures
    • 阳极氧化薄膜结构的电气连接
    • US20110242778A1
    • 2011-10-06
    • US13131740
    • 2009-12-03
    • Steven D. TheissMichael A. Haase
    • Steven D. TheissMichael A. Haase
    • H05K7/00C25D5/02C25D7/00H05K3/07B32B3/10
    • H01L21/76802H01L27/1214H01L27/124H01L2224/24137H05K3/4092Y10T29/49002Y10T29/49124Y10T29/49147Y10T428/12396
    • Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier. The second metallization layer is disposed over the anodized layer, making electrical contact with the first electrically conductive layer in the via connection region.
    • 描述了形成电路的方法,通过该电路将第一薄膜金属化层电连接到第二薄膜金属化层。 通孔形成涉及在阳极氧化第一金属化层之前使用设置在通孔连接区域中的阳极氧化屏障和/或补充焊盘。 用于形成屏障的材料在阳极氧化期间对于阳极氧化溶液是基本上不可渗透的,并且破坏导电层和阻挡层之间的氧化物的形成。 辅助垫是非阳极氧化的,并被屏障覆盖,以在阳极氧化期间基本上防止电流流过垫。 阳极氧化后,屏障被去除。 如果补充垫具有足够的导电性,则可以在去除屏障之后留在第一金属化层上。 第二金属化层设置在阳极氧化层上,与通孔连接区域中的第一导电层电接触。
    • 70. 发明申请
    • MONOCHROMATIC LIGHT SOURCE WITH HIGH ASPECT RATIO
    • 单色光源高倍率
    • US20110140128A1
    • 2011-06-16
    • US13058315
    • 2009-08-18
    • Catherine A. LeatherdaleMichael A. HaaseTodd A. Ballen
    • Catherine A. LeatherdaleMichael A. HaaseTodd A. Ballen
    • H01L33/50H01L33/20H01L33/28
    • H01L33/20H01L33/08H01L33/10H01L33/505
    • Light emitting systems are disclosed. The light emitting system includes an LED that emits light at a first wave-length. A primary portion of the emitted first wavelength light exits the LED from a top surface of the LED that has a minimum lateral dimension Wmin. The remaining portion of the emitted first wavelength light exits the LED from one or more sides of the LED that has a maximum edge thickness Tmax (122, 124). The ratio Wmin/Tmax is at least 30. The light emitting system further includes a re-emitting semiconductor construction that includes a semiconductor potential well. The re-emitting semiconductor construction receives the first wavelength light that exits the LED from the top surface and converts at least a portion of the received light to light of a second wavelength. The integrated emission intensity of all light at the second wavelength that exit the light emitting system is at least 4 times the integrated emission intensity of all light at the first wavelength that exit the light emitting system.
    • 公开了发光系统。 发光系统包括发射第一波长的光的LED。 发射的第一波长光的主要部分从具有最小横向尺寸Wmin的LED的顶表面离开LED。 发射的第一波长光的剩余部分从具有最大边缘厚度Tmax(122,124)的LED的一侧或多侧离开LED。 比率Wmin / Tmax至少为30.发光系统还包括包括半导体势阱的再发射半导体结构。 再发射半导体结构从顶表面接收离开LED的第一波长光,并将接收的光的至少一部分转换成第二波长的光。 离开发光系统的第二波长的所有光的集成发射强度是离开发光系统的第一波长的所有光的集成发射强度的至少4倍。