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    • 61. 发明授权
    • Semiconductor memory device having hierarchical bit line structure
    • 具有分层位线结构的半导体存储器件
    • US5495440A
    • 1996-02-27
    • US321711
    • 1994-10-12
    • Mikio Asakura
    • Mikio Asakura
    • G11C11/401G11C11/404G11C11/4097H01L21/8242H01L27/10H01L27/108G11C11/24
    • G11C11/4097
    • A memory cell array is divided into a plurality of memory cell groups in the column direction. In each memory cell group, a sub-bit line SBL and a sub-cell plate line SCPL are located. A pair of main bit lines are arranged for memory cells on one column. For each sub-cell plate line, a switching transistor is provided connecting the sub-cell plate line to one main bit line in response to a group select signal. For each sub-bit line, a switching transistor is provided connecting corresponding sub-bit lines to the other main bit line in response to a group select signal BS. A constant voltage VBL is transmitted to the sub-cell plate line through a switching transistor rendered conductive in response to a group select signal CPPR. A dynamic type semiconductor memory device is provided whose memory array layout is facilitated and in which a sufficient read potential difference is produced on a pair of bit lines upon word line selection.
    • 存储单元阵列在列方向上分为多个存储单元组。 在每个存储单元组中,定位有子位线SBL和子单元板线SCPL。 一列主位线用于一列上的存储单元。 对于每个子电池板线,提供响应于组选择信号将子电池板线连接到一个主位线的开关晶体管。 对于每个子位线,提供响应于组选择信号BS将对应的子位线连接到另一个主位线的开关晶体管。 恒定电压VBL通过响应于组选择信号CPPR而导通的开关晶体管传送到子电池板线。 提供一种动态型半导体存储器件,其存储阵列布局方便,并且在字线选择时在一对位线上产生足够的读电位差。
    • 62. 发明授权
    • Cache memory system having error correcting circuit
    • 具有纠错电路的高速缓冲存储器系统
    • US4953164A
    • 1990-08-28
    • US254233
    • 1988-10-06
    • Mikio AsakuraKazuyasu FujishimaYoshio Matsuda
    • Mikio AsakuraKazuyasu FujishimaYoshio Matsuda
    • G11C11/413G06F11/10G06F12/08G11C11/401G11C29/00G11C29/42
    • G06F11/1064G06F12/0802
    • There are provided a first memory cell array and a second memory cell array. The first memory cell array comprises a dynamic RAM and the second memory cell array comprises a static RAM. In addition, the second memory cell array has smaller capacity than that of the first memory cell array. An error correcting circuit, a check bit generating circuit and a register are connected between the first memory cell array and the second memory cell array. Data which is frequently accessed is transferred from the first memory cell array to the second memory cell array and stored therein. Access is made to the second memory cell array. When data which is required is not in the second memory cell array, access is made to the first memory cell array. At the time of transferring data from the first memory cell array to the second memory cell array, errors are corrected by the error correcting circuit. The check bit generating circuit is responsive to data whose error is corrected by the error correcting circuit for generating new check bits.
    • 提供了第一存储单元阵列和第二存储单元阵列。 第一存储单元阵列包括动态RAM,第二存储单元阵列包括静态RAM。 此外,第二存储单元阵列具有比第一存储单元阵列小的容量。 纠错电路,校验位产生电路和寄存器连接在第一存储单元阵列和第二存储单元阵列之间。 频繁访问的数据从第一存储单元阵列传送到第二存储单元阵列并存储在其中。 访问第二个存储单元阵列。 当所需的数据不在第二存储单元阵列中时,对第一存储单元阵列进行访问。 在将数据从第一存储单元阵列传送到第二存储单元阵列时,错误校正电路校正错误。 校验位产生电路响应于错误被纠错电路校正的数据,用于产生新的校验位。
    • 67. 发明授权
    • Semiconductor memory device with predecoder
    • 具有预解码器的半导体存储器件
    • US6064607A
    • 2000-05-16
    • US177484
    • 1998-10-23
    • Takeo MikiMikio AsakuraSatoshi Kawasaki
    • Takeo MikiMikio AsakuraSatoshi Kawasaki
    • G11C8/10G11C29/00G11C7/00
    • G11C29/80G11C8/10
    • Each of first and second program circuits includes a determination node, first to fourth fuses, first to fourth N channel MOS transistors, and first to fourth supply lines. The first to fourth N channel MOS transistors receive first to fourth row address predecode signals, respectively. The first N channel MOS transistor included in the first program circuit and the first N channel MOS transistor included in the second program circuit are arranged adjacent to each other. The first supply line provides a first row address predecode signal to the gate of these two N channel MOS transistors. The same applies for the second to fourth N channel MOS transistors and the second to fourth supply lines. Accordingly, the interconnection capacitance of the row address predecode signal line can be reduced. Also, the size of the transistor driving the row address predecode signal and the transistors in the program circuit can be reduced to allow a smaller layout area for the entire chip.
    • 第一和第二编程电路中的每一个包括确定节点,第一至第四保险丝,第一至第四N沟道MOS晶体管和第一至第四电源线。 第一至第四N沟道MOS晶体管分别接收第一至第四行地址预解码信号。 包括在第一编程电路中的第一N沟道MOS晶体管和包括在第二编程电路中的第一N沟道MOS晶体管彼此相邻布置。 第一电源线为这两个N沟道MOS晶体管的栅极提供第一行地址预解码信号。 同样适用于第二至第四N沟道MOS晶体管和第二至第四供电线。 因此,可以减少行地址预解码信号线的互连电容。 此外,可以减小驱动行地址预解码信号的晶体管的尺寸和程序电路中的晶体管的尺寸,以允许整个芯片的布局面积较小。