专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US08430535B2 Socket device, lamp device and lighting device 有权
标题翻译：插座装置，灯装置和照明装置
公开(公告)号：US08430535B2
公开(公告)日：2013-04-30
申请号：US13233827
申请日：2011-09-15
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00 , H01R33/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： There is provided a lighting fixture capable of efficiently radiating heat of a lamp device attached to a socket device.By attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
摘要翻译：提供了能够有效地辐射安装在插座装置上的灯具的热量的照明器材。通过将灯装置安装到插座装置，灯装置的盖部与夹具本体接触，并通过弹性体压靠固定体，并与夹具本体紧密接触。通过灯装置的LED的照明而产生的热量从帽部传导到夹具本体并被有效地辐射。

62. 发明授权

US08376562B2 Light-emitting module, self-ballasted lamp and lighting equipment 失效
标题翻译：发光模块，自镇流灯和照明设备
公开(公告)号：US08376562B2
公开(公告)日：2013-02-19
申请号：US12886123
申请日：2010-09-20
申请人： Shigeru Osawa , Masahiko Kamata , Takuro Hiramatsu , Tsutomu Araki , Hitoshi Kawano
发明人： Shigeru Osawa , Masahiko Kamata , Takuro Hiramatsu , Tsutomu Araki , Hitoshi Kawano
IPC分类号： F21V33/00
CPC分类号： F21V3/00 , F21K9/23 , F21V3/061 , F21V3/062 , F21V17/101 , F21V19/0055 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： A light-emitting module includes a module substrate, semiconductor light-emitting elements and a connection substrate. On one face of the module substrate, a conductive layer is formed. The semiconductor light-emitting elements and the connection substrate are mounted on the conductive layer of the module substrate. Electric wires, which extend from a lighting circuit, are connected to the connection substrate. Power is supplied to the semiconductor light-emitting elements through the connection substrate and the conductive layer of the module substrate.
摘要翻译：发光模块包括模块基板，半导体发光元件和连接基板。在模块基板的一个面上形成导电层。半导体发光元件和连接基板安装在模块基板的导电层上。从照明电路延伸的电线连接到连接基板。通过连接基板和模块基板的导电层向半导体发光元件供电。

63. 发明申请

US20120320610A1 Socket Device 有权
公开(公告)号：US20120320610A1
公开(公告)日：2012-12-20
申请号：US13597893
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V21/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

64. 发明申请

US20120320593A1 Light Emitting Diode (LED) Bulb 有权
标题翻译：发光二极管（LED）灯泡
公开(公告)号：US20120320593A1
公开(公告)日：2012-12-20
申请号：US13595557
申请日：2012-08-27
申请人： Nobuhiko Betsuda , Takumi Suwa , Hitoshi Kawano , Akiko Saito , Makoto Bessho , Yusuke Shibahara , Hiroki Tamai , Nobuo Shibano , Keiichi Shimizu
发明人： Nobuhiko Betsuda , Takumi Suwa , Hitoshi Kawano , Akiko Saito , Makoto Bessho , Yusuke Shibahara , Hiroki Tamai , Nobuo Shibano , Keiichi Shimizu
IPC分类号： F21V29/00
CPC分类号： F21V29/02 , F21K9/232 , F21V3/00 , F21V23/0492 , F21V29/67 , F21V29/773 , F21V29/83 , F21Y2115/10
摘要： A lighting device may include a substrate attached to one edge side of a radiator and a cover may be attached to cover the substrate. Heat-radiating fins may be provided on the other edge side of the radiator and an air-cooling unit may be rotatably provided inside the heat-radiating fins, thereby enabling freely rotation. In one or more examples, a case storing a circuit part is attached to the other edge side of the radiator and a cap is provided to the case. By the air flow from the air-cooling unit, the heat-radiating fins are caused to be a part of the ventilation path to allow for ventilation of the inside of the radiator.
摘要翻译：照明装置可以包括附接到散热器的一个边缘侧的基板，并且可以附接盖以覆盖基板。散热片可以设置在散热器的另一边缘侧，并且空气冷却单元可以可旋转地设置在散热片内部，从而能够自由旋转。在一个或多个示例中，存储电路部分的壳体附接到散热器的另一边缘侧，并且在壳体上设置盖。通过来自空气冷却单元的空气流，使散热片成为通风路径的一部分，以允许散热器内部的通风。

65. 发明申请

US20120307497A1 Light-Emitting Module and Lighting Apparatus 审中-公开
公开(公告)号：US20120307497A1
公开(公告)日：2012-12-06
申请号：US13587278
申请日：2012-08-16
申请人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
发明人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
IPC分类号： F21V21/00
CPC分类号： F21V29/70 , F21K9/00 , F21K9/20 , F21K9/232 , F21S8/02 , F21V23/005 , F21V23/06 , F21V29/76 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H05K1/181
摘要： A light-emitting module may be configured to have improved light emission efficiency and light distribution characteristics. A light-emitting module may include a substrate having a front surface side as a component mounting surface and a rear surface side as a flat heat dissipating surface, a plurality of light-emitting elements arranged in a manner protruding at a central portion of the component mounting surface of the substrate. The light-emitting elements may radiate light at least in an upper surface direction and in a direction along the component mounting surface. The module may further include one or more lighting circuit components electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged closer to the peripheral edge side of the substrate than the light emitting elements on the component mounting surface of the substrate, and a connector for power supply connection.

66. 发明申请

US20120306352A1 Light-Emitting Module and Lighting Apparatus 审中-公开
标题翻译：发光模块和照明设备
公开(公告)号：US20120306352A1
公开(公告)日：2012-12-06
申请号：US13587225
申请日：2012-08-16
申请人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
发明人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
IPC分类号： H05B33/00
CPC分类号： F21K9/135 , F21K9/00 , F21K9/20 , F21K9/232 , F21S8/02 , F21V23/005 , F21V23/06 , F21V29/70 , F21V29/76 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H05K1/181
摘要： A light-emitting module may be configured to have improved light emission efficiency and light distribution characteristics. A light-emitting module may include a substrate having a front surface side as a component mounting surface and a rear surface side as a flat heat dissipating surface, a plurality of light-emitting elements arranged in a manner protruding at a central portion of the component mounting surface of the substrate. The light-emitting elements may radiate light at least in an upper surface direction and in a direction along the component mounting surface. The module may further include one or more lighting circuit components electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged closer to the peripheral edge side of the substrate than the light emitting elements on the component mounting surface of the substrate, and a connector for power supply connection.
摘要翻译：发光模块可以被配置为具有改进的发光效率和光分布特性。发光模块可以包括具有作为部件安装表面的正面侧和作为平坦散热表面的后表面侧的基板，以在部件的中心部分突出的方式布置的多个发光元件基板的安装表面。发光元件可以至少在上表面方向和沿着部件安装表面的方向上辐射光。模块还可以包括一个或多个照明电路部件，其通过布置在基板上的布线图案电连接到发光元件，并且布置成比基板的元件安装表面上的发光元件更靠近基板的周边边缘基板和用于电源连接的连接器。

67. 发明申请

US20120306344A1 Light-Emitting Module and Lighting Apparatus 审中-公开
公开(公告)号：US20120306344A1
公开(公告)日：2012-12-06
申请号：US13587235
申请日：2012-08-16
申请人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
发明人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
IPC分类号： H05B33/00
CPC分类号： F21V29/70 , F21K9/00 , F21K9/20 , F21K9/232 , F21S8/02 , F21V23/005 , F21V23/06 , F21V29/76 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H05K1/181
摘要： A light-emitting module may be configured to have improved light emission efficiency and light distribution characteristics. A light-emitting module may include a substrate having a front surface side as a component mounting surface and a rear surface side as a flat heat dissipating surface, a plurality of light-emitting elements arranged in a manner protruding at a central portion of the component mounting surface of the substrate. The light-emitting elements may radiate light at least in an upper surface direction and in a direction along the component mounting surface. The module may further include one or more lighting circuit components electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged closer to the peripheral edge side of the substrate than the light emitting elements on the component mounting surface of the substrate, and a connector for power supply connection.

68. 发明申请

US20120063148A1 LIGHT-EMITTING MODULE AND LIGHTING APPARATUS 审中-公开
标题翻译：发光模组和照明装置
公开(公告)号：US20120063148A1
公开(公告)日：2012-03-15
申请号：US13227133
申请日：2011-09-07
申请人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
发明人： Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
IPC分类号： F21V7/00
CPC分类号： F21V29/70 , F21K9/00 , F21K9/20 , F21K9/232 , F21S8/02 , F21V23/005 , F21V23/06 , F21V29/76 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H05K1/181
摘要： A light-emitting module includes a substrate having a front surface side component mounting surface and a rear surface side flat heat dissipating surface. Light-emitting elements are arranged to protrude at a central portion of the component mounting surface and radiate light at least man upper surface direction and in a direction along the component mounting surface. A lighting circuit component is electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged closer to the peripheral edge side of the substrate than the light emitting elements: A connector for power supply connection is arranged closer to the peripheral edge side of the substrate than the light emitting elements on the component mounting surface of the substrate and is electrically connected to the lighting circuit component.
摘要翻译：发光模块包括具有前表面侧部件安装表面和后表面侧平坦散热表面的基板。发光元件布置成在部件安装表面的中心部分处突出，并且至少在人的上表面方向和沿着部件安装表面的方向上辐射光。照明电路部件通过布置在基板上的布线图案与发光元件电连接，并且布置成比发光元件更靠近基板的周边边缘侧。电源连接用连接器配置成靠近与基板的部件安装面上的发光元件相比，与基板的周边边缘侧电连接。

69. 发明申请

US20120008318A1 LIGHTING APPARATUS 审中-公开
标题翻译：照明设备
公开(公告)号：US20120008318A1
公开(公告)日：2012-01-12
申请号：US13256649
申请日：2010-04-27
申请人： Tomoko Ishiwata , Kazunori Yashiro , Kazutoshi Mita , Hitoshi Kawano , Katsusuke Uchino , Isao Yamazaki
发明人： Tomoko Ishiwata , Kazunori Yashiro , Kazutoshi Mita , Hitoshi Kawano , Katsusuke Uchino , Isao Yamazaki
IPC分类号： F21S2/00 , F21V9/16
CPC分类号： H05B33/086 , F21K9/00 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H05B33/0869 , H01L2924/00
摘要： A lighting apparatus includes a red LED; a green LED; a blue LED; and a white LED made up of a blue light-emitting element and a yellow phosphor, wherein the red LED, the green LED, the blue LED, and the white LED generate 26 to 38%, 35 to 50%, 0 to 2%, and 12 to 33% of light, respectively, and white light obtained by additive color mixing of light from the red, green, blue, and white LEDs has a correlated color temperature of 2800 K or more to less than 3500 K, a deviation of 0.02 or below in absolute value, and a color gamut area ratio of 120% or more to 140% or less. Consequently, the lighting apparatus can radiate an illuminating light which makes colors look vivid.
摘要翻译：照明装置包括红色LED; 绿色LED; 蓝色LED; 以及由蓝色发光元件和黄色荧光体构成的白色LED，其中红色LED，绿色LED，蓝色LED和白色LED产生26〜38％，35〜50％，0〜2％和12〜33％的光，并且通过对来自红，绿，蓝和白LED的光进行加色混合而获得的白光具有2800K以上至小于3500K的相关色温，偏差的绝对值为0.02以下，色域面积率为120％以上且140％以下。因此，照明装置可以照射使得颜色看起来生动的照明光。

70. 发明申请

US20120002429A1 SOCKET DEVICE, LAMP DEVICE AND LIGHTING DEVICE 有权
标题翻译：插座装置，灯装置和照明装置
公开(公告)号：US20120002429A1
公开(公告)日：2012-01-05
申请号：US13233827
申请日：2011-09-15
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00 , F21V21/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： There is provided a lighting fixture capable of efficiently radiating heat of a lamp device attached to a socket device.By attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with. a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
摘要翻译：提供了能够有效地辐射安装在插座装置上的灯具的热量的照明器材。通过将灯装置安装到插座装置上，使灯装置的盖部接触。夹具本体，并通过弹性体抵压并与夹具本体紧密接触。通过灯装置的LED的照明而产生的热量从帽部传导到夹具本体并被有效地辐射。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式