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    • 64. 发明授权
    • Semiconductor devices
    • 半导体器件
    • US06876015B2
    • 2005-04-05
    • US10202063
    • 2002-07-25
    • Katsumi Mori
    • Katsumi Mori
    • H01L21/82H01L23/525H01L27/10
    • H01L23/5258H01L2924/0002H01L2924/00
    • A semiconductor device may include a fuse section 110 in which a plurality of fuses 20 to be fused by irradiation of a laser beam are formed. The fuses 20 are arranged at a pitch X, and an insulation layer 36 having a specified film thickness covers upper portions of the fuses 20. The fuses 20 may have a width W and a film thickness T that have a relation indicated by the following equation: T≧0.4/W. Furthermore, the width W of the fuse 20 may be 3 μm or less, and may be less than ½ of the pitch X of the fuses 20. Also, the film thickness of the fuse 20 may be 0.7 μm or less.
    • 半导体器件可以包括熔丝部分110,其中形成通过激光束的照射熔化的多个保险丝20。 保险丝20以间距X布置,并且具有指定膜厚度的绝缘层36覆盖保险丝20的上部。保险丝20可以具有宽度W和膜厚度T,该宽度W和膜厚度T具有下列等式 :T> = 0.4 / W。 此外,保险丝20的宽度W可以为3μm以下,并且可以小于保险丝20的间距X的1/2。另外,保险丝20的膜厚可以为0.7μm以下。
    • 66. 发明授权
    • Alkaline battery
    • 碱性电池
    • US06794082B2
    • 2004-09-21
    • US09947978
    • 2001-09-06
    • Katsumi MoriTakumi OhharaKenji Sato
    • Katsumi MoriTakumi OhharaKenji Sato
    • H01M208
    • H01M2/0275H01M2/0222H01M2/0272H01M4/48H01M4/62H01M6/12H01M10/52H01M2004/028H01M2300/0014
    • An alkaline battery constructed of a cathode can and an anode cup in such a way that an open end of the cathode can is sealed by the anode cup, with a gasket interposed between them, characterized in that the open end of the anode cup is folded back in U-shape along its periphery and the fold is tightened for hermetic sealing by the internal periphery of the open end of the cathode can, with the gasket interposed between them, the anode cup has a higher hydrogen over potential material coating layer formed in a limited region on the inside thereof excluding the bottom of the U-shaped fold and the outer periphery of the fold, the cathode can contains the cathode active material and silver-nickelite (AgNiO2), the anode cup contains the anode mix which is mercury-free zinc or zinc alloy powder as the anode active material.
    • 一种由阴极罐和阳极杯构成的碱性电池,使得阴极罐的开口端由阳极杯密封,垫圈介于它们之间,其特征在于阳极杯的开口端折叠 沿着其周边回U形,并且折叠部被紧固以通过阴极罐的开口端的内周进行气密密封,其中衬垫介于它们之间,阳极杯具有较高的在潜在材料涂层上形成的氢 除了U形折叠的底部和折叠的外周之外的其内部的有限区域,阴极可以包含正极活性物质和银 - 镍铋(AgNiO 2),阳极杯包含作为汞的阳极混合物 - 无锌或锌合金粉末作为阳极活性材料。
    • 68. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US06518633B2
    • 2003-02-11
    • US09773779
    • 2001-02-02
    • Katsumi MoriKenji Kojima
    • Katsumi MoriKenji Kojima
    • H01L2976
    • H01L21/76229
    • A semiconductor wafer 10 has a chip region 20 and a non-chip region 22. Dummy trench isolation regions 40 are formed in at least a part of the non-chip region 22 of the semiconductor wafer 10. The dummy trench isolation regions 40 are formed in a region extending by a specified distance D10 into the non-chip region 22 from a boundary between the chip region 20 and the non-chip region 22. A method is also provided for processing a semiconductor wafer 10 having a chip region 20 and a non-chip region 22. The method includes a process for forming trench isolation regions in the semiconductor wafer 10. The process includes the steps of forming dummy trench isolation regions 40 in at least a part of the non-chip region 22 of the semiconductor wafer 10, wherein the dummy trench isolation regions 40 are formed in a region extending by a specified distance D10 into the non-chip region 22 from a boundary between the chip region 20 and the non-chip region 22.
    • 半导体晶片10具有芯片区域20和非芯片区域22.在半导体晶片10的非芯片区域22的至少一部分中形成虚设沟槽隔离区域40.形成虚设沟槽隔离区域40 在从芯片区域20和非芯片区域22之间的边界延伸指定距离D10的区域到非芯片区域22中。还提供了一种用于处理具有芯片区域20和 非芯片区域22.该方法包括在半导体晶片10中形成沟槽隔离区域的工艺。该工艺包括在半导体晶片的非芯片区域22的至少一部分中形成虚设沟槽隔离区域40的步骤 如图10所示,其中虚设沟槽隔离区40形成在从芯片区域20和非芯片区域22之间的边界延伸到非芯片区域22的特定距离D10的区域中。
    • 70. 发明授权
    • Surface emitting semiconductor laser and its manufacturing process
    • 表面发射半导体激光器及其制造工艺
    • US5625637A
    • 1997-04-29
    • US359964
    • 1994-12-19
    • Katsumi MoriTatsuya AsakaHideaki Iwano
    • Katsumi MoriTatsuya AsakaHideaki Iwano
    • H01S5/028H01S5/183H01S5/22H01S3/19
    • H01S5/18369H01S2304/04H01S5/18308H01S5/18341H01S5/2211H01S5/2224
    • A surface emitting semiconductor laser, with a resonator cavity transverse to the planar extent of the deposited layers, is provided with a first reflection mirror on the substrate side composed of alternating layers comprising a first layer that is made of a Group III-V compound semiconductor and a second layer that is made of a Group III-V compound semiconductor with an energy bandgap that is larger than that of the first layer. A second reflection mirror is provided at the opposite end of the cavity adjacent to a column like resonator portion. At least the first reflection mirror comprises a distributive Bragg reflection (DBR) multiple layer mirror that has an interface region between first and second layers having a carrier concentration that is higher than that of other regions. The column like resonator portion is surrounded by a buried layer which may consist of two layers, the first layer functioning as barrier layer and the second layer functioning as a flattening layer. The first layer may be comprised of a silicon compound and the second layer may be comprised of SOG or a resin compound. The multiple layer band structure of the DBR mirror is improved, current easily flows vertically through the multiple layers and the element resistance is low. In addition, a simple and reliable method is employed to fabricate the DBR mirror and the dual buried layer, respectively, because the doping concentration is controlled through dopant gas flow control or is controlled through light and can be easily accomplished without using comparatively high temperature processing.
    • 具有横向于沉积层的平面范围的谐振腔的表面发射半导体激光器在基板侧上设置有由交替层组成的第一反射镜,该交替层包括由III-V族化合物半导体 以及由具有比第一层的能带隙大的能带隙的III-V族化合物半导体制成的第二层。 第二反射镜设置在与柱状谐振器部分相邻的腔的相对端。 至少第一反射镜包括分布布拉格反射(DBR)多层反射镜,其在第一和第二层之间具有高于其它区域的载流子浓度的界面区域。 柱状谐振器部分被埋入层包围,该掩埋层可以由两层组成,第一层用作阻挡层,第二层用作平坦化层。 第一层可以由硅化合物组成,第二层可以由SOG或树脂化合物构成。 DBR镜的多层带结构得到改善,电流容易垂直流过多层,元件电阻较低。 另外,采用简单可靠的方法来制造DBR镜和双埋层,因为掺杂浓度通过掺杂剂气体流量控制来控制或通过光控制并且可以容易地实现而不使用比较高的温度处理 。