会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 68. 发明授权
    • Thin film integrated circuit and method for manufacturing the same, CPU, memory, electronic card and electronic device
    • 薄膜集成电路及其制造方法,CPU,存储器,电子卡和电子设备
    • US07923778B2
    • 2011-04-12
    • US11876429
    • 2007-10-22
    • Tetsuji YamaguchiAtsuo IsobeSatoru Saito
    • Tetsuji YamaguchiAtsuo IsobeSatoru Saito
    • H02L27/14H01L27/88
    • H01L27/1259H01L27/1214
    • A salicide process is conducted to a thin film integrated circuit without worrying about damages to a glass substrate, and thus, high-speed operation of a circuit can be achieved. A base metal film, an oxide and a base insulating film are formed over a glass substrate. A TFT having a sidewall is formed over the base insulating film, and a metal film is formed to cover the TFT. Annealing is conducted by RTA or the like at such a temperature that does not cause shrinkage of the substrate, and a high-resistant metal silicide layer is formed in source and drain regions. After removing an unreacted metal film, laser irradiation is conducted for the second annealing; therefore a silicide reaction proceeds and the high-resistant metal silicide layer becomes a low-resistant metal silicide layer. In the second annealing, a base metal film absorbs and accumulates heat of the laser irradiation, and a semiconductor layer is supplied with beat of the base metal film in addition to heat of the laser irradiation, thereby enhancing efficiency of the silicide reaction in the source and drain regions.
    • 对薄膜集成电路进行自对准处理,而不用担心对玻璃基板的损坏,因此可以实现电路的高速操作。 在玻璃基板上形成贱金属膜,氧化物和基底绝缘膜。 在基底绝缘膜上形成具有侧壁的TFT,并且形成覆盖TFT的金属膜。 在不会引起基板收缩的温度下由RTA等进行退火,在源极和漏极区域形成高阻金属硅化物层。 在除去未反应的金属膜之后,对第二次退火进行激光照射; 因此进行硅化物反应,高阻金属硅化物层变成低电阻金属硅化物层。 在第二退火中,贱金属膜吸收并累积激光照射的热量,并且除了激光照射的热量之外,还向半导体层供给贱金属膜的节拍,从而提高源的硅化物反应的效率 和漏区。