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    • 61. 发明授权
    • Method of manufacturing an ink jet printer head
    • 制造喷墨打印机头的方法
    • US06594898B1
    • 2003-07-22
    • US09596144
    • 2000-06-16
    • Sang Kyeong Yun
    • Sang Kyeong Yun
    • B21D5376
    • B41J2/1628B41J2/161B41J2/1623B41J2/1629B41J2/1631B41J2/1642B41J2/1643B41J2/1645B41J2/1646B41J2002/14306Y10S29/016Y10T29/42Y10T29/49401
    • A method of making ink jet printer head body provides a silicon wafer forming a restrictor plate over the silicon wafer by doping an impurity component. A nozzle plate is formed under the silicon wafer by doping an impurity component and a nozzle is formed by etching after the forming of the nozzle plate. A channel going through the restrictor plate and silicon wafer is formed by etching after the forming of the restrictor plate. The channel is formed of a wide upper portion and a narrow lower portion by patterning the silicon wafer and restrictor plate narrowly and etching the silicon wafer and restrictor plate, and then patterning the silicon wafer and restrictor plate widely and etching the silicon wafer and restrictor plate, except for the lower end of the silicon wafer. A restrictor at the restrictor plate is formed by etching after the patternings of the restrictor plate. One or more reservers continue to the restrictor under the restrictor by etching a definite thickness after the patternings of the silicon wafer.
    • 制造喷墨打印机头体的方法通过掺杂杂质成分在硅晶片上形成限制板。 通过掺杂杂质成分在硅晶片之下形成喷嘴板,并且在喷嘴板形成之后通过蚀刻形成喷嘴。 在限流板形成之后通过蚀刻形成通过限流板和硅晶片的通道。 通过将硅晶片和限制板狭窄地图案化并蚀刻硅晶片和限制板,然后广泛地图案化硅晶片和限制板,并且蚀刻硅晶片和限制板,通道由宽的上部和窄的下部形成 ,除了硅晶片的下端。 在节流板的图案之后通过蚀刻形成限流板上的限流器。 一个或多个储存器在限制器之后通过在硅晶片的图案之后蚀刻一定厚度而继续到限流器。
    • 63. 发明授权
    • Actuator for ink jet printer head using shape memory alloy
    • 喷墨打印头使用形状记忆合金的致动器
    • US06481821B1
    • 2002-11-19
    • US09442514
    • 1999-11-18
    • Sang Kyeong YunSung June ParkHae Yong Choi
    • Sang Kyeong YunSung June ParkHae Yong Choi
    • B41J2045
    • B41J2/14B41J2002/14346
    • The present invention relates to an actuator for an ink jet printer head using a shape memory alloy which includes a lower space part; a silicon substrate where said lower space part is formed; an insulating film formed on said silicon substrate surface and made of a silicon oxide film which acts to push the shape memory alloy film to nozzle side direction and a silicon nitride film which acts to pull the shape memory alloy film in a direction opposite to nozzle side; and a shape memory alloy layer formed upon said insulation film so as to cover said lower space part. The invention can make effect to prevent print state deterioration by repetitive use as it can minimize actuator fatigue phenomenon by repetitive use by way of initial transformation direction and magniture control according to insulation film formation of adequate composition and thickness.
    • 本发明涉及一种使用形状记忆合金的喷墨打印头的致动器,该形状记忆合金包括下部空间部分; 形成所述下部空间部分的硅基板; 在所述硅衬底表面上形成的绝缘膜,其由用于将形状记忆合金膜推向喷嘴侧方向的氧化硅膜和用于将形状记忆合金膜沿与喷嘴侧相反的方向拉动的氮化硅膜 ; 以及形成在所述绝缘膜上以覆盖所述下部空间部分的形状记忆合金层。 本发明可以通过重复使用来实现防止打印状态恶化,因为它可以通过根据初始转换方向和根据具有足够组成和厚度的绝缘膜形成的幅度控制重复使用来最小化致动器疲劳现象。
    • 64. 发明授权
    • Method for fabricating piezoelectric/electrostrictive thick film using seeding layer
    • 使用接种层制造压电/电致伸缩厚膜的方法
    • US06432238B1
    • 2002-08-13
    • US09330557
    • 1999-06-11
    • Sang Kyeong YunDong-Hoon Kim
    • Sang Kyeong YunDong-Hoon Kim
    • B32B3126
    • H01L41/314H01L41/318H01L41/319
    • Disclosed is a method for fabricating a piezoelectric/electrostrictive thick film, using a seeding layer. On a substrate is formed the seeding layer which is prepared from a ceramic sol solution or a ceramic paste, both identical or similar in composition to the piezoelectric/electrostrictive film. The ceramic paste is prepared from a mixture of a ceramic oxide powder, which has a particle size of 5 &mgr;m or less and is prepared from Pb and Ti-based piezoelectric/electrostrictive elements by a non-explosive oxidation-reduction combustion reaction at 100-500° C., and a ceramic sol solution in water or an organic solvent, identical or similar in composition to the ceramic oxide powder. Then, the seeding layer is subjected to an after-treatment. A piezoelectric/electrostrictive film is directly formed on the seeding layer. Alternatively, a piezoelectric/electrostrictive film, separately formed and sintered, is attached on the seeding layer.
    • 公开了使用接种层制造压电/电致伸缩厚膜的方法。 在基板上形成由陶瓷溶胶溶液或陶瓷膏制成的接合层,其组成与压电/电致伸缩膜相同或相似。 陶瓷浆料由粒径为5μm以下的陶瓷氧化物粉末的混合物制成,通过在100℃的非爆炸性氧化还原燃烧反应中由Pb和Ti系压电/电致伸缩元素制备, 500℃,和在水或有机溶剂中的陶瓷溶胶溶液,其组成与陶瓷氧化物粉末相同或相似。 然后,对接种层进行后处理。 在接种层上直接形成压电/电致伸缩膜。 或者,分别形成和烧结的压电/电致伸缩膜附着在接种层上。
    • 66. 发明授权
    • Method for fabricating piezoelectric/electrostrictive ceramic micro actuator using photolithography
    • 使用光刻制造压电/电致伸缩陶瓷微型致动器的方法
    • US06265139B1
    • 2001-07-24
    • US09334127
    • 1999-06-15
    • Sang Kyeong YunSung-June ParkYeon Kyoung Jung
    • Sang Kyeong YunSung-June ParkYeon Kyoung Jung
    • B81C100
    • H01L41/331H01L41/0477H01L41/0973H01L41/1875H01L41/314
    • Disclosed is a method for fabricating a piezoelectric/electrostrictive thick film, using photolithography. On a vibrating plate is formed a bottom electrode. Over the bottom electrode, a photoresist is coated, exposed to light and developed to form molds in fine patterns. Separately, a ceramic paste is prepared by mixing a ceramic oxide powder and a ceramic sol solution. The ceramic oxide powder has a particle size of 5 &mgr;m or less and is prepared from Pb and Ti-based ceramic oxide powder by a non-explosive oxidation-reduction combustion reaction at 100-500° C. while the ceramic sol solution, identical or similar in composition to the ceramic oxide powder, uses water or an organic solvent as an base. Next, the ceramic paste is filled in the molds to form a piezoelectric/electrostrictive film, followed by conducting a thermal treatment at 100 to 300° C. to sinter the film. Finally, a top electrode is formed on the film. Alternatively, the bottom electrode may be not formed if the vibrating plate is of electroconductivity. In the micro actuator, a high aspect ratio of fine patterns and a significant improvement in the bonding properties between the film and the infrastructure are achieved. Also, the film is protected from external damage, such as scratching, because the molds surround the film.
    • 公开了使用光刻法制造压电/电致伸缩厚膜的方法。 在振动板上形成底部电极。 在底部电极上,涂覆光致抗蚀剂,暴露于光并显影以形成精细图案的模具。 另外,通过混合陶瓷氧化物粉末和陶瓷溶胶溶液来制备陶瓷浆料。 陶瓷氧化物粉末的粒径为5μm以下,通过在100-500℃下的非爆炸性氧化还原燃烧反应由Pb和Ti系陶瓷氧化物粉末制成,同时陶瓷溶胶溶液相同或 与陶瓷氧化物粉末的组成相似,使用水或有机溶剂作为碱。 接下来,将陶瓷膏填充到模具中以形成压电/电致伸缩膜,然后在100至300℃下进行热处理以烧结该膜。 最后,在膜上形成顶部电极。 或者,如果振动板具有导电性,则可能不形成底部电极。 在微致动器中,实现了精细图案的高纵横比和薄膜与基础设施之间的粘结特性的显着改善。 此外,由于模具围绕胶片,因此该胶片可以防止外部损坏,例如划伤。