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61. 发明授权

US07446347B2 Optoelectronic component and method for the production thereof, module and device comprising a module of this type 有权
标题翻译：光电元件及其制造方法，包括这种模块的模块和装置
公开(公告)号：US07446347B2
公开(公告)日：2008-11-04
申请号：US10362614
申请日：2001-08-22
申请人： Georg Bogner , Herbert Brunner , Wolfgang Lex , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Wolfgang Lex , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/13 , H01L25/167 , H01L2224/48091 , H01L2924/01055 , H01L2924/01068 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component, having a semiconductor chip (1) which is mounted on a flexible chip support (6), in which conductor tracks (3, 5) for electrically connecting the semiconductor chip (1) are embodied on a first main face, and on which a housing frame (7) is disposed that is filled with a radiation-permeable medium, in particular a filler compound. A display device, an illumination or backlighting device, and a method for producing components of the invention are also disclosed.
摘要翻译：本发明涉及一种光电子元件，其具有安装在柔性芯片支撑件（6）上的半导体芯片（1），其中用于电连接半导体芯片（1）的导体轨道（3,5）体现在第一主面，并且在其上设置有填充有辐射透过介质，特别是填充剂化合物的壳体框架（7）。本发明还公开了一种显示装置，照明或背光装置及其制造方法。

62. 发明申请

US20080265266A1 Housing for an Optoelectronic Component, Optoelectronic Component and Method for the Production of an Optoelectronic Component 有权
标题翻译：光电元件的壳体，光电元件的制造和光电子元件的制造方法
公开(公告)号：US20080265266A1
公开(公告)日：2008-10-30
申请号：US11575705
申请日：2005-09-20
申请人： Georg Bogner , Herbert Brunner , Michael Hiegler , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Michael Hiegler , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.
摘要翻译：公开了一种用于光电子部件的壳体，其包括具有芯片安装表面的载体。与载体分开制造的光学元件被施加到载体上。芯片安装表面和光学元件限定了分离平面，载体和光学元件之间的分离平面布置在芯片安装表面的平面内。还公开了具有这种类型的壳体的光电子部件和这种类型的光电子部件的制造方法。

63. 发明授权

US07435997B2 Component comprising a large number of light-emitting-diode chips 有权
标题翻译：包含大量发光二极管芯片的部件
公开(公告)号：US07435997B2
公开(公告)日：2008-10-14
申请号：US10362554
申请日：2001-08-22
申请人： Karlheinz Arndt , Georg Bogner , Herbert Brunner , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Herbert Brunner , Gunter Waitl
IPC分类号： H01L21/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the efficiency of the device (1) substantially.
摘要翻译：在反射器（3）中具有多个发光二极管芯片（5）的装置（1）形成为使得发光二极管芯片（5）之间的直接视线被隔板（11）中断）。这实质上提高了装置（1）的效率。

64. 发明授权

US07223620B2 Process for the production of light-emitting diode light sources with a luminescence conversion element 有权
标题翻译：具有发光转换元件的发光二极管光源的制造方法
公开(公告)号：US07223620B2
公开(公告)日：2007-05-29
申请号：US10735507
申请日：2003-12-11
申请人： Harald Jäger , Herbert Brunner
发明人： Harald Jäger , Herbert Brunner
IPC分类号： H01L21/027
CPC分类号： B29C45/14639 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014
摘要： A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.
摘要翻译：同时产生同一种类的多个发光二极管光源。每个光源包括发光二极管芯片和发光转换元件，其转换由发光二极管芯片发射的电磁辐射的至少一部分的波长。在第一种方法中，提供了一种施加到载体衬底的发光二极管层序列的层复合物。晶片设置有沟槽，然后插入模具的空腔中。包含发光转换材料的模塑料被驱入，使得沟槽至少部分地被模塑料填充。然后去除模具，并且发光二极管光源与层复合物分离。在第二过程中，提供以规则排列施加到公共载体的多个发光二极管芯片代替层复合物。

65. 发明申请

US20070034889A1 Diode housing 有权
标题翻译：二极管外壳
公开(公告)号：US20070034889A1
公开(公告)日：2007-02-15
申请号：US11584956
申请日：2006-10-23
申请人： Gunther Waitl , Herbert Brunner
发明人： Gunther Waitl , Herbert Brunner
IPC分类号： H01L33/00 , H01L31/0203 , H01L23/02
CPC分类号： H01L33/486 , H01L24/45 , H01L31/0203 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01019 , H01L2924/01058 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.
摘要翻译：设置容纳半导体芯片的壳体。外壳和芯片可用于发送和/或接收辐射。外壳的热门应用可能在发光二极管中。壳体包括被冲压成两个电隔离部分的导体条。壳体还包括从壳体的顶部向内延伸的腔体。导体部分包括暴露在空腔底部的相应区域。半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露的导体实现的内部辐射反射。

66. 发明授权

US07109590B2 Semiconductor component comprising a surface metallization 有权
标题翻译：半导体部件包括表面金属化
公开(公告)号：US07109590B2
公开(公告)日：2006-09-19
申请号：US10296405
申请日：2001-05-10
申请人： Herbert Brunner , Thomas Hofer , Harald Jager
发明人： Herbert Brunner , Thomas Hofer , Harald Jager
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/49805 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48464 , H01L2224/73265 , H01L2224/854 , H01L2924/00014 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H05K1/0271 , H05K3/3442 , H05K2201/09181 , H05K2201/09381 , H05K2201/09472 , H05K2201/10727 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body (3) and a package base body (2) on whose surface conductor path structures (7) are formed by means of surface metallization. A subregion of the conductor path structure (7) constitutes the solder connections of the semiconductor component. The solder connections (1) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.
摘要翻译：本发明涉及包括表面金属化并且具有至少一个半导体本体（3）和封装基体（2）的半导体部件，其表面上通过表面金属化形成导体路径结构（7）。导体路径结构（7）的一个子区域构成半导体元件的焊料连接。焊接连接（1）被组合以形成行，各行焊接连接以彼此非常小的预定间隔布置。

67. 发明授权

US07102212B2 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 有权
公开(公告)号：US07102212B2
公开(公告)日：2006-09-05
申请号：US11215763
申请日：2005-08-30
申请人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
发明人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
IPC分类号： H01L23/495 , H01L31/203
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K3/3426 , H05K2201/10454 , H05K2201/10651 , H05K2201/10818 , Y02P70/613 , H01L2924/00014
摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

68. 发明申请

US20060138442A1 Diode housing 有权
公开(公告)号：US20060138442A1
公开(公告)日：2006-06-29
申请号：US11345756
申请日：2006-02-02
申请人： Gunther Waitl , Herbert Brunner
发明人： Gunther Waitl , Herbert Brunner
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/45 , H01L31/0203 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01019 , H01L2924/01058 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

69. 发明申请

US20050196886A1 Process for the production of light-emitting diode light sources with a luminescence conversion element 有权
标题翻译：具有发光转换元件的发光二极管光源的制造方法
公开(公告)号：US20050196886A1
公开(公告)日：2005-09-08
申请号：US10735507
申请日：2003-12-11
申请人： Harald Jager , Herbert Brunner
发明人： Harald Jager , Herbert Brunner
IPC分类号： B29C45/14 , H01L33/52 , H01L21/00
CPC分类号： B29C45/14639 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014
摘要： A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.
摘要翻译：同时产生同一种类的多个发光二极管光源。每个光源包括发光二极管芯片和发光转换元件，其转换由发光二极管芯片发射的电磁辐射的至少一部分的波长。在第一种方法中，提供了一种施加到载体衬底的发光二极管层序列的层复合物。晶片设置有沟槽，然后插入模具的空腔中。包含发光转换材料的模塑料被驱入，使得沟槽至少部分地被模塑料填充。然后去除模具，并且发光二极管光源与层复合物分离。在第二过程中，提供以规则排列施加到公共载体的多个发光二极管芯片代替层复合物。

70. 发明授权

US06927469B2 Surface mountable light emitting or receiving device 有权
标题翻译：表面贴装发光或接收装置
公开(公告)号：US06927469B2
公开(公告)日：2005-08-09
申请号：US10173055
申请日：2002-06-17
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Günter Waitl
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/48 , H01L33/60 , H01L33/64 , H01L33/00 , H01L23/29 , H01L27/14 , H01L23/795 , H01L31/08
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component, in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

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