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61. 发明申请

US20060186550A1 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060186550A1
公开(公告)日：2006-08-24
申请号：US11272063
申请日：2005-11-14
申请人： Osamu Ikeda , Masahide Okamoto , Yukihiro Satou
发明人： Osamu Ikeda , Masahide Okamoto , Yukihiro Satou
IPC分类号： H01L21/44 , H01L23/48
CPC分类号： H05K3/3463 , B23K35/0238 , B23K35/262 , B23K35/264 , B23K2101/40 , H01L23/3128 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/32507 , H01L2224/371 , H01L2224/3754 , H01L2224/40225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73265 , H01L2224/83101 , H01L2224/83194 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/83825 , H01L2224/84801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10329 , H01L2924/15311 , H01L2924/15747 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , H01L2924/19105 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2924/01049 , H01L2924/3512 , H01L2224/85399 , H01L2224/05599
摘要： In a semiconductor module connecting a semiconductor element and a passive element to a printed board, each of connection portions between the semiconductor element and the printed board and between the passive element and the printed board includes a metal with a melting point of 260° C. or higher and an intermetallic compound with a melting point of 260° C. or higher. Specifically, by connecting them using Pb-free solder with a melting point of 260° C. or lower, the printed board capable of lowering in cost, lightening, and reducing back height can be applied to a module board.
摘要翻译：在将半导体元件和无源元件连接到印刷电路板的半导体模块中，半导体元件和印刷电路板之间以及无源元件和印刷电路板之间的每个连接部分包括熔点为260℃的金属。以上，熔点260℃以上的金属间化合物。具体来说，通过使用熔点为260℃以下的无铅焊料进行连接，能够将成本降低，降低后退高度的印刷电路板应用于模块基板。

62. 发明授权

US07095102B2 Pad rearrangement substrate 失效
标题翻译：垫重排衬底
公开(公告)号：US07095102B2
公开(公告)日：2006-08-22
申请号：US10290028
申请日：2002-11-06
申请人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
发明人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
IPC分类号： H01L23/02
CPC分类号： H01L23/49855 , G06K19/077 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A pad rearrangement substrate includes an internal terminal provided on a mounting plane of a dielectric substrate, an external terminal provided on the external terminal plane of the dielectric substrate, an internal wiring pattern connecting the external terminal to the internal terminal, an antenna pattern provided at a corner portion of the external terminal plane of the dielectric substrate, an external terminal provided on the external terminal plane of the dielectric substrate, and a dielectric layer. The antenna pattern is connected to the dummy external terminal. The dielectric layer coats the external terminal plane of the dielectric substrate except the external terminal and the dummy external terminal.
摘要翻译：衬垫重排衬底包括设置在电介质衬底的安装平面上的内部端子，设置在电介质衬底的外部端子平面上的外部端子，将外部端子连接到内部端子的内部布线图案，设置在电介质基板的外部端子平面的角部，设置在电介质基板的外部端子平面上的外部端子和电介质层。天线图案连接到虚拟外部端子。电介质层涂敷除了外部端子和虚设外部端子之外的电介质基板的外部端子平面。

63. 发明授权

US06638045B2 Die for manufacturing resin pellets 失效
标题翻译：用于制造树脂颗粒的模具
公开(公告)号：US06638045B2
公开(公告)日：2003-10-28
申请号：US09740918
申请日：2000-12-21
申请人： Yasuo Yoshii , Shinichi Fukumizu , Osamu Ikeda , Nobuhiro Yamasaki , Yoshiaki Nakata
发明人： Yasuo Yoshii , Shinichi Fukumizu , Osamu Ikeda , Nobuhiro Yamasaki , Yoshiaki Nakata
IPC分类号： B29C4730
CPC分类号： B29C47/86 , B29B9/065 , B29C47/0011 , B29C47/30 , B29C47/862
摘要： A die for manufacturing resin pellets capable of processing a die plate easily, and achieving simplification of a construction of heat channels and enhancement of heating efficiency. A die 1 for manufacturing resin pellets provided with a number of nozzle orifices 7 in the outer surface of the die, there are provided a plurality of rows of heat channels 8 which extend in a direction crossing the resin channels 5 in the vicinity of the outer surface of the die and are arranged along the resin channels 5. At least one of an introducing course and a discharging course for a heat medium in the plurality of heat channels 8.
摘要翻译：一种用于制造能够容易地加工模板的树脂颗粒的模具，并且实现了热通道的构造的简化和提高了加热效率。用于制造在模具的外表面上设置有多个喷嘴孔7的树脂颗粒的模具1设置有多个排列的热通道8，其在与外部的附近的树脂通道5相交的方向上延伸并且沿树脂通道5布置。多个热通道8中的热介质的导入路线和放电路径中的至少一个。

64. 发明授权

US06396086B1 Semiconductor device and semiconductor integrated circuit having a conductive film on element region 失效
标题翻译：在元件区域上具有导电膜的半导体器件和半导体集成电路
公开(公告)号：US06396086B1
公开(公告)日：2002-05-28
申请号：US09404090
申请日：1999-09-23
申请人： Yuji Takeuchi , Riichiro Shirota , Seiichi Aritome , Masashi Umemura , Yuuichiro Murahama , Hitoshi Araki , Masamitsu Yahata , Osamu Ikeda
发明人： Yuji Takeuchi , Riichiro Shirota , Seiichi Aritome , Masashi Umemura , Yuuichiro Murahama , Hitoshi Araki , Masamitsu Yahata , Osamu Ikeda
IPC分类号： H01L2710
CPC分类号： H01L27/088 , H01L21/76838 , H01L27/0629 , H01L27/0805 , H01L29/94
摘要： In a semiconductor device of MOS structure, the element region has a shape such as a square shape which has a plurality of sides and a plurality of corners. On the element region, a conductive film which constitutes one electrode of the MOS structure is formed. The other electrode of the MOS structure is a silicon substrate. The conductive film is provided so as to cover at least sides adjacent to each other and so as not to cover the corners including the corners which are the contact points (intersecting points) of the adjacent sides. Further, in case the element region is in a ring shape, the conductive film is provided so as to cover none of the corners including the inside corners of the ring-shaped element region. By the above-mentioned structure, the occurrence of breakdown in the insulation film in the MOS structure can be prevented, and the reliability thereof can be enhanced.
摘要翻译：在MOS结构的半导体器件中，元件区域具有多个侧面和多个角的方形的形状。在元件区域上形成构成MOS结构的一个电极的导电膜。 MOS结构的另一个电极是硅衬底。导电膜被设置成覆盖彼此相邻的至少边，并且不覆盖包括作为相邻侧的接触点（交叉点）的角部的角部。此外，在元件区域为环形的情况下，导电膜被设置成不覆盖包括环形元件区域的内角的任何角。通过上述结构，可以防止在MOS结构中的绝缘膜中发生击穿，从而可以提高其可靠性。

65. 发明授权

US06299506B1 Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using 失效
公开(公告)号：US06299506B1
公开(公告)日：2001-10-09
申请号：US09044146
申请日：1998-03-19
申请人： Matsuomi Nishimura , Osamu Ikeda , Satoshi Ohta , Shinzo Uchiyama
发明人： Matsuomi Nishimura , Osamu Ikeda , Satoshi Ohta , Shinzo Uchiyama
IPC分类号： B24B4902
摘要： A polishing apparatus includes a holder for holding a polished body with a polished surface thereof facing upwardly, and a polishing head for holding a polishing pad having a polishing surface having an area smaller than an area of the polished surface while contacting the polishing pad with the polished surface and for rotating the polishing pad around its rotation axis. The polishing head is provided with a driver for revolving the polishing pad around a revolution axis, and the revolution axis and the rotation axis are positioned so that a distance between the revolution axis and the rotation axis becomes smaller than a radius of the polishing pad.

66. 发明授权

US6146277A Command input method and recording medium 失效
标题翻译：命令输入法和记录介质
公开(公告)号：US6146277A
公开(公告)日：2000-11-14
申请号：US51253
申请日：1998-04-07
申请人： Osamu Ikeda
发明人： Osamu Ikeda
IPC分类号： A63F13/10 , G06F3/033 , G06F3/048 , A63F13/00 , A63F9/24 , G06F17/00 , G06F19/00
CPC分类号： A63F13/533 , A63F13/10 , G06F3/0481 , A63F13/822 , A63F2300/308 , A63F2300/807
摘要： This invention relates to a game system. The game system has a window image including an action command frame and a non-action command frame. When it is a player's turn to designate an action parameter, the window image including the action command frame and the non-action command frame is displayed on a display plane of display means of the game player to enable the game player to select a command in the action command frame or the non-action command frame and accept the selected command. Concurrently, a window image solely including the non-action command frame is displayed on a display plane of display means of the game player who is not assigned with the turn to enable the non-assigned game player to designate the command in the non-action command frame on the window image and accept the designated command while allowing the game player to see an overall image in a game space through the window image. Accordingly, while the opponent game player is in turn of using the action command, the non-assigned game player utilizes the non-action command frame, thereby allowing the game players to participate in a game more positively to establish a more pleasant game environment.
摘要翻译： PCT No.PCT / JP97 / 02877。 371日期：1998年4月7日 102（e）日期1998年4月7日PCT 1997年8月20日PCT公布。出版物WO98 / 07486 日期：1998年2月26日本发明涉及游戏系统。游戏系统具有包括动作命令帧和非动作命令帧的窗口图像。当玩家轮到指定动作参数时，包括动作命令帧和非动作命令帧的窗口图像被显示在游戏者的显示装置的显示面上，以使玩家能够选择命令动作命令帧或非动作命令帧，并接受所选命令。同时，仅在没有分配回合的游戏者的显示装置的显示面上显示完全包括非动作指令帧的窗口图像，以使未被分配的游戏者能够在不动作中指定命令命令帧，并接受指定的命令，同时允许玩家通过窗口图像在游戏空间中看到整体图像。因此，当对手游戏者依次使用动作命令时，未分配的游戏者利用非动作命令帧，从而允许游戏者更积极地参与游戏，以建立更愉悦的游戏环境。

67. 发明授权

US06025243A Method for preparing a semiconductor device 失效
标题翻译：半导体器件的制备方法
公开(公告)号：US06025243A
公开(公告)日：2000-02-15
申请号：US257294
申请日：1994-06-09
申请人： Kazuaki Ohmi , Osamu Ikeda , Shigeyuki Matsumoto
发明人： Kazuaki Ohmi , Osamu Ikeda , Shigeyuki Matsumoto
IPC分类号： H01L21/285 , H01L21/768 , H01L23/54
CPC分类号： H01L21/76843 , H01L21/28562 , H01L21/28568 , H01L21/76879 , H01L2924/0002 , Y10S148/107
摘要： A deposited film formation method comprises the steps of:(a) feeding a gas of an organometallic compound containing molybdenum atom and hydrogen gas onto a substrate having an electron donative surface; and(b) maintaining the temperature of the electron donative surface within the range of the decomposition temperature of the organometallic compound or lower and 800.degree. C. or lower to form a molybdenum film on the electron donative surface.
摘要翻译：沉积膜形成方法包括以下步骤：（a）将含有钼原子和氢气的有机金属化合物的气体供给到具有给电子表面的基板上; 和（b）将供电表面的温度保持在有机金属化合物的分解温度范围内或更低至800℃或更低，以在电子给体表面上形成钼膜。

68. 发明授权

US5926289A Image digitizing system 失效
标题翻译：图像数字化系统
公开(公告)号：US5926289A
公开(公告)日：1999-07-20
申请号：US729073
申请日：1996-10-10
申请人： Marco Brandestini , Richard A. Ferraro , Masashi Tazawa , Eisaku Maeda , Nobuhiro Fujinawa , Osamu Ikeda , Toshiya Aikawa
发明人： Marco Brandestini , Richard A. Ferraro , Masashi Tazawa , Eisaku Maeda , Nobuhiro Fujinawa , Osamu Ikeda , Toshiya Aikawa
IPC分类号： H04N1/04
CPC分类号： H04N1/0057 , H04N1/00588 , H04N1/00602 , H04N1/00604 , H04N2201/0406 , H04N2201/0408 , H04N2201/0422
摘要： A transporting system for an image digitizer can handle both positive and negative transparent film material. The transport features accurate linear motion with high resolution in a single compact unit. For the processing of individually framed slides, an automatic eject mechanism is provided. Both manual and motor driven focus adjustments are provided. Individual images can be oriented by an angular adjustment option. A special carrier allows the system to process negatives in uncut strips. The transport can manage larger number of images using either a slide tray or roll feed attachment.
摘要翻译：用于图像数字转换器的传送系统可以处理正和负透明膜材料。运输在单个紧凑型单元中具有高分辨率的精确线性运动。对于单独框架的滑块的处理，提供自动弹出机构。提供手动和电机驱动的焦点调整。单个图像可以通过角度调整选项定向。专用载体允许系统处理未切割条中的负片。运输工具可以使用滑动托盘或滚动进给附件来管理更大数量的图像。

69. 发明授权

US5918115A Method of manufacturing a surrounding gate type MOSFET 失效
公开(公告)号：US5918115A
公开(公告)日：1999-06-29
申请号：US901936
申请日：1997-07-29
申请人： Shin Kikuchi , Mamoru Miyawaki , Genzo Monma , Hayao Ohzu , Shunsuke Inoue , Yoshio Nakamura , Takeshi Ichikawa , Osamu Ikeda , Tetsunobu Kohchi
发明人： Shin Kikuchi , Mamoru Miyawaki , Genzo Monma , Hayao Ohzu , Shunsuke Inoue , Yoshio Nakamura , Takeshi Ichikawa , Osamu Ikeda , Tetsunobu Kohchi
IPC分类号： H01L27/115 , H01L21/332
CPC分类号： H01L27/115 , H01L2924/0002
摘要： A semiconductor device including: an insulated gate type transistor having a columnar semiconductor region formed on the main side of a semiconductor substrate, a gate electrode formed on the side surface of the columnar semiconductor region while interposing a gate insulating film and main electrode regions respectively formed on and formed below the columnar semiconductor region; and a memory element which is formed on the upper main electrode region and which can be broken electrically.

70. 发明授权

US5830297A Method and apparatus for application of adhesive 失效
标题翻译：用于粘合剂的方法和设备
公开(公告)号：US5830297A
公开(公告)日：1998-11-03
申请号：US685604
申请日：1996-07-24
申请人： Hitoshi Nakahira , Hiroyuki Miyake , Osamu Ikeda , Takashi Sasaki , Yuzuru Inaba , Toshiyuki Kinou
发明人： Hitoshi Nakahira , Hiroyuki Miyake , Osamu Ikeda , Takashi Sasaki , Yuzuru Inaba , Toshiyuki Kinou
IPC分类号： B05C5/02 , H05K3/00 , H05K3/30 , H05K13/04 , B32B31/00
CPC分类号： H05K13/0469 , B05C5/0208 , H05K3/0097 , H05K3/305 , Y10T156/1798
摘要： An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.
摘要翻译：一种用于通过施加喷嘴将粘合剂施加到施加物体上的粘合剂的施加方法。每个应用对象通过每个桌子的移动而定位在与输送方向相交的方向上，并且对应于桌子的各个应用头单独地沿传送方向移动和定位，并且将粘合剂同时施加到应用的必要位置使得电子电路板的生产效率在各个方面得到增强，而不增加设备的尺寸。

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