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    • 64. 发明申请
    • Method for forming metal wire in semiconductor device
    • 在半导体器件中形成金属线的方法
    • US20050106853A1
    • 2005-05-19
    • US10878316
    • 2004-06-29
    • Hyung Kim
    • Hyung Kim
    • H01L21/3205H01L21/28H01L21/304H01L21/44H01L21/461H01L21/4763H01L21/768
    • H01L21/7684
    • The present invention relates to a method for forming a metal wire in a semiconductor device. The method comprises the steps of forming a lower metal wire on a semiconductor substrate, depositing an insulating film on the lower metal wire, forming a damascene etch pattern in the insulating film, depositing a conductive material on the insulating film so that the conductive material fills the damascene etch pattern, thus forming a conductive layer including step portions, depositing, on the conductive layer, a material having a high etch selective ratio against the conductive material, thus forming an anti-etch film, stripping a part of the anti-etch film by means of a CMP process until the conductive layer is exposed, striping a portion of the conductive layer by means of an etch process using the anti-etch film as an etch mask, and stripping the remaining anti-etch film and conductive layer by means of a CMP process, thus forming a conductive wire with which the damascene etch pattern is filled. Therefore, a large amount of slurry and the usage of a pad depending on a long-time polishing in a CMP process can be reduced. It is thus possible to save a process cost price in development and production of a semiconductor device.
    • 本发明涉及在半导体器件中形成金属线的方法。 该方法包括以下步骤:在半导体衬底上形成下金属线,在下金属线上沉积绝缘膜,在绝缘膜中形成镶嵌蚀刻图案,在导电材料上填充导电材料 镶嵌蚀刻图案,从而形成包括阶梯部分的导电层,在导电层上沉积与导电材料相比具有高蚀刻选择比的材料,从而形成抗蚀刻膜,剥离部分抗蚀刻 通过CMP工艺直到导电层暴露,通过使用该抗蚀刻膜作为蚀刻掩模的蚀刻工艺对导电层的一部分进行条纹化,并且通过以下步骤剥离剩余的抗蚀刻膜和导电层: CMP工艺的手段,从而形成填充镶嵌蚀刻图案的导线。 因此,可以减少在CMP工艺中大量的浆料和根据长时间抛光的垫的使用。 因此,可以在开发和制造半导体器件中节省工艺成本价格。
    • 65. 发明申请
    • Hose clamping assembly
    • 软管夹紧组件
    • US20050104370A1
    • 2005-05-19
    • US10788366
    • 2004-03-01
    • Hyung KimIn JeonSung HurChun CholByoung Kang
    • Hyung KimIn JeonSung HurChun CholByoung Kang
    • F16L41/00F16L47/32F16L39/00
    • F16L47/32
    • A hose clamping assembly comprises a branched pipe having a plurality of projected stoppers thereon, each of the stoppers formed around an outer surface of each branch of the branched pipe and spaced apart a certain distance from each other, a hose connected to each branch of the branched pipe by sliding onto each of the branches, the hose contacting a nearest stopper from the end portion of the branch among the plurality of stoppers, a clamp formed on an outer surface of the hose and between the stoppers by a molding apparatus, a portion of the clamp on the outer surface of the hose connected to a portion of the clamp between the stoppers and an arm connecting the clamp to an adjacent clamp having a different axial direction, the arm formed by the molding apparatus.
    • 软管夹紧组件包括分支管,其上具有多个突出的塞子,每个止动件形成在分支管的每个分支的外表面周围并彼此隔开一定距离,连接到 分支管通过滑动到每个分支上,软管接触来自多个止动件中的分支端部的最近的止动件,夹具形成在软管的外表面上,并通过模制装置形成在止动件之间,部分 所述夹具的外表面上的连接到所述夹持件的所述止动件的一部分之间的所述夹具,以及将所述夹具连接到具有不同轴向方向的相邻夹具的臂,所述臂由所述模制设备形成。