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    • 63. 发明授权
    • Method for using a multiple polarity reversible charge pump circuit
    • 使用多极性可逆电荷泵电路的方法
    • US07495500B2
    • 2009-02-24
    • US11618838
    • 2006-12-31
    • Ali K. Al-ShammaRoy E. Scheuerlein
    • Ali K. Al-ShammaRoy E. Scheuerlein
    • G05F1/10
    • H02M3/073H02M2003/071H02M2003/077
    • A multiple polarity reversible charge pump circuit is disclosed which, in certain embodiments, may be configured to generate a positive voltage at times and may be reversed to generate a negative voltage at other times. Such a charge pump circuit is advantageous if both the positive and negative voltage are not simultaneously required. In certain other embodiments, a charge pump circuit generates a high output current for only a positive boosted voltage in one mode of operation, but lower current positive and negative boosted voltage outputs in another mode of operation. Use with certain erasable memory array technologies is disclosed, particularly certain resistive passive element memory cells, and more particularly in a three-dimensional memory array.
    • 公开了一种多极性可逆电荷泵电路,其在某些实施例中可被配置为有时产生正电压并且可以反向以在其它时间产生负电压。 如果不同时需要正电压和负电压,则这种电荷泵电路是有利的。 在某些其他实施例中,电荷泵电路仅在一种工作模式下产生仅仅正升压电压的高输出电流,而在另一种工作模式下产生较低电流正和负升压电压输出。 公开了某些可擦除存储器阵列技术的使用,特别是某些电阻性无源元件存储单元,更具体地在三维存储器阵列中使用。
    • 64. 发明申请
    • OPTIMIZATION OF CRITICAL DIMENSIONS AND PITCH OF PATTERNED FEATURES IN AND ABOVE A SUBSTRATE
    • 关键尺寸的优化和基板上及以上图案特征的优化
    • US20080310231A1
    • 2008-12-18
    • US12136766
    • 2008-06-10
    • James M. CleevesRoy E. Scheuerlein
    • James M. CleevesRoy E. Scheuerlein
    • G11C11/34H01L27/092
    • H01L27/105H01L23/528H01L2924/0002H01L2924/00
    • A die is formed with different and optimized critical dimensions in different device levels and areas of those device levels using photolithography and etch techniques. One aspect of the invention provides for a memory array formed above a substrate, with driver circuitry formed in the substrate. A level of the memory array consists of, for example, parallel rails and a fan-out region. It is desirable to maximize density of the rails and minimize cost of lithography for the entire memory array. This can be achieved by forming the rails at a tighter pitch than the CMOS circuitry beneath it, allowing cheaper lithography tools to be used when forming the CMOS, and similarly by optimizing lithography and etch techniques for a device level to produce a tight pitch in the rails, and a more relaxed pitch in the less-critical fan-out region.
    • 在使用光刻和蚀刻技术的不同器件级别和那些器件级别的区域中,使用不同且优化的临界尺寸形成管芯。 本发明的一个方面提供了形成在衬底上的存储器阵列,其中驱动电路形成在衬底中。 存储器阵列的一个级别包括例如平行轨道和扇出区域。 希望使轨道的密度最大化并最小化整个存储器阵列的光刻成本。 这可以通过以比它下面的CMOS电路更紧的间距形成轨道来实现,从而允许在形成CMOS时使用更便宜的光刻工具,并且类似地通过优化用于器件级别的光刻和蚀刻技术以在 轨道,并且在不太关键的扇出区域更放松。
    • 66. 发明授权
    • Optimization of critical dimensions and pitch of patterned features in and above a substrate
    • 优化衬底中和图案上的图案特征的临界尺寸和间距
    • US07423304B2
    • 2008-09-09
    • US10728437
    • 2003-12-05
    • James M. CleevesRoy E. Scheuerlein
    • James M. CleevesRoy E. Scheuerlein
    • H01L29/80H01L31/112
    • H01L27/105H01L23/528H01L2924/0002H01L2924/00
    • A die is formed with different and optimized critical dimensions in different device levels and areas of those device levels using photolithography and etch techniques. One aspect of the invention provides for a memory array formed above a substrate, with driver circuitry formed in the substrate. A level of the memory array consists of, for example, parallel rails and a fan-out region. It is desirable to maximize density of the rails and minimize cost of lithography for the entire memory array. This can be achieved by forming the rails at a tighter pitch than the CMOS circuitry beneath it, allowing cheaper lithography tools to be used when forming the CMOS, and similarly by optimizing lithography and etch techniques for a device level to produce a tight pitch in the rails, and a more relaxed pitch in the less-critical fan-out region.
    • 在使用光刻和蚀刻技术的不同器件级别和那些器件级别的区域中,使用不同且优化的临界尺寸形成管芯。 本发明的一个方面提供了形成在衬底上的存储器阵列,其中驱动电路形成在衬底中。 存储器阵列的一个级别包括例如平行轨道和扇出区域。 希望使轨道的密度最大化并最小化整个存储器阵列的光刻成本。 这可以通过以比它下面的CMOS电路更紧的间距形成轨道来实现,从而允许在形成CMOS时使用更便宜的光刻工具,并且类似地通过优化用于器件级别的光刻和蚀刻技术来产生紧密的间距 轨道,并且在不太关键的扇出区域更放松。
    • 67. 发明授权
    • Apparatus and method for programming an array of nonvolatile memory cells including switchable resistor memory elements
    • 用于编程包括可切换电阻存储元件的非易失性存储单元阵列的装置和方法
    • US07362604B2
    • 2008-04-22
    • US11179077
    • 2005-07-11
    • Roy E. Scheuerlein
    • Roy E. Scheuerlein
    • G11C11/00
    • G11C13/0011G11C11/5614G11C13/0069G11C2013/009G11C2213/71G11C2213/79
    • A non-volatile memory cell includes a switchable resistor memory element in series with a switch device. An array of such cells may be programmed using only positive voltages. A method for programming such cells also supports a direct write of both 0 and 1 data states without requirement of a block erase operation, and is scalable for use with relatively low voltage power supplies. A method for reading such cells reduces read disturb of a selected memory cell by impressing a read bias voltage having a polarity opposite that of a set voltage employed to change the switchable resistor memory element to a low resistance state. Such programming and read methods are well suited for use in a three-dimensional memory array formed on multiple levels above a substrate, particularly those having extremely compact array line drivers on very tight layout pitch.
    • 非易失性存储单元包括与开关装置串联的可切换电阻存储元件。 可以仅使用正电压来编程这样的单元阵列。 用于编程这样的单元的方法还支持0和1数据状态的直接写入,而不需要块擦除操作,并且可扩展以用于相对低电压的电源。 用于读取这种单元的方法通过将具有极性与用于将可切换电阻器存储元件改变为低电阻状态的设定电压的极性相反的读取偏置电压来减小所选存储单元的读取干扰。 这种编程和读取方法非常适用于形成在衬底上的多个层上的三维存储器阵列,特别是在非常紧凑的布局间距上具有非常紧凑的阵列线驱动器的那些。
    • 70. 发明申请
    • SYSTEMS FOR REVERSE BIAS TRIM OPERATIONS IN NON-VOLATILE MEMORY
    • 用于在非易失性存储器中反向偏移操作的系统
    • US20080025078A1
    • 2008-01-31
    • US11461431
    • 2006-07-31
    • Roy E. ScheuerleinTanmay Kumar
    • Roy E. ScheuerleinTanmay Kumar
    • G11C11/00
    • G11C8/08G11C5/02G11C11/56G11C13/0023G11C13/0028G11C13/0038G11C13/0069G11C13/0097G11C17/16G11C17/18G11C2213/71G11C2213/72
    • A reverse bias trim operation for the reset state of a non-volatile memory system is disclosed. Non-volatile memory cells including a resistance change element undergo a reverse bias reset operation to change their resistance from a set state at a first level of resistance to a reset state at a second level of resistance. Certain memory cells in a set of cells that was reset may be deeply reset to a level of resistance beyond a target level for the reset state. A second reverse bias is applied to the set of memory cells to move the resistance of each cell that was deeply reset toward the target level of the reset state. A smaller reverse bias than used for the reset operation can shift the resistance of the cells back toward the set level and out of their deeply reset condition. The operation is self-limiting in that cells stop their resistance shifts upon reaching the target level. Cells that were not deeply reset are not affected.
    • 公开了一种用于非易失性存储器系统的复位状态的反偏压调整操作。 包括电阻变化元件的非易失性存储单元经历反向偏置复位操作,以在第二电阻电平处的第一电阻电平将其电阻从设定状态改变为复位状态。 复位的一组单元格中的某些存储单元可能被重新设置为超出复位状态的目标电平的电阻水平。 第二反向偏压被施加到存储器单元组,以将每个单元的电阻移动到复位状态的目标电平。 与用于复位操作相比较小的反向偏压可以将电池的电阻转移回设定电平并脱离它们的深度复位状态。 操作是自限制的,因为细胞在达到目标水平时停止其阻力位移。 未重新设置的单元格不受影响。